scholarly journals Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth during Thermal Aging of SAC305 Solder Alloy

2013 ◽  
Vol 03 (02) ◽  
Author(s):  
Tabassum Yasmin ◽  
Muhammad Sadiq
Keyword(s):  
Intermetallic Compound ◽  
Solder Alloy ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Sac305 Solder ◽  
Lanthanum Doping

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

In-situ EIS study on the initial corrosion evolution behavior of SAC305 solder alloy covered with NaCl solution

2021 ◽  
Vol 852 ◽  
pp. 156953 ◽  
Author(s):  
Chuang Qiao ◽  
Mingna Wang ◽  
Long Hao ◽  
Xiaolin Jiang ◽  
Xiahe Liu ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Nacl Solution ◽  
Sac305 Solder ◽  
Evolution Behavior

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

scholarly journals Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 936 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Intermetallic Compound ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Solder Paste ◽  
Shear Tests ◽  
Sac305 Solder ◽  
Epoxy Solder ◽  
The Relationship ◽  
Bonding Characteristics ◽  
Preventive Effects

This study investigated the suppression of the growth of the intermetallic compound (IMC) layer that forms between epoxy solder joints and the substrate in electronic packaging by adding graphene nano-sheets (GNSs) to 96.5Sn–3.0Ag–0.5Cu (wt %, SAC305) solder whose bonding characteristics had been strengthened with a polymer. IMC growth was induced in isothermal aging tests at 150 °C, 125 °C and 85 °C for 504 h (21 days). Activation energies were calculated based on the IMC layer thickness, temperature, and time. The activation energy required for the formation of IMCs was 45.5 KJ/mol for the plain epoxy solder, 52.8 KJ/mol for the 0.01%-GNS solder, 62.5 KJ/mol for the 0.05%-GNS solder, and 68.7 KJ/mol for the 0.1%-GNS solder. Thus, the preventive effects were higher for increasing concentrations of GNS in the epoxy solder. In addition, shear tests were employed on the solder joints to analyze the relationship between the addition of GNSs and the bonding characteristics of the solder joints. It was found that the addition of GNSs to epoxy solder weakened the bonding characteristics of the solder, but not critically so because the shear force was higher than for normal solder (i.e., without the addition of epoxy). Thus, the addition of a small amount of GNSs to epoxy solder can suppress the formation of an IMC layer during isothermal aging without significantly weakening the bonding characteristics of the epoxy solder paste.

scholarly journals Effect of Mixed Rare Earths on the Wetting Behavior and Interfacial Reaction between Sn-0.70Cu-0.05Ni Solder and Amorphous Fe84.3Si0.3B5.4 Alloy

2018 ◽  
Vol 206 ◽  
pp. 03005
Author(s):  
Bin Hou ◽  
Fengmei Liu ◽  
Hongqin Wang ◽  
Yupeng Zhang ◽  
Jianglong Yi ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Melting Temperature ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Rare Earths ◽  
Wetting Behavior ◽  
Amorphous Substrate ◽  
Continuous State ◽  
Amorphous Substrates ◽  
Limited Change

In order to explore the effect of addition of mixed rare earths (MRE) on the wetting behavior and interfacial reaction between Sn-0.70Cu-0.05Ni solder and amorphous Fe84.3Si10.3B5.4 alloy, 0.25 wt.% percentage of the MRE, which are mainly elements La and Ce, were added into the solder. Results show it can refine the microstructure of the solder alloy, and there is limited change of melting temperature with the addition of MRE in the solder. The wettability of the solder on amorphous substrate is improved by adding 0.25 wt.% percentage of the MRE into Sn-0.70Cu-0.05Ni solder. Moreover, research results indicate that, with the increase of wetting temperature, the final equilibrium wetting angles of Sn-0.70Cu-0.05Ni and Sn-0.70Cu-0.05Ni-0.25MRE on amorphous substrate decrease gradually, indicating the better wettability at the higher wetting temperature. In addition, with the increase of temperature, the distribution of intermetallic compound (IMC) FeSn2 formed at the interface between the two solders and amorphous substrate is changed from discontinuous state to continuous state. The thickness of the interfacial IMC layer between solder and amorphous substrates reduced with the addition of MRE, indicating that the presence of 0.25 wt.% percentage of the MRE is effective in suppressing the growth of IMC layer.

Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

2017 ◽  
Vol 29 (4) ◽  
pp. 191-198 ◽  
Author(s):  
Muhammad Aamir ◽  
Izhar Izhar ◽  
Muhammad Waqas ◽  
Muhammad Iqbal ◽  
Muhammad Imran Hanif ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Fuzzy Logic ◽  
Solder Alloy ◽  
Thermal Aging ◽  
Fuzzy Rule ◽  
Rule Base ◽  
Content Type ◽  
Wide Range ◽  
Fuzzy Logic Approach ◽  
Free Solder

Purpose This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5 (SAC305) alloy, at different levels of temperature. The reliability of solder joint in materials selection is critical in terms of temperature, mechanical properties and environmental aspects. Owing to a wide range of soldering materials available, the selection space finds a fuzzy characteristic. Design/methodology/approach The developed algorithm takes thermal aging temperature for SAC305 alloy as input and converts it into fuzzy domain. These fuzzified values are then subjected to a fuzzy rule base, where a set of rules determines the IMC size and mechanical properties, such as yield strength (YS) and ultimate tensile strength (UTS) of SAC305 alloy. The algorithm is successfully simulated for various input thermal aging temperatures. To analyze and validate the developed algorithm, an SAC305 lead (Pb)-free solder alloy is developed and thermally aged at 40, 60 and 100°C temperature. Findings The experimental results indicate an average IMCs size of 5.967 (in Pixels), 19.850 N/mm2 YS and 22.740 N/mm2 UTS for SAC305 alloy when thermally aged at an elevated temperature of 140°C. In comparison, the simulation results predicted 5.895 (in Pixels) average IMCs size, 19.875 N/mm2 YS and 22.480 N/mm2 UTS for SAC305 alloy at 140°C thermally aged temperature. Originality/value From the experimental and simulated results, it is evident that the fuzzy-based developed algorithm can be used effectively to predict the IMCs size and mechanical properties of SAC305 at various aging temperatures, for the first time.

Microstructure evolution and impact fracture behaviors of Z3CN20-09M stainless steels after long-term thermal aging

2013 ◽  
Vol 433 (1-3) ◽  
pp. 41-49 ◽  
Author(s):  
S.L. Li ◽  
Y.L. Wang ◽  
H.L. Zhang ◽  
S.X. Li ◽  
K. Zheng ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Stainless Steels ◽  
Thermal Aging ◽  
Impact Fracture ◽  
Fracture Behaviors

Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

2018 ◽  
Vol 280 ◽  
pp. 206-211 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Nur Ain Athirah Amran ◽  
Mohd Izrul Izwan Ramli
Keyword(s):  
Intermetallic Compound ◽  
Microstructure Evolution ◽  
Bulk Solder ◽  
Solder Paste ◽  
Microstructure Formation ◽  
Cu Content ◽  
Microstructure Morphology ◽  
Solder Microstructure ◽  
Multiple Reflow Cycles ◽  
Solder Composition

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.

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