Influence of different chemical surface patterns on the dynamic wetting behaviour on flat and silanized silicon wafers during inclining-plate measurements: An experimental investigation with the high-precision drop shape analysis approach

Author(s):  
F. Heib ◽  
W.M. Munief ◽  
S. Ingebrandt ◽  
R. Hempelmann ◽  
M. Schmitt
Sign in / Sign up

Export Citation Format

Share Document