Light regulated heterojunctions with tunable interfacial energy barriers for sensitive and specific detection of copper ions

2021 ◽  
pp. 133880
Author(s):  
Ye Ma ◽  
Ming Li ◽  
Zhengming Li ◽  
Minggang Zhao
Keyword(s):  
Interfacial Energy ◽  
Copper Ions ◽  
Specific Detection ◽  
Energy Barriers

TiO 2 ‐Au NPs Heterojunction Arrays for Sensitive and Specific Detection of Copper Ions

2021 ◽  
pp. 2101169
Author(s):  
Liangbin Jia ◽  
Yao Tang ◽  
Ming Li ◽  
Meiyan Zhu ◽  
Xiaotong Dong ◽  
...  
Keyword(s):  
Copper Ions ◽  
Specific Detection ◽  
Au Nps

Tuning Interfacial Energy Barriers in Heterojunctions for Anti‐Interference Sensing

2020 ◽  
pp. 2008604
Author(s):  
Minggang Zhao ◽  
Jiatuo Yu ◽  
Xiaomin Zhang ◽  
Zhengming Li ◽  
Yu Ding ◽  
...  
Keyword(s):  
Interfacial Energy ◽  
Energy Barriers

scholarly journals Effect of the Electron Transport Layer on the Interfacial Energy Barriers and Lifetime of R2R Printed Organic Solar Cell Modules

2018 ◽  
Vol 1 (11) ◽  
pp. 5977-5985 ◽  
Author(s):  
Marja Vilkman ◽  
Kaisa-Leena Väisänen ◽  
Pälvi Apilo ◽  
Riccardo Po ◽  
Marja Välimäki ◽  
...  
Keyword(s):  
Solar Cell ◽  
Electron Transport ◽  
Interfacial Energy ◽  
Organic Solar Cell ◽  
Transport Layer ◽  
Electron Transport Layer ◽  
Energy Barriers ◽  
Cell Modules

64: Rapid, Species-Specific Detection of Uropathogens from Clinical Urine Specimens Using an Electrochemical Microsensor Array

2005 ◽  
Vol 173 (4S) ◽  
pp. 18-18
Author(s):  
Joseph C. Liao ◽  
Mitra Mastali ◽  
David A. Haake ◽  
Bernard M. Churchill
Keyword(s):  
Specific Detection ◽  
Species Specific ◽  
Urine Specimens

The Effect of Copper Ions on Clot Lysis Time in the Fibrinolytic Assay of Streptokinase

1965 ◽  
Vol 13 (02) ◽  
pp. 477-483
Author(s):  
Alwin B. Bogert
Keyword(s):  
Copper Ions ◽  
Borate Buffer ◽  
Fibrinolytic System ◽  
Clot Lysis ◽  
Distilled Water ◽  
Naturally Occurring ◽  
Lysis Time ◽  
Low Levels ◽  
Effect Of Copper ◽  
Clot Lysis Time

SummaryExperiments were conducted to determine why different lots of Borate Buffer reagent affect the clot lysis times obtained in the fibrinolytic assay of Streptokinase. Minerals naturally occurring in distilled water were screened individually to determine their influence on lysis. Copper was found to have a very pronounced effect in this regard on the fibrinolytic system in that low levels reduce the lysis time and high levels increase it.

The role of copper ions in hydrogen peroxide bleaching: Their origin, removal, and effect on pulp quality

TAPPI Journal ◽  
2012 ◽  
Vol 11 (7) ◽  
pp. 37-46 ◽  
Author(s):  
PEDRO E.G. LOUREIRO ◽  
SANDRINE DUARTE ◽  
DMITRY V. EVTUGUIN ◽  
M. GRAÇA V.S. CARVALHO
Keyword(s):  
Hydrogen Peroxide ◽  
Copper Ions ◽  
Peroxide Bleaching ◽  
Metals Removal ◽  
Peroxide Decomposition ◽  
Equipment Corrosion ◽  
And Performance ◽  
And Control ◽  
Main Effects

This study puts particular emphasis on the role of copper ions in the performance of hydrogen peroxide bleaching (P-stage). Owing to their variable levels across the bleaching line due to washing filtrates, bleaching reagents, and equipment corrosion, these ions can play a major role in hydrogen peroxide decomposition and be detrimental to polysaccharide integrity. In this study, a Cu-contaminated D0(EOP)D1 prebleached pulp was subjected to an acidic washing (A-stage) or chelation (Q-stage) before the alkaline P-stage. The objective was to understand the isolated and combined role of copper ions in peroxide bleaching performance. By applying an experimental design, it was possible to identify the main effects of the pretreatment variables on the extent of metals removal and performance of the P-stage. The acid treatment was unsuccessful in terms of complete copper removal, magnesium preservation, and control of hydrogen peroxide consumption in the following P-stage. Increasing reaction temperature and time of the acidic A-stage improved the brightness stability of the D0(EOP)D1AP bleached pulp. The optimum conditions for chelation pretreatment to maximize the brightness gains obtained in the subsequent P-stage with the lowest peroxide consumption were 0.4% diethylenetriaminepentaacetic acid (DTPA), 80ºC, and 4.5 pH.

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

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