Method for measurement of the dimensions of a cylindrical electronic component having two axial terminations

2015 ◽  
Keyword(s):  
Electronic Component

scholarly journals An Electronic Component Recognition Algorithm Based on Deep Learning with a Faster SqueezeNet

2020 ◽  
Vol 2020 ◽  
pp. 1-11
Author(s):  
Yuanyuan Xu ◽  
Genke Yang ◽  
Jiliang Luo ◽  
Jianan He
Keyword(s):  
Deep Learning ◽  
Characteristic Curve ◽  
Area Under The Curve ◽  
Principal Component ◽  
Recognition Algorithm ◽  
Electronic Component ◽  
Support Vector ◽  
Learning Networks ◽  
Component Recognition ◽  
And Performance

Electronic component recognition plays an important role in industrial production, electronic manufacturing, and testing. In order to address the problem of the low recognition recall and accuracy of traditional image recognition technologies (such as principal component analysis (PCA) and support vector machine (SVM)), this paper selects multiple deep learning networks for testing and optimizes the SqueezeNet network. The paper then presents an electronic component recognition algorithm based on the Faster SqueezeNet network. This structure can reduce the size of network parameters and computational complexity without deteriorating the performance of the network. The results show that the proposed algorithm performs well, where the Receiver Operating Characteristic Curve (ROC) and Area Under the Curve (AUC), capacitor and inductor, reach 1.0. When the FPR is less than or equal 10 − 6   level, the TPR is greater than or equal to 0.99; its reasoning time is about 2.67 ms, achieving the industrial application level in terms of time consumption and performance.

scholarly journals Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure

2018 ◽  
Vol 144 ◽  
pp. 04010
Author(s):  
Bobin Saji George ◽  
M. Ajmal ◽  
S. R. Deepu ◽  
M. Aswin ◽  
D. Ribin ◽  
...  
Keyword(s):  
Power Dissipation ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Electronic Component ◽  
Thermal Design ◽  
Electronic Systems ◽  
Computational Domain ◽  
Computational Tool ◽  
Cycle Times ◽  
Design Cycle

Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be generated and quickly assessed. The present numerical study aims at developing a computational tool in OpenFOAM that can predict the heat dissipation rate and temperature profile of any electronic component in operation. A suitable computational domain with defined aspect ratio is chosen. For analyzing, “buoyant Boussinesq Simple Foam“ solver available with OpenFOAM is used. It was modified for adapting to the investigation with specified initial and boundary conditions. The experimental setup was made with the dimensions taken up for numerical study. Thermocouples were calibrated and placed in specified locations. For different heat input, the temperatures are noted down at steady state and compared with results from the numerical study.

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