Construction of hexagonal boron nitride@polystyrene nanocomposite with high thermal conductivity for thermal management application

2020 ◽  
Vol 46 (6) ◽  
pp. 7595-7601 ◽  
Author(s):  
Weifang Han ◽  
Mengyuan Chen ◽  
Wei Song ◽  
Chunhua Ge ◽  
Xiangdong Zhang
2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000001-00005
Author(s):  
Ya Liu ◽  
Nan Wang ◽  
Lilei Ye ◽  
Abdelhafid Zehri ◽  
Andreas Nylander ◽  
...  

Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m−1 K−1 and 0.485 W m−1 K−1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.


2020 ◽  
Vol 4 (3) ◽  
pp. 116
Author(s):  
Maryam Khalaj ◽  
Sanaz Zarabi Golkhatmi ◽  
Sayed Ali Ahmad Alem ◽  
Kahila Baghchesaraee ◽  
Mahdi Hasanzadeh Azar ◽  
...  

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.


2019 ◽  
Vol 3 (11) ◽  
pp. 2455-2462 ◽  
Author(s):  
Si-Wei Xiong ◽  
Pan Zhang ◽  
Yu Xia ◽  
Pei-Gen Fu ◽  
Jing-Gang Gai

We developed a thermally conductive and antimicrobial QACs@h-BN/LLDPE composites for thermal management of medically electronic devices, it was approximately 100% against both E. coli and S. aureus and its thermal conductivity can reach 1.115 W m−1 K−1.


2019 ◽  
Vol 163 ◽  
pp. 723-729 ◽  
Author(s):  
Haeun Shin ◽  
Seokhoon Ahn ◽  
Doohun Kim ◽  
Jong Kuk Lim ◽  
Chae Bin Kim ◽  
...  

2018 ◽  
Vol 10 (40) ◽  
pp. 34625-34633 ◽  
Author(s):  
O. Hwan Kwon ◽  
Taeyong Ha ◽  
Dong-Gyun Kim ◽  
Byoung Gak Kim ◽  
Yong Seok Kim ◽  
...  

2020 ◽  
Vol 3 (12) ◽  
pp. 12148-12156
Author(s):  
Elisha Mercado ◽  
Chao Yuan ◽  
Yan Zhou ◽  
Jiahan Li ◽  
James H. Edgar ◽  
...  

Small ◽  
2014 ◽  
Vol 11 (14) ◽  
pp. 1655-1659 ◽  
Author(s):  
Zhiqiao Kuang ◽  
Yulong Chen ◽  
Yonglai Lu ◽  
Li Liu ◽  
Shui Hu ◽  
...  

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