Influence of Abrasive Density on the Material Removal Mechanisms in Diamond Wire Sawing of Silicon Crystal

2022 ◽  
pp. 488-496
Author(s):  
Van-Nhat Le ◽  
Van-Dung Tran
Keyword(s):  
Material Removal ◽  
Silicon Crystal ◽  
Diamond Wire ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
Diamond Wire Sawing

scholarly journals Simulation of the ductile machining mode of silicon

2021 ◽  
Author(s):  
Hagen Klippel ◽  
Stefan Süssmaier ◽  
Matthias Röthlin ◽  
Mohamadreza Afrasiabi ◽  
Uygar Pala ◽  
...  
Keyword(s):  
Brittle Material ◽  
Material Removal ◽  
Machining Process ◽  
Ductile Material ◽  
Diamond Wire ◽  
Ductile Machining ◽  
Mesh Free ◽  
Diamond Wire Sawing ◽  
Material Removal Mode ◽  
Brittle Material Removal

AbstractDiamond wire sawing has been developed to reduce the cutting loss when cutting silicon wafers from ingots. The surface of silicon solar cells must be flawless in order to achieve the highest possible efficiency. However, the surface is damaged during sawing. The extent of the damage depends primarily on the material removal mode. Under certain conditions, the generally brittle material can be machined in ductile mode, whereby considerably fewer cracks occur in the surface than with brittle material removal. In the presented paper, a numerical model is developed in order to support the optimisation of the machining process regarding the transition between ductile and brittle material removal. The simulations are performed with an GPU-accelerated in-house developed code using mesh-free methods which easily handle large deformations while classic methods like FEM would require intensive remeshing. The Johnson-Cook flow stress model is implemented and used to evaluate the applicability of a model for ductile material behaviour in the transition zone between ductile and brittle removal mode. The simulation results are compared with results obtained from single grain scratch experiments using a real, non-idealised grain geometry as present in the diamond wire sawing process.

Material removal mechanisms by EDM of zirconia reinforced MWCNT nanocomposites

2016 ◽  
Vol 42 (5) ◽  
pp. 5792-5801 ◽  
Author(s):  
Latifa Melk ◽  
Marta-Lena Antti ◽  
Marc Anglada
Keyword(s):  
Material Removal ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms

Study of material removal mechanisms in grinding of C/SiC composites via single-abrasive scratch tests

2019 ◽  
Vol 45 (4) ◽  
pp. 4729-4738 ◽  
Author(s):  
Yuanchen Li ◽  
Xiang Ge ◽  
Hui Wang ◽  
Yingbin Hu ◽  
Fuda Ning ◽  
...  
Keyword(s):  
Material Removal ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
Sic Composites ◽  
Scratch Tests

Progress in material removal mechanisms of surface polishing with ultra precision

2004 ◽  
Vol 49 (16) ◽  
pp. 1687-1693 ◽  
Author(s):  
Jin Xu ◽  
Jianbin Luo ◽  
Xinchun Lu ◽  
Chaohui Zhang ◽  
Guoshun Pan
Keyword(s):  
Material Removal ◽  
Material Removal Mechanisms ◽  
Surface Polishing ◽  
Removal Mechanisms ◽  
Ultra Precision
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