Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material

We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt %. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

Download Full-text

Influence of thermal interface material on thermal performance of InGaAlP thin-film SMD LED mounted on different substrate packages

Microelectronics International ◽

10.1108/mi-05-2017-0027 ◽

2018 ◽

Vol 35 (2) ◽

pp. 104-114 ◽

Cited By ~ 1

Author(s):

Muna E. Raypah ◽

Mutharasu Devarajan ◽

Fauziah Sulaiman

Keyword(s):

Thin Film ◽

Thermal Performance ◽

Thermal Interface Material ◽

Thermal Interface

Download Full-text

Development of High Thermally Conductive Die Attach for TIM Applications

International Symposium on Microelectronics ◽

10.4071/2380-4505-2019.1.000312 ◽

2019 ◽

Vol 2019 (1) ◽

pp. 000312-000315

Author(s):

Maciej Patelka ◽

Sho Ikeda ◽

Koji Sasaki ◽

Hiroki Myodo ◽

Nortisuka Mizumura

Keyword(s):

Thermal Conductivity ◽

High Power ◽

Thermal Interface Material ◽

Thermal Interface ◽

Power Semiconductor ◽

Die Attach ◽

Industry Standards ◽

Thermally Conductive ◽

Low Modulus ◽

Thermal Grease

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.

Download Full-text

Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

Applied Thermal Engineering ◽

10.1016/j.applthermaleng.2019.114686 ◽

2020 ◽

Vol 166 ◽

pp. 114686 ◽

Cited By ~ 2

Author(s):

Liang Chen ◽

Daxiang Deng ◽

Qingsong Huang ◽

Xinhai Xu ◽

Yingxi Xie

Keyword(s):

Thermal Performance ◽

High Power ◽

Vapor Chamber ◽

High Power Led

Download Full-text

Use of 1D mechanical and thermal models to predetermine the heat transferable by a thermal interface material layer in space applications

Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science ◽

10.1177/0954406220915508 ◽

2020 ◽

Vol 234 (17) ◽

pp. 3459-3473

Author(s):

Simon Vandevelde ◽

Alain Daidié ◽

Marc Sartor

Keyword(s):

Heat Transfer ◽

Thermal Performance ◽

Thermal Contact ◽

Interface Layer ◽

Thermal Interface Material ◽

Space Applications ◽

Thermal Interface ◽

Steady State Heat ◽

Steady State Heat Transfer ◽

Assistance Tool

This paper proposes the use of 1D basic models to build a design assistance tool capable of evaluating the heat transfer between a third-level electronic packaging and its support, considering a conventional configuration where a thermal interface material is placed between these two parts. Using this kind of tool early in the design process may facilitate choices concerning geometry and material. The packaging is modelled by a stepped beam (the equipment) and the interface layer by a nonlinear elastic foundation (the thermal interface material). Considering that the electronic equipment bends under the effect of the forces exerted by the fasteners, the tool makes it possible to determine the contact zone remaining operative after deformation, and the pressure distribution at the interface. Mechanical results are then used to calculate the steady-state heat transfer between the equipment and its support, taking into account the diffusion within the equipment and the thermal interface material, and also the thermal contact resistances, the latter being dependent on the contact pressure. A detailed case study is used to illustrate the utility of the approach. The 1D models are exploited to illustrate the interest of the design assistance tool. The influence of different parameters on the thermal performance is studied and a new innovative proposal is analyzed, which could lead to a significant increase in thermal performance.

Download Full-text