Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition

For study the damage characteristic of the mullite heat storage ceramic under thermal shock condition, mechanical properties of mullite have been investigated. Under the different cooling mediums (room temperature water, boiling water, air), single and five cycles thermal shock conditions, The article studied the variation of flexural strength and fracture toughness along with temperature. The result show that with the increase of heat transfer coefficient of cooling medium, the bending strength of ceramic decreased. In the 600°C,the ceramic have a maximum bending strength and a minimum fracture toughness. The fracture toughness of precrack specimen is lower than that of non-precrack specimen on the whole. Both Precrack ceramic and non-precrack ceramic have a maximum fracture toughness at 400°C. The study of this paper provides a theoretical basis for the better predicting fracture damage and service life of heat storage ceramic.

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In Situ Displacement Measurement of Flex Package Subject to Thermal Shock Conditions

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.326-328.525 ◽

2006 ◽

Vol 326-328 ◽

pp. 525-528 ◽

Cited By ~ 1

Author(s):

Samson Yoon ◽

Seung Min Cho ◽

Yuri Lee ◽

Bong Tae Han

Keyword(s):

Thermal Cycling ◽

Thermal Shock ◽

Maximum Level ◽

Ramp Rate ◽

Shock Condition ◽

Out Of Plane ◽

Accelerated Thermal Cycling ◽

Test Profiles ◽

Cycling Condition

A unique interferometric system utilizing thermal-conduction loading is developed and implemented to investigate the effect of ramp rates of accelerated test profiles on the thermal deformation of flex package assemblies. The system provides extreme ramp rates to simulate the thermal shock condition with a temperature control much finer than the conventional convection based system can provide. The in-plane and out-of-plane displacements of the flex package are documented through moiré interferometry and Twyman/Green interferometry, respectively. Deformation measured under a thermal shock condition is compared with that under the conventional thermal cycling condition to assess the effect of ramp rates on package deformation. The comparison reveals that a low ramp rate of typical accelerated thermal cycling (ATC) tests causes significant reduction in the maximum level of elastic energy in the package assembly.

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GRAPHITIZED ELECTRODES DESTRUCTION UNDER THE THERMAL SHOCK CONDITION

NOVYE OGNEUPORY (NEW REFRACTORIES) ◽

10.17073/1683-4518-2018-3-57-63 ◽

2018 ◽

pp. 57-63 ◽

Cited By ~ 1

Author(s):

G. D. Apal'kova

Keyword(s):

Thermal Shock ◽

Shock Condition

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Finite Element Analysis on Fracture Mechanics of Al2O3, AlN and Si3N4-based Substrates under Thermal Shock Condition

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202544 ◽

2020 ◽

Author(s):

Yidian Shi ◽

Hu He ◽

Wenhui Zhu

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Fracture Mechanics ◽

Thermal Shock ◽

Element Analysis ◽

Shock Condition

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Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Metals ◽

10.3390/met8080586 ◽

2018 ◽

Vol 8 (8) ◽

pp. 586 ◽

Cited By ~ 3

Author(s):

Junghwan Bang ◽

Dong-Yurl Yu ◽

Ming Yang ◽

Yong-Ho Ko ◽

Jeong-Won Yoon ◽

...

Keyword(s):

Thermal Shock ◽

Solder Joints ◽

Low Cost ◽

Thermal Shock Test ◽

Shock Condition ◽

Joint Reliability ◽

Cu3sn Layer ◽

Kirkendall Voids ◽

Free Solder ◽

Thermomechanical Reliability

The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for automobile application. In this study, a new lead-free solder, Sn-0.7Cu-0.2Cr (wt.%) alloy, was developed. To evaluate the thermomechanical reliability of the new solder alloy in automobile electronics, a thermal shock test was performed. The results show that the presence of Cr in solder inhibits the growth of interfacial Cu3Sn layer and the formation of Kirkendall voids, which effectively improves the joint reliability under intense thermal shock condition compared with the commercial SAC305 and SC07 solders. Specifically, the shear strength of the Sn-0.7Cu-0.2Cr/Cu solder joints was higher by 23% and 44% than that of SAC305 and SC07 solder joints after 2000 cycles of thermal shock at 1 m/s shear speed.

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Fabrication of Cu@Sn Core-Shell Structured Particles and the Application in High Remelting Temperature Bonding

Materials Science Forum ◽

10.4028/www.scientific.net/msf.878.3 ◽

2016 ◽

Vol 878 ◽

pp. 3-7 ◽

Cited By ~ 2

Author(s):

Tian Qi Hu ◽

Hong Tao Chen ◽

Ming Yu Li

Keyword(s):

Electrical Conductivity ◽

High Temperature ◽

Thermal Shock ◽

Harsh Environments ◽

Core Shell ◽

Power Devices ◽

Reflow Soldering ◽

Bonding Material ◽

Die Attach ◽

Reflow Temperature

A novel solder bonding material for high-temperature applications based on Cu@Sn core-shell structured particles was developed, and the fabricated Cu@Sn particles were compressed into preforms for die attachment. The reflow temperature for this bonding material could reached as low as 260°C due to the low melting temperature of the outer Sn layer. However, after reflow soldering, the resulting interconnections can withstand a high temperature of at least 415°C, outer Sn layer completely transformed into Cu-Sn intermetallic compounds (IMCs) with high remelting temperatures. The formed bondlines exhibit good electrical conductivity due to the low porosity and the embedded Cu particles in the interconnections. Furthermore, the interconnections also exhibit excellent reliability under thermal shock cycling from-55°C to 200°C. This die attach material is suitable for power devices operating under high temperatures or other harsh environments.

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