Cost effective routing techniques in 2D mesh NoC using on-chip transmission lines

2019 ◽  
Vol 123 ◽  
pp. 118-129 ◽  
Author(s):  
Dipika Deb ◽  
John Jose ◽  
Shirshendu Das ◽  
Hemangee K. Kapoor
Keyword(s):  
Transmission Lines ◽  
Cost Effective ◽  
Routing Techniques ◽  
On Chip

scholarly journals 3D printed microfluidic lab-on-a-chip device for fiber-based dual beam optical manipulation

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Haoran Wang ◽  
Anton Enders ◽  
John-Alexander Preuss ◽  
Janina Bahnemann ◽  
Alexander Heisterkamp ◽  
...  
Keyword(s):  
Optical Fibers ◽  
Single Cells ◽  
Lab On A Chip ◽  
Cost Effective ◽  
Optical Manipulation ◽  
Hydrodynamic Focusing ◽  
Trapping Region ◽  
Dual Beam ◽  
3D Printed ◽  
On Chip

Abstract3D printing of microfluidic lab-on-a-chip devices enables rapid prototyping of robust and complex structures. In this work, we designed and fabricated a 3D printed lab-on-a-chip device for fiber-based dual beam optical manipulation. The final 3D printed chip offers three key features, such as (1) an optimized fiber channel design for precise alignment of optical fibers, (2) an optically clear window to visualize the trapping region, and (3) a sample channel which facilitates hydrodynamic focusing of samples. A square zig–zag structure incorporated in the sample channel increases the number of particles at the trapping site and focuses the cells and particles during experiments when operating the chip at low Reynolds number. To evaluate the performance of the device for optical manipulation, we implemented on-chip, fiber-based optical trapping of different-sized microscopic particles and performed trap stiffness measurements. In addition, optical stretching of MCF-7 cells was successfully accomplished for the purpose of studying the effects of a cytochalasin metabolite, pyrichalasin H, on cell elasticity. We observed distinct changes in the deformability of single cells treated with pyrichalasin H compared to untreated cells. These results demonstrate that 3D printed microfluidic lab-on-a-chip devices offer a cost-effective and customizable platform for applications in optical manipulation.

scholarly journals TRANSIENT RESPONSE OF A DISTRIBUTED RLC INTERCONNECT BASED ON DIRECT POLE EXTRACTION

2009 ◽  
Vol 18 (07) ◽  
pp. 1263-1285 ◽  
Author(s):  
GUOQING CHEN ◽  
EBY G. FRIEDMAN
Keyword(s):  
Closed Form ◽  
Transient Response ◽  
Transmission Lines ◽  
Average Error ◽  
Proposed Model ◽  
Newton Raphson ◽  
On Chip ◽  
Interconnect Systems ◽  
Interconnect System ◽  
Raphson Method

With higher operating frequencies, transmission lines are required to model global on-chip interconnects. In this paper, an accurate and efficient solution for the transient response at the far end of a transmission line based on a direct pole extraction of the system is proposed. Closed form expressions of the poles are developed for two special interconnect systems: an RC interconnect and an RLC interconnect with zero driver resistance. By performing a system conversion, the poles of an interconnect system with general circuit parameters are solved. The Newton–Raphson method is used to further improve the accuracy of the poles. Based on these poles, closed form expressions for the step and ramp response are determined. Higher accuracy can be obtained with additional pairs of poles. The computational complexity of the model is proportional to the number of pole pairs. With two pairs of poles, the average error of the 50% delay is 1% as compared with Spectre simulations. With ten pairs of poles, the average error of the 10%-to-90% rise time and the overshoots is 2% and 1.9%, respectively. Frequency dependent effects are also successfully included in the proposed method and excellent match is observed between the proposed model and Spectre simulations.

scholarly journals Recent Advances in Hearing Aid Technology-A Review

2021 ◽  
Vol 9 (VI) ◽  
pp. 3427-3429
Author(s):  
Animita Das
Keyword(s):  
Hearing Aids ◽  
Hearing Aid ◽  
Cost Effective ◽  
System On Chip ◽  
Audio Signals ◽  
Technology System ◽  
The People ◽  
Chip Technology ◽  
On Chip ◽  
System 1

Hearing aids are electroacoustic gadgets commonly worn in or behind the ear and are intended to enhance the speech Nowadays hearing aids support various application unlike the traditional ones such that it can act like headphones streaming audio signals from internet-enabled devices connected wirelessly via Bluetooth. This paper aims to review the various advancements in the hearing aid technology. System on chip technology of the microcontroller have been used in various studies to develop and design an effective hearing assistant device and help the people with hearing impairment to lead a normal life. Ten articles have been reviewed for the study and it can be concluded that IoT is the future for an efficient, cost effective hearing assistive system [1]

Wearout and Variation Tolerant Source Synchronous Communication for GALS Network-on-Chip Design

2014 ◽  
pp. 399-419
Author(s):  
Alessandro Strano ◽  
Carles Hernández ◽  
Federico Silla ◽  
Davide Bertozzi
Keyword(s):  
Cost Effective ◽  
Internal Communication ◽  
Synchronous Communication ◽  
Chip Design ◽  
Networks On Chip ◽  
Switch Architecture ◽  
Network Operation ◽  
Placement And Routing ◽  
Delay Variations ◽  
On Chip

In the context of multi-IP chips making use of internal communication paths other than the traditional buses, source synchronous links for use in multi-synchronous Networks-on-Chip (NoCs) are becoming the most vulnerable points for correct network operation and therefore need to be safeguarded against intra-link delay variations and signal misalignments. The intricacy of matching link net attributes during placement and routing and the growing role of process parameter variations in nanoscale silicon technologies, as well as the deterioration due to the ageing of the chip, are the root causes for this. This chapter addresses the challenge of designing a timing variation and layout mismatch tolerant link for synchronizer-based GALS NoCs by implementing a self-calibration mechanism. A timing variation detector senses the misalignment, due to process variation and wearout, between data lines with themselves and with the transmitter clock routed with data in source synchronous links. Then, a suitable delayed replica of the transmitter clock is selected for safe sampling of misaligned data. This chapter proves the robustness of the link in isolation with respect to a detector-less link, also addressing integration issues with the downstream synchronizer and switch architecture, proving the benefits in a realistic experimental setting for cost-effective NoCs.

Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass Ceramic

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001269-001290
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack of improved electrical performance beyond 16nm. As a result, industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this talk, we will present on our efforts in glass interposers fabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. Life MicroFab's APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitchs, in 125 micron thick APEX™ Glass ceramic. We will present (1) on our efforts producing high aspect ratio TGVs in thin (500-250 micron) and ultra thin (250-75 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

scholarly journals Key aspects and feasibility assessment of a proposed wind farm in Jordan

2019 ◽  
Vol 15 (1) ◽  
pp. 97-105 ◽  
Author(s):  
Mohammad Al-Addous ◽  
Motasem Saidan ◽  
Mathhar Bdour ◽  
Zakariya Dalala ◽  
Aiman Albatayneh ◽  
...  
Keyword(s):  
Wind Energy ◽  
Transmission Lines ◽  
Wind Farm ◽  
Cost Effective ◽  
Selling Price ◽  
Technological Advancement ◽  
Energy Potential ◽  
Environmental Consequences ◽  
Feasibility Assessment ◽  
The Interest Rate

Abstract To tackle climate change and secure energy supplies, many countries invest heavily on wind energy as it is a clean source and is becoming more cost effective with the technological advancement and increased capacity per unit installed. The investigation of the availability of wind resources is an essential step of any feasibility study of a wind farm project and is vital for securing financial resources. With this intent, the main aspects for designing a wind farm at Ajloun (north of Jordan) is investigated and wind energy potential is determined based on available wind data. Based on the site characteristic, the required infrastructure is highlighted, including the turbine array layout and the pattern of connections with the external transmission lines. The investigation of the feasibility of the project includes an appraisal of social and environmental consequences of constructing the wind farm project. The results show that the selected location for the wind farm is encouraging and has a promising profit potential. The findings estimate the annual electricity generation of the wind farm at 379659.51 MWh, with a breakeven selling point of around $30.03/MWh, at a highly competitive price. However, with an estimated selling price of $36.65/MWh on average, it will settle the interest rate demanded by the banks that have an internal rate of return of 7%. No major issues with geotechnical and environmental issues were identified with respect to the project.

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