Influences of Properties of Fixed Abrasive Tool on the Lapping Process of Stainless Steel Substrate

2010 ◽  
Vol 135 ◽  
pp. 365-369
Author(s):  
Cong Rong Zhu ◽  
Bing Hai Lv ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Material Removal Rate ◽  
Material Removal ◽  
Stainless Steel Substrate ◽  
Removal Rate ◽  
Steel Substrate ◽  
Abrasive Tool ◽  
Bonding Material ◽  
Fixed Abrasive

To improve the machining efficiency as well as surface roughness, a series of experiments employed fixed abrasive tools are carried out for stainless steel substrate, and influences of properties of fixed abrasive tool on the lapping process are studied. It is found that the resin is the best bonding material in this study. The surface roughness under different concentration of bonding material is similar, and the material removal rate (MRR) increases as the concentration of bonding material decreases from 50% to 20%. But too little of bonding material results into low bond strength that causing low material removal rate. It is also found that higher shear strength, lower wear rate, and the shear strength of the tool with 35% bonding material is the highest. It is obvious that the surface roughness and material removal rate decline as the grit size decreases. The roughness of surface lapped with resin bonded 4000# SiC abrasive tool comes to 18nm, and the material removal rate is 0.63μm/min.

Preparation and Evaluation of Hydrophilic Fixed Abrasive Pad

2010 ◽  
Vol 431-432 ◽  
pp. 17-20 ◽  
Author(s):  
Yong Wei Zhu ◽  
Jun Li ◽  
Jun Wang ◽  
Kui Lin
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Urethane Acrylate ◽  
Swelling Ratio ◽  
Pencil Hardness ◽  
Fixed Abrasive Pad ◽  
Preparation And Evaluation ◽  
Fixed Abrasive

The swelling ratio and the pencil hardness of pad were introduced to evaluate the properties of hydrophilic fixed abrasive (FA) pad. The effect of pad composition on its swelling ratio and pencil hardness was studied. Results show that the swelling ratio increases with the rise of content of Trimethylopropane Triacrylate (TMPTA) and Urethane Acrylate (PUA) and the pad gets harder while there is more TMPTA and less PUA. Results also show that a low swelling ratio corresponds to a high material removal rate (MRR), and a low wet pencil hardness to a low surface roughness in each group.

Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet

2014 ◽  
Vol 1027 ◽  
pp. 58-62
Author(s):  
Hai Feng Cheng ◽  
Li Jie Ma ◽  
Jian Guo Yao ◽  
Jian Xiu Su
Keyword(s):  
Stainless Steel ◽  
Process Parameters ◽  
Material Removal ◽  
Stainless Steel Substrate ◽  
Removal Rate ◽  
Steel Substrate ◽  
Rotational Velocity ◽  
Stainless Steel Sheet ◽  
Polishing Pressure ◽  
Abrasive Size

Chemical mechanical polishing (CMP) is the most effective technology to achieve ultra-smooth without damage surface in ultra-precision machining of stainless steel substrate. In this paper, according to the slurry ingredients obtained by former research, the influences of the CMP process parameters, such as the rotational velocity of the platen and the carrier, the polishing pressure and the abrasive size on the material removal rate (MRR), have been studied in CMP stainless steel substrate based on the alumina (Al2O3) abrasive. The research results show that the material removal rate increases with the increase of the abrasive size, the rotational velocity of the platen and the polishing pressure significantly and the surface roughness increases with the increase of the abrasive size. This study results will provide the reference for optimizing the process parameters and researching the material removal mechanism in CMP stainless steel sheet.

Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel

2014 ◽  
Vol 1027 ◽  
pp. 167-170 ◽  
Author(s):  
Jian Xiu Su ◽  
Jia Peng Chen ◽  
Hai Feng Cheng ◽  
Song Zhan Fan
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
304 Stainless Steel ◽  
Research Results

In chemical mechanical polishing (CMP) of ultra-thin stainless steel, the oxidant of polishing slurry determines the material removal rate (MRR). In this paper, the influences of oxidant in slurry on MRR and surface roughness have been studied in CMP of ultra-thin 304 stainless steel based on alumina (Al2O3) abrasive. The research results show that, in the same conditions, the MRR increases with the increase of the oxidant C and the oxidant B, the MRR decreases with the increase of the oxidant A and the MRR is max with the oxidant C. It indicated that the oxidant C has a large effect on MRR in CMP of the 304 stainless steel. The research results can provide the reference for studying the slurry in CMP of ultra-thin stainless steel.

Investigation into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the Assistance of Ultrasonic Vibration

2012 ◽  
Vol 523-524 ◽  
pp. 155-160 ◽  
Author(s):  
Ya Guo Li ◽  
Yong Bo Wu ◽  
Li Bo Zhou ◽  
Hui Ru Guo ◽  
Jian Guo Cao ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Fused Silica ◽  
Processing Efficiency ◽  
Machined Surface ◽  
Fixed Abrasive

Ultrasonic vibration assisted processing is well known for the improvement in machined surface quality and processing efficiency due to the reduced forces and tribology-generated heating when grinding hard-brittle materials. We transplanted this philosophy to chemo-mechanical fixed abrasive polishing of optical glass, namely fused silica, in an attempt to improve surface roughness and/or material removal rate. Experiments were conducted to elucidate the fundamental characteristics of chemo-mechanical fixed abrasive polishing of fused silica in the presence and absence of ultrasonic vibration on a setup with an in-house built gadget. The experimental results show that ultrasonic vibration assisted chemo-mechanical fixed abrasive polishing can yield increased material removal rate while maintaining the surface roughness of manufactured optics compared to conventional fixed abrasive polishing without ultrasonic vibration. The mechanism of material removal in fixed abrasive polishing was also delved. We found that the glass material is removed through the synergic effects of chemical and mechanical actions between abrasives and glass and the resultant grinding swarf contains ample Si element as well as Ce element, standing in stark contrast to the polisher that contains abundant Ce element and minor Si element.

scholarly journals Optimal design and experimental study of fixed abrasive pads based on coupling of damping regulation and pellet arrangement

2021 ◽  
Vol 12 (1) ◽  
pp. 97-108
Author(s):  
Chaoqun Xu ◽  
Congfu Fang ◽  
Yuan Li ◽  
Chong Liu
Keyword(s):  
Surface Roughness ◽  
Pressure Distribution ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Wafer Surface ◽  
Test Results ◽  
Workpiece Material ◽  
Fixed Abrasive

Abstract. Lapping and polishing technology is an efficient processing method for wafer planarization processing. The structure of the fixed abrasive pad (FAP) is one of the most concerning issues in the research. The FAP structure affects the pressure distribution on the wafer surface, and the pressure distribution during processing has a significant influence on the wafer surface. Therefore, in this paper, a better pressure distribution is obtained by adjusting the angle of the spiral arrangement and the damping distribution of the damping layer of the FAP, thereby obtaining better processing quality. Based on the above theory, a new type of FAP, with coupling between the arrangement of the pellets and the damping regulation of the damping layer, was designed and optimized. The machining effects of different FAPs on the workpiece surface are compared in terms of material removal rate, material removal thickness, and surface roughness. The test results show that the workpiece material removal rate is higher than that of the traditional FAP when using the optimized FAP. The non-uniformity of the optimized FAP for that of material removal was 4.034 µm, which was lower than the traditional FAPs by 24.4 % and 17.6 %, respectively. The average surface roughness, Ra, of the optimized FAP is 0.21 µm, which is lower than 19.1 % and 12.5 % of the two traditional FAPs, respectively. Therefore, workpiece material removal and distribution are more uniform, and the surface quality of the workpiece is better when the optimized FAP processing is used. The test results prove that the optimized pellet arrangement and damping can achieve a better surface quality of the workpiece, which can meet the precision lapping process requirements for high-quality surfaces and large-scale production of brittle and hard materials such as sapphire.

Influence of Bond Material Concentration on the Mechanical Properties of Fixed Abrasive Lapping Tool for Stainless Steel

2012 ◽  
Vol 499 ◽  
pp. 372-377
Author(s):  
C.R. Zhu ◽  
B.H. Lv ◽  
Ju Long Yuan
Keyword(s):  
Mechanical Properties ◽  
Stainless Steel ◽  
Shear Strength ◽  
Modulus Of Elasticity ◽  
Stainless Steel Substrate ◽  
Steel Substrate ◽  
Abrasive Tool ◽  
Micro Structure ◽  
Sem Images ◽  
Fixed Abrasive

To improve the machining efficiency as well as surface roughness, a resin-bonded fixed abrasive tool is developed for lapping process of stainless steel substrate. To optimize the lapping ability of the fixed abrasive tool, the influences of bond material concentration on the mechanical properties of fixed abrasive lapping tool, including structure hardness, shear strength, the water-absorbing capacity and modulus of elasticity in compression are investigated. The micro structure of tools is also observed. Tools made of #1000 SiC abrasive and resin with different concentrations is employed in the tests. It is found, the hardness, shear strength, and modulus of elasticity in compression reach highest value, as the 35%wt bond material are used. The water-absorbing capacity increases as the bond material concentration decreases. It is judged from the SEM images that the number of pores in tool with 35%wt bond material is at the most.

Precision Honing of Stainless Steel Valve Core

2011 ◽  
Vol 487 ◽  
pp. 438-442
Author(s):  
Zhi Gang Dong ◽  
C.W. Kang ◽  
L. Xu
Keyword(s):  
Experimental Study ◽  
Surface Roughness ◽  
Stainless Steel ◽  
Surface Topography ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grit Size ◽  
Steel Cylinder

The paper reports an experimental study on the effect of honing parameters on the honing surface roughness, material removal rate and surface topography. A cylindrical honing machine was developed, on which the honing experiments for stainless steel cylinder parts were performed with different honing parameters including the abrasives and its grit size of honing stones, honing pressure and honing time. The results can provide helpful instruction to the determination of the honing process and parameters.

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