Trends of Simulation Technolgies. Evaluation and Thermal Stress Analysis for Design of Surface Mount Solder Joints.

Journal of The Japan Institute of Electronics Packaging ◽

10.5104/jiep.2.173 ◽

1999 ◽

Vol 2 (3) ◽

pp. 173-178 ◽

Author(s):

Kuniaki TAKAHASHI ◽

Minoru MUKAI ◽

Takashi KAWAKAMI ◽

Yasuo KANEKO ◽

Nobuyuki TAKAKI

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Solder Joints ◽

Thermal Stress Analysis ◽

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A nonlinear thermal stress analysis of surface mount solder joints

10.1109/ectc.1990.122305 ◽

2002 ◽

Author(s):

B. Ozmat

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Solder Joints ◽

Thermal Stress Analysis ◽

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Reliability Design Method for Solder Joints Based on Coupled Thermal-Stress Analysis of Electronics Packaging Structure

Journal of The Japan Institute of Electronics Packaging ◽

10.5104/jiep.9.405 ◽

2006 ◽

Vol 9 (5) ◽

pp. 405-412 ◽

Author(s):

Kenji HIROHATA ◽

Katsumi HISANO ◽

Hiroyuki TAKAHASHI ◽

Minoru MUKAI ◽

Takashi KAWAKAMI ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Solder Joints ◽

Design Method ◽

Electronics Packaging ◽

Reliability Design ◽

Thermal Stress Analysis ◽

Packaging Structure

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Two-Dimensional Thermal Stress Analysis of Surface Mount Joints under Uniform Temperature Change.

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.60.1056 ◽

1994 ◽

Vol 60 (572) ◽

pp. 1056-1062

Author(s):

Fumito Nakagawa ◽

Yuichi Nakano ◽

Toshiyuki Sawa

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Temperature Change ◽

Two Dimensional ◽

Uniform Temperature ◽

Thermal Stress Analysis ◽

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Two-Dimensional Thermal Stress Analysis of Surface Mount Joints under Uniform Temperature Change

JSME international journal Ser A Mechanics and material engineering ◽

10.1299/jsmea1993.38.4_425 ◽

1995 ◽

Vol 38 (4) ◽

pp. 425-432 ◽

Author(s):

Fumito Nakagawa ◽

Yuichi Nakano ◽

Toshiyuki Sawa

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Temperature Change ◽

Two Dimensional ◽

Uniform Temperature ◽

Thermal Stress Analysis ◽

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Heat transfer and nonlinear thermal stress analysis of a convective surface mount package

IEEE Transactions on Components Packaging and Manufacturing Technology Part A ◽

10.1109/95.588576 ◽

1997 ◽

Vol 20 (2) ◽

pp. 213-219 ◽

Author(s):

Bor Zen Hong ◽

Tsorng-Dih Yuan

Keyword(s):

Heat Transfer ◽

Thermal Stress ◽

Stress Analysis ◽

Thermal Stress Analysis ◽

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Heat transfer and nonlinear thermal stress analysis of a convective surface mount package

InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V ◽

10.1109/itherm.1996.534550 ◽

2002 ◽

Author(s):

Bor Zen Hong ◽

Tsorng-Dih Yuan

Keyword(s):

Heat Transfer ◽

Thermal Stress ◽

Stress Analysis ◽

Thermal Stress Analysis ◽

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Mechanical & Thermal Stress Analysis under Actual Condition and Test Design of 550kV High Coupled Split Reactor

2020 IEEE 4th Conference on Energy Internet and Energy System Integration (EI2) ◽

10.1109/ei250167.2020.9347258 ◽

2020 ◽

Author(s):

Li Zhao ◽

Yanzhe Zhang ◽

Tong Jiang ◽

Qiang Tang ◽

Haojun Liu ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Actual Condition ◽

Test Design ◽

Thermal Stress Analysis

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Comparative Assessment of Elastio-Viscoplastic Models for Thermal Stress Analysis of Automotive Powertrain Component

10.4271/2015-01-0533 ◽

2015 ◽

Author(s):

Jianghui Mao ◽

Carlos Engler-Pinto ◽

Xuming Su

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Comparative Assessment ◽

Thermal Stress Analysis ◽

Automotive Powertrain ◽

Viscoplastic Models

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Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International ◽

10.1109/3dic.2012.6263002 ◽

2012 ◽

Author(s):

Sayuri Kohara ◽

Akihiro Horibe ◽

Kuniaki Sueoka ◽

Keiji Matsumoto ◽

Fumiaki Yamada ◽

...

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

3D Integration ◽

Thermal Stress Analysis ◽

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Thermal stress analysis for laser cutting corner with a fluctuant cutting speed in steel plate

Journal of Physics Conference Series ◽

10.1088/1742-6596/633/1/012090 ◽

2015 ◽

Vol 633 ◽

pp. 012090 ◽

Author(s):

H B Xu ◽

Jun Hu ◽

Hong Sheng ◽

Z C Du

Keyword(s):

Thermal Stress ◽

Stress Analysis ◽

Laser Cutting ◽

Steel Plate ◽

Cutting Speed ◽

Thermal Stress Analysis

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