An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate
2015 ◽
Vol 44
(10)
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pp. 3855-3862
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2006 ◽
Vol 46
(12)
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pp. 2139-2148
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2005 ◽
Vol 43
(18)
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pp. 3955-3957
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2009 ◽
Vol 4
(4)
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pp. 401-413
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2010 ◽
Vol 23
(5)
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pp. 1589-1602
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2017 ◽
Vol 36
(3)
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pp. 873-878
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2021 ◽
2013 ◽
Vol 49
(13)
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pp. 164
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1991 ◽
pp. 394-399