Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
2018 ◽
Vol 88-90
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pp. 779-787
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Keyword(s):
1990 ◽
Vol 37
(7)
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pp. 957-961
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Keyword(s):
2016 ◽
Vol 19
(6)
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pp. 441-450
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2000 ◽
Vol 48
(18-19)
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pp. 4725-4733
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1993 ◽
Vol 27
(16)
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pp. 1545-1577
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1990 ◽
Vol 29
(11)
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pp. 888-892
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2010 ◽
Vol 30
(15)
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pp. 3271
Keyword(s):
Keyword(s):
2003 ◽
Vol 2003.16
(0)
◽
pp. 247-248