scholarly journals Non-linear finite element analysis of a Ti6Al4V/Inconel 625 joint obtained by explosion welding for sub-sea applications

2021 ◽  
Vol 38 (1) ◽  
pp. 13-16
Author(s):  
Pasqualino Corigliano
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Strain Curve ◽  
Explosion Welding ◽  
Inconel 625 ◽  
Stress Strain Curve ◽  
Stress Strain ◽  
Element Analysis ◽  
Linear Finite Element ◽  
Non Linear

Industries have shown interest in the use of dissimilar metals to make corrosion-resistant materials combined with good mechanical properties in marine environments. Explosive welding can be considered a good method for joining dissimilar materials to prevent galvanic corrosion. The aim of the present study was to simulate the non-linear behaviour of a Ti6Al4V/Inconel 625 welded joint obtained by explosion welding from the values of the tensile ultimate strength and yielding strength of the parent materials. The present study compared the stress-strain curve from tensile loading obtained by the non-linear finite element analysis with the experimental stress-strain curve of a bimetallic joint. The applied method provides useful information for the development of models and the prediction of the structural behaviour of Ti6Al4V/Inconel 625 explosive welded joints.

scholarly journals Study on forging process and die design of parking sensor shell

2018 ◽  
Vol 185 ◽  
pp. 00020
Author(s):  
Tung-Sheng Yang ◽  
Jhong -Yuan Li
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Distribution ◽  
Strain Curve ◽  
Stress Strain Curve ◽  
Stress Strain ◽  
Element Analysis ◽  
Forging Process ◽  
The Finite Element Analysis ◽  
Forging Force

The process of precision forging has been developed recently because of its advantages of giving high production rates and improved strength. For complete filling up, predicting the power requirement and final shape are important features of the forging process. A finite element method is used to investigate the forging force, the final shape and the stress distribution of the parking sensor shell forging. The stress-strain curve of AL-6082 is obtained by the computerized screw universal testing machine. The friction factor between AL-6082 alloy and die material (SKD11) are determined by using ring compression test. Stress-strain curve and fiction factor are then applied to the finite element analysis of the parking sensor shell forging. Maximum forging load, effective stress distribution and shape dimensions are determined of the parking sensor shell forging, using the finite element analysis. Then the parking sensor shells are formed by the forging machine. Finally, the experimental data are compared with the results of the current simulation for the forging force and shape dimensions of the parking sensor shell.

Numerical Study on the Mechanical Behavior of Aluminum Foam Material Using CT Image

2009 ◽  
Vol 79-82 ◽  
pp. 1297-1300 ◽  
Author(s):  
Hyup Jae Chung ◽  
Kyong Yop Rhee ◽  
Beom Suck Han ◽  
Yong Mun Ryu
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Aluminum Foam ◽  
Three Dimensional ◽  
Strain Curve ◽  
Foam Material ◽  
Stress Strain Curve ◽  
Stress Strain ◽  
Element Analysis ◽  
X Ray

In this study, finite element analysis was made to predict the tensile and compressive behaviors of aluminum foam material. The predicted tensile and compressive behaviors were compared with those determined from the tensile and compressive tests. X-ray imaging technique was used to determine internal structure of aluminum foam material. That is, X-ray computed tomography (CT) was used to model the porosities of the material. Three-dimensional finite element modeling was made by stacking two-dimensional tomography of aluminum foam material determined from CT images. The stackings of CT images were processed by three-dimensional modeling program. The results showed that the tensile stress-strain curve predicted from the finite element analysis was similar to that determined by the experiment. The simulated compressive stress-strain curve also showed similar tendency with that of experiment up to about 0.4 strain but exhibited a different behavior from the experimental one after 0.4 strain. The discrepancy of compressive stress-strain curves in a high strain range was associated with the contact of aluminum foam walls broken by the large deformation.

Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analysis

2003 ◽  
Vol 17 (08n09) ◽  
pp. 1983-1988
Author(s):  
Baik Woo Lee ◽  
Jeung Hyun Jeong ◽  
Woosoon Jang ◽  
Ju Young Kim ◽  
Dong Won Kim ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Thermal Deformation ◽  
Flip Chip ◽  
Computational Analysis ◽  
Strain Curve ◽  
Stress Strain Curve ◽  
Stress Strain ◽  
Element Analysis

Many thermomechanical reliability studies on microelectronics and microsystems have relied upon computational analysis, since experimental work is rather difficult and very time-consuming. For computational analysis, it is essential to use as input accurate material properties; if not, the results of a reliability analysis may be very inaccurate. However, it is still quite difficult to arrive at unified material properties for modeling microelectronic assemblies because of the absence of standards for micro-material characterization, the difference between bulk and in-situ material properties, and so forth. The goal of this study was to determine the uniaxial stress-strain curve of a solder in a flip-chip assembly, using experimental measurements and finite-element analysis (FEA) of the solder's thermal deformation characteristics with increasing temperature. The thermal deformation of flip-chip solder joints was measured by electronic speckle pattern interferometry (ESPI). For the scale of evaluation required, the measurement magnification was modified to allow its application to micromaterials by using a long-working-distance microscope, iris and zoom lens. Local deformation of solder balls could be measured at submicrometer scale, and stress-strain curves could be determined using the measured thermal deformation as input data for finite-element analysis. The procedure was applied to an Sn-36Pb-2Ag flip-chip solder joint.

Specimen positioning effect on microshear test: Non-linear finite element analysis

2012 ◽  
Vol 28 ◽  
pp. e15-e16
Author(s):  
L.H.A. Raposo ◽  
L.C.M. Dantas ◽  
T.A. Xavier ◽  
A.G. Pereira ◽  
A. Versluis ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Element Analysis ◽  
Linear Finite Element ◽  
Non Linear
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