An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate

2015 ◽  
Vol 44 (10) ◽  
pp. 3855-3862 ◽  
Author(s):  
Jing-Yao Chang ◽  
Tung-Han Chaung ◽  
Tao-Chih Chang
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