scholarly journals Recent advances in compact repetitive high-power Marx generators

2019 ◽  
Vol 37 (01) ◽  
pp. 110-121 ◽  
Author(s):  
Falun Song ◽  
Fei Li ◽  
Beizhen Zhang ◽  
Mingdong Zhu ◽  
Chunxia Li ◽  
...  

AbstractThis paper introduces recent activities on Marx-based compact repetitive pulsed power generators at the Institute of Applied Electronics (IAE), China Academy of Engineering Physics (CAEP), over the period 2010–2018. A characteristic feature of the generators described is the use of a simplified bipolar charged Marx circuit, in which the normal isolation resistors or inductors to ground are removed to make the circuit simpler. Several pulse-forming modules developed to generate a 100 ns square wave output are introduced, including thin-film dielectric lines of different structures, a pulse-forming line based on a Printed Circuit Board, and non-uniform pulse-forming networks. A compact repetitive three-electrode spark gap switch with low-jitter, high-voltage, and high-current was developed and is used in the generators. A positive and negative series resonant constant current power supply with high precision and high power is introduced. As an important part of the repetitive pulse power generator, a lower jitter pulse trigger source is introduced. Several typical high-power repetitive pulsed power generators developed at IAE are introduced including a 30 GW low-impedance Marx generator, a compact square-wave pulse generator based on Kapton-film dielectric Blumlein line, a 20 GW high pulse-energy repetitive PFN-Marx generator, and a coaxial Marx generator based on ceramic capacitors. The research of key technologies and their development status are discussed, which can provide a reference for the future development and application of miniaturization of compact and repetitive Marx generators.

Nano Research ◽  
2014 ◽  
Vol 8 (3) ◽  
pp. 722-730 ◽  
Author(s):  
Changbao Han ◽  
Chi Zhang ◽  
Wei Tang ◽  
Xiaohui Li ◽  
Zhong Lin Wang

2012 ◽  
Vol 2012 (1) ◽  
pp. 001038-001045 ◽  
Author(s):  
Sheng-Tsai Wu ◽  
John H. Lau ◽  
Heng-Chieh Chien ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
...  

In this study, the nonlinear thermal stress distributions at the Cu-low-k pads of Moore's law chips and creep strain energy density per cycle at the solder joints of a 3D IC integration system-in-package (SiP) are investigated. At the same time, the warpage of the TSV interposer and reliability assessment of solder joints in the architecture is examined. The analyzed structure comprises one PCB (printed circuit board), one BT (bismaleimide triazene) substrate, one interposer with through silicon vias (TSVs), two DRAM (dynamic random access memory) chips and one high power ASIC (application specific integrated circuit) chip. The high power chip and DRAM chips are supported, respectively on the top-side and bottom-side of the Cu-filled TSV interposer.


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