scholarly journals Identification of the Thermal Conductance of a Hidden Barrier from Outer Thermal Data

2021 ◽  
Vol 8 (1) ◽  
pp. 16
Author(s):  
Gabriele Inglese ◽  
Roberto Olmi ◽  
Agnese Scalbi
Keyword(s):  
Heat Transfer ◽  
Fourier Transform ◽  
Fast Fourier Transform ◽  
Thin Plate ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Thermal Contact Conductance ◽  
Composite Slab ◽  
Thermal Data ◽  
Investigate Heat Transfer

Hidden defects affecting the interface in a composite slab are evaluated from thermal data collected on the upper side of the specimen. First we restrict the problem to the upper component of the object. Then we investigate heat transfer through, the inaccessible interface by means of Thin Plate Approximation. Finally, a Fast Fourier Transform is used to filter data. In this way, we obtain a reliable reconstruction of simulated flaws in thermal contact conductance corresponding to appreciable defects of the interface.

Recent Developments in Contact Conductance Heat Transfer

1988 ◽  
Vol 110 (4b) ◽  
pp. 1059-1070 ◽  
Author(s):  
L. S. Fletcher
Keyword(s):  
Heat Transfer ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Thermal Contact Conductance ◽  
Contact Conductance ◽  
Thermal Rectification ◽  
Numerical Studies ◽  
Wide Range ◽  
Theoretical Investigations ◽  
Recent Developments

The characteristics of thermal contact conductance are increasingly important in a wide range of technologies. As a consequence, the number of experimental and theoretical investigations of contact conductance has increased. This paper reviews and categorizes recent developments in contact conductance heat transfer. Among the topics included are the theoretical/analytical/numerical studies of contact conductance for conforming surfaces and other surface geometries; the thermal conductance in such technological areas as advanced or modern materials, microelectronics, and biomedicine; and selected topics including thermal rectification, gas conductance, cylindrical contacts, periodic and sliding contacts, and conductance measurements. The paper concludes with recommendations for emerging and continuing areas of investigation.

Thermal and Electrical Conductance of Pressure Tube/Calandria Tube Interface

2020 ◽  
Author(s):  
Chukwudi Azih ◽  
Reilly MacCoy ◽  
Hazem Mazhar ◽  
Chris Fraser
Keyword(s):  
Heat Transfer ◽  
Thermal Contact ◽  
Electrical Conductance ◽  
Thermal Conductance ◽  
Pressure Tube ◽  
Thermal Contact Conductance ◽  
Interface Pressure ◽  
Contact Conductance ◽  
Engineered Systems ◽  
Interface Thermal Conductance

Abstract In some engineered systems, the interface thermal conductance is a key parameter that governs the heat transfer behaviour of components in solid-solid contact. For example, in certain postulated accident scenarios for CANDU reactors, the pressure tube (PT) may deform into contact with the calandria tube (CT) to form a more direct path for heat transfer from the fuel to the moderator. There have been no direct measurements of interface thermal conductance in integrated “Contact boiling” experiments designed to mimic this Loss-of-coolant accident (LOCA) scenario due to the geometrical limits of the test components and the cumbersome nature of the instrumentation required to extract contact conductance data. It has been noted that the modelling of the contact conductance is one of the main sources of uncertainty in predicting the outcome of the contact boiling experiments that mimic LOCA scenarios. The present study demonstrated an analogy between the electrical and thermal contact conductance for PT/CT interfaces. The range of interface pressure and interface temperatures studies are selected to match the expected range of conditions during a CANDU LOCA scenario. The experiment setup consists of two sets of specimen representing PT and CT material. The specimen are instrumented with four K-type thermocouples in sequence to capture the temperature gradient imposed via a three-chamber oven. Within a range of interface pressures from 2 to 7 MPa and a temperature range from 510 to 720°C, the analogy is independent of the interface pressure or the load applied. This demonstrates the measurement of the electrical conductance between the PT and CT in contact boiling as a promising technique for obtaining in-situ information on the thermal contact conductance during integrated experiments.

Heat Conduction Through a Layered Pressure Vessel Wall

1986 ◽  
Vol 108 (4) ◽  
pp. 418-422
Author(s):  
M. Ueda ◽  
M. Kinugawa ◽  
Y. Hara ◽  
K. Yamazato
Keyword(s):  
Heat Conduction ◽  
Pressure Vessel ◽  
Vessel Wall ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Postweld Heat Treatment ◽  
Pressure Vessels ◽  
Scale Model ◽  
Thermal Contact Conductance ◽  
Simplified Method

Heat conduction tests of a layered pressure vessel wall were performed using full-scale model pressure vessel courses. Thermal conductance between layers was estimated from the test results. A simplified method, developed for the thermal analysis of layered-wall pressure vessels during postweld heat treatment and actual operation, includes thermal contact conductance at the layer interfaces which depends upon the contact pressure and gap height. Temperature changes calculated using the simplified method agreed well with the experiments.

scholarly journals Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

2019 ◽  
Author(s):  
Jin Cui ◽  
Liang Pan ◽  
Justin A. Weibel
Keyword(s):  
Heat Sink ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Thermal Interface Material ◽  
Thermal Contact Conductance ◽  
Compression Pressure ◽  
Thermal Interface ◽  
Operation Temperature ◽  
Optical Module ◽  
Dry Contact

Abstract Pluggable optoelectronic transceiver modules are widely used in the fiber-optic communication infrastructure. It is essential to mitigate thermal contact resistance between the high-power optical module and its riding heat sink in order to maintain the required operation temperature. The pluggable nature of the modules requires dry contact thermal interfaces that permit repeated insertion–disconnect cycles under low compression pressures (∼10–100 kPa). Conventional wet thermal interface materials (TIM), such as greases, or those that require high compression pressures, are not suitable for pluggable operation. Here we demonstrate the use of compliant micro-structured TIM to enhance the thermal contact conductance between an optical module and its riding heat sink under a low compression pressure (20 kPa). The metallized and polymer-coated structures are able to accommodate the surface nonflatness and microscale roughness of the mating surface while maintaining a high effective thermal conductance across the thickness. This dry contact TIM is demonstrated to maintain reliable thermal performance after 100 plug-in and plug-out cycles while under compression.

A three-dimensional fractal theory based on thermal contact conductance model of rough surfaces

2017 ◽  
Vol 232 (5) ◽  
pp. 528-539 ◽  
Author(s):  
Yongsheng Zhao ◽  
Cui Fang ◽  
Ligang Cai ◽  
Zhifeng Liu
Keyword(s):  
Rough Surfaces ◽  
Fractal Theory ◽  
Thermal Contact ◽  
Three Dimensional ◽  
Thermal Conductance ◽  
Engineering Application ◽  
Thermal Contact Conductance ◽  
Real Contact Area ◽  
Contact Conductance ◽  
Elastic Plastic

The thermal contact conductance is an important problem in the field of heat transfer. In this research, a three-dimensional fractal theory based on the thermal contact conductance model is presented. The topography of the contact surfaces was fractal featured and determined by fractal parameters. The asperities in the microscale were considered as elastic, elastic-plastic, or plastic deformations. The real contact area of the asperities could be obtained based on the Hertz contact theory. It was assumed that the rough contact surface was composed of numerous discrete and parallel microcontact cylinders. Consequently, the thermal contact conductance of the surface roughness was composed of the thermal constriction conductance of microcontacts and the air medium thermal conductance of microgaps. The thermal contact conductance of rough surfaces could be calculated by the microasperities integration. An experimental set-up with annular interface was designed to verify the presented thermal contact conductance model. Three materials were used for the thermal contact conductance analysis with different fractal dimensions D and fractal roughness parameters G. The numerical results demonstrated that the thermal contact conductance could be affected by the elastic-plastic deformation of the asperities and the gap thermal conductance should not be ignored under the lower contact load. The presented model would provide a theoretical basis for thermal transfer engineering application.

scholarly journals Thermal contact resistance across a linear heterojunction within a hybrid graphene/hexagonal boron nitride sheet

2016 ◽  
Vol 18 (35) ◽  
pp. 24164-24170 ◽  
Author(s):  
Yang Hong ◽  
Jingchao Zhang ◽  
Xiao Cheng Zeng
Keyword(s):  
Heat Transfer ◽  
Thermal Properties ◽  
Boron Nitride ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Hexagonal Boron Nitride ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Vital Role ◽  
Interfacial Thermal Conductance

Interfacial thermal conductance plays a vital role in defining the thermal properties of nanostructured materials in which heat transfer is predominantly phonon mediated.

Combined Parameter and Function Estimation in Heat Transfer With Application to Contact Conductance

1988 ◽  
Vol 110 (4b) ◽  
pp. 1046-1058 ◽  
Author(s):  
J. V. Beck
Keyword(s):  
Heat Transfer ◽  
Parameter Estimation ◽  
Heat Conduction Problem ◽  
Thermal Contact ◽  
Temperature Measurements ◽  
Thermal Contact Conductance ◽  
Transient Temperature ◽  
Function Estimation ◽  
Contact Conductance

This paper discusses parameter estimation, function estimation, and a combination of the two. An example of parameter estimation is the determination of thermal conductivity of solids from transient temperature measurements. An example of function estimation is the inverse heat conduction problem, which uses transient temperature measurements to determine the surface heat flux history. The examples used herein involve the determination of the thermal contact conductance. Two sets of very good data are analyzed. One set of steady-state data was obtained by Antonetti and Eid (1987). The other set was obtained by Moses and Johnson (1986) under transient conditions for periodic contact. Both sets of data are used to illustrate parameter, function, and combined estimation. It is demonstrated that the proposed methods are more powerful then commonly accepted methods. Many other heat transfer problems can be treated using the proposed techniques.

Thermal Contact Conductance of Spherical Rough Metals

1997 ◽  
Vol 119 (4) ◽  
pp. 684-690 ◽  
Author(s):  
M. A. Lambert ◽  
L. S. Fletcher
Keyword(s):  
Nuclear Reactor ◽  
Combustion Engine ◽  
Fundamental Problem ◽  
Thermal Contact ◽  
Thermal Conductance ◽  
Thermal Control ◽  
Cryogenic Liquid ◽  
Thermal Contact Conductance ◽  
Thermomechanical Model ◽  
Contact Conductance

Junction thermal conductance is an important consideration in such applications as thermally induced stresses in supersonic and hypersonic flight vehicles, nuclear reactor cooling, electronics packaging, spacecraft thermal control, gas turbine and internal combustion engine cooling, and cryogenic liquid storage. A fundamental problem in analyzing and predicting junction thermal conductance is determining thermal contact conductance of nonflat rough metals. Workable models have been previously derived for the limiting idealized cases of flat, rough, and spherical smooth surfaces. However, until now no tractable models have been advanced for nonflat rough “engineering” surfaces which are much more commonly dealt with in practice. The present investigation details the synthesis of previously derived models for macroscopically nonuniform thermal contact conductance and contact of nonflat rough spheres into a thermomechanical model, which is presented in an analytical/graphical format. The present model agrees well with representative experimental conductance results from the literature for stainless steel 303 and 304 with widely varying nonflatness (2 to 200 μm) and roughness (0.1 to 10 μm).

Sign in / Sign up

Export Citation Format

Share Document