Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure

2018 ◽  
Vol 88-90 ◽  
pp. 779-787 ◽  
Author(s):  
Dongjin Kim ◽  
Chuantong Chen ◽  
Aiji Suetake ◽  
Chanyang Choe ◽  
Tohru Sugahara ◽  
...  
2016 ◽  
Vol 19 (6) ◽  
pp. 441-450 ◽  
Author(s):  
Yuka Yamada ◽  
Hiroshi Hohjo ◽  
Hidehiko Kimura ◽  
Atsushi Kawamoto ◽  
Tadayoshi Matsumori ◽  
...  

1985 ◽  
Vol 27 (10) ◽  
pp. 778-781
Author(s):  
A. S. Tabatchikov ◽  
A. V. Pryakhin ◽  
L. N. Barmin

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