scholarly journals Conductive Regenerated Cellulose Fibers by Electroless Plating

Fibers ◽  
2019 ◽  
Vol 7 (5) ◽  
pp. 38 ◽  
Author(s):  
Zainab Al-Maqdasi ◽  
Abdelghani Hajlane ◽  
Abdelghani Renbi ◽  
Ayoub Ouarga ◽  
Shailesh Singh Chouhan ◽  
...  
Keyword(s):  
Mechanical Performance ◽  
Cellulose Fibers ◽  
Regenerated Cellulose ◽  
Moisture Uptake ◽  
Copper Plating ◽  
Printed Wiring Boards ◽  
Electroless Copper Plating ◽  
Functional Composites ◽  
Electroless Copper ◽  
Advanced Applications

Continuous metalized regenerated cellulose fibers for advanced applications (e.g., multi-functional composites) are produced by electroless copper plating. Copper is successfully deposited on the surface of cellulose fibers using commercial cyanide-free electroless copper plating packages commonly available for the manufacturing of printed wiring boards. The deposited copper was found to enhance the thermal stability, electrical conductivity and resistance to moisture uptake of the fibers. On the other hand, the chemistry involved in plating altered the molecular structure of the fibers, as was indicated by the degradation of their mechanical performance (tensile strength and modulus).

scholarly journals Conductive Regenerated Cellulose Fibers for Multi-Functional Composites: Mechanical and Structural Investigation

Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1746
Author(s):  
Zainab Al-Maqdasi ◽  
Roberts Joffe ◽  
Ayoub Ouarga ◽  
Nazanin Emami ◽  
Shailesh Singh Chouhan ◽  
...  
Keyword(s):  
Molecular Structure ◽  
Mechanical Properties ◽  
Structural Integrity ◽  
Mechanical Performance ◽  
Cellulose Fibers ◽  
Regenerated Cellulose ◽  
Plating Bath ◽  
Model Composite ◽  
Sensing Applications ◽  
Functional Composites

Regenerated cellulose fibers coated with copper via electroless plating process are investigated for their mechanical properties, molecular structure changes, and suitability for use in sensing applications. Mechanical properties are evaluated in terms of tensile stiffness and strength of fiber tows before, during and after the plating process. The effect of the treatment on the molecular structure of fibers is investigated by measuring their thermal stability with differential scanning calorimetry and obtaining Raman spectra of fibers at different stages of the treatment. Results show that the last stage in the electroless process (the plating step) is the most detrimental, causing changes in fibers’ properties. Fibers seem to lose their structural integrity and develop surface defects that result in a substantial loss in their mechanical strength. However, repeating the process more than once or elongating the residence time in the plating bath does not show a further negative effect on the strength but contributes to the increase in the copper coating thickness, and, subsequently, the final stiffness of the tows. Monitoring the changes in resistance values with applied strain on a model composite made of these conductive tows show an excellent correlation between the increase in strain and increase in electrical resistance. These results indicate that these fibers show potential when combined with conventional composites of glass or carbon fibers as structure monitoring devices without largely affecting their mechanical performance.

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper

Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Vacuum ◽  
2019 ◽  
Vol 170 ◽  
pp. 108967 ◽  
Author(s):  
Yan Hong ◽  
Xiangqing You ◽  
Yi Zeng ◽  
Yuanming Chen ◽  
Yunzhong Huang ◽  
...  
Keyword(s):  
Surface Modification ◽  
Epoxy Resin ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Copper Plating ◽  
Air Plasma ◽  
Electroless Copper Plating ◽  
Plasma Surface ◽  
Printed Circuit ◽  
Electroless Copper

scholarly journals Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent.

1991 ◽  
Vol 42 (9) ◽  
pp. 913-917 ◽  
Author(s):  
Hideo HONMA ◽  
Motoaki KOMATSU ◽  
Tomoyuki FUJINAMI
Keyword(s):  
Glyoxylic Acid ◽  
Reducing Agent ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

New and clean strategy for the determination of Cu2+ in electroless copper plating baths

2007 ◽  
Vol 68 (1) ◽  
pp. 150-155 ◽  
Author(s):  
Rutao Liu ◽  
Wansong Zong ◽  
Canzhu Gao ◽  
Zhenxing Chi ◽  
Lijun Zhang
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless Copper Plating Process by Applying Alternating One-Side Air Stirring Method for High-Aspect-Ratio Through-Holes

2017 ◽  
Vol 164 (12) ◽  
pp. D771-D777 ◽  
Author(s):  
H. Kanemoto ◽  
T. Kawamura ◽  
H. Suzuki ◽  
T. Miyazaki ◽  
H. Mozumi ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper
Sign in / Sign up

Export Citation Format

Share Document