Printable semiconductors for flexible electronics

AccessScience ◽  
2015 ◽  
Keyword(s):  
Flexible Electronics

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

scholarly journals Flexible Electronics: Flexible, Strong, Anisotropic Wood‐Derived Conductive Circuit (Adv. Sustainable Syst. 6/2021)

2021 ◽  
Vol 5 (6) ◽  
pp. 2170011
Author(s):  
Hao Sun ◽  
Tong Ji ◽  
Hongjie Bi ◽  
Xin Lin ◽  
Chen Chen ◽  
...  
Keyword(s):  
Flexible Electronics

scholarly journals Ultralow magnetostrictive flexible ferromagnetic nanowires

Nanoscale ◽  
2021 ◽  
Author(s):  
Giuseppe Muscas ◽  
Petra Jönsson ◽  
Ismael Garcia Serrano ◽  
Örjan Vallin ◽  
M. Venkata Kamalakar
Keyword(s):  
Flexible Electronics ◽  
Magnetic Nanowires ◽  
Wearable Technologies ◽  
Ferromagnetic Nanowires ◽  
Core Components

The integration of magneto-electric and spintronic sensors to flexible electronics presents massive potential for advancing flexible and wearable technologies. Magnetic nanowires are core components for building such devices. Therefore, realizing...

scholarly journals Integrating flexible electronics for pulsed electric field delivery in a vascularized 3D glioblastoma model

2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Marie C. Lefevre ◽  
Gerwin Dijk ◽  
Attila Kaszas ◽  
Martin Baca ◽  
David Moreau ◽  
...  
Keyword(s):  
Electric Field ◽  
Electric Fields ◽  
Flexible Electronics ◽  
Soft Tissues ◽  
Multiphoton Microscopy ◽  
Membrane Integrity ◽  
Tumor Model ◽  
Pulsed Electric Fields ◽  
In Ovo ◽  
Cell Membrane Integrity

AbstractGlioblastoma is a highly aggressive brain tumor, very invasive and thus difficult to eradicate with standard oncology therapies. Bioelectric treatments based on pulsed electric fields have proven to be a successful method to treat cancerous tissues. However, they rely on stiff electrodes, which cause acute and chronic injuries, especially in soft tissues like the brain. Here we demonstrate the feasibility of delivering pulsed electric fields with flexible electronics using an in ovo vascularized tumor model. We show with fluorescence widefield and multiphoton microscopy that pulsed electric fields induce vasoconstriction of blood vessels and evoke calcium signals in vascularized glioblastoma spheroids stably expressing a genetically encoded fluorescence reporter. Simulations of the electric field delivery are compared with the measured influence of electric field effects on cell membrane integrity in exposed tumor cells. Our results confirm the feasibility of flexible electronics as a means of delivering intense pulsed electric fields to tumors in an intravital 3D vascularized model of human glioblastoma.

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

Liquid metal-based nanocomposite materials: Fabrication technology and applications

Nanoscale ◽  
2021 ◽  
Author(s):  
Hiroki Ota ◽  
Nyamjargal Ochirkhuyag ◽  
Ryosuke Matsuda ◽  
Zihao Song ◽  
Fumika Nakamura ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Liquid Metals ◽  
Nanocomposite Materials ◽  
Fabrication Technology

Research on liquid metals has been steadily garnering more interest in recent times because the properties of these metals are conducive to flexible electronics applications; further, these metals are in...

Double-network hydrogel with adjustable surface morphology and multifunctional integration for flexible strain sensors

Soft Matter ◽  
2021 ◽  
Author(s):  
Yang Yu ◽  
Fengjin Xie ◽  
Xinpei Gao ◽  
Liqiang Zheng
Keyword(s):  
Surface Morphology ◽  
Flexible Electronics ◽  
High Performance ◽  
Strain Sensors ◽  
Next Generation ◽  
Double Network ◽  
Conductive Hydrogels

The next generation of high-performance flexible electronics has put forward new demands to the development of ionic conductive hydrogels. In recent years, many efforts have been made toward developing double-network...

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