scholarly journals Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

RSC Advances ◽  
2021 ◽  
Vol 11 (62) ◽  
pp. 39153-39168
Author(s):  
Bo Wu ◽  
Baizhao Tan ◽  
Guizhen Tan ◽  
Ming Zeng ◽  
Jinyi Luo ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Gold Plating ◽  
Plating Bath ◽  
Cu Substrate ◽  
Black Pad ◽  
Electroless Gold

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

scholarly journals Electroless Gold Plating Using Erythorbic Acid as Reducing Agent

2006 ◽  
Vol 74 (6) ◽  
pp. 479-483 ◽  
Author(s):  
Tadashi KURASHINA ◽  
Hiroshi NISHINAKAYAMA ◽  
Norio KANEKO ◽  
Naoyuki SHINOHARA ◽  
Hidemi NAWAFUNE
Keyword(s):  
Reducing Agent ◽  
Gold Plating ◽  
Erythorbic Acid ◽  
Electroless Gold

scholarly journals Electrochemical Behavior of Electroless Gold Plating with Ascorbic Acid as a Reducing Agent.

1991 ◽  
Vol 42 (7) ◽  
pp. 729-735 ◽  
Author(s):  
Masaru KATO ◽  
Keiko NIIKURA ◽  
Shigetaka HOSHINO ◽  
Izumi OHNO
Keyword(s):  
Ascorbic Acid ◽  
Electrochemical Behavior ◽  
Reducing Agent ◽  
Gold Plating ◽  
Electroless Gold

The Effects of Additives on the Properties of Non-Cyanide Electroless Gold Plating Deposition

2014 ◽  
Vol 1030-1032 ◽  
pp. 205-208
Author(s):  
Jiao Qu ◽  
Shi Feng Huang ◽  
Mei Juan Zhou ◽  
Lan Li ◽  
Chao Li ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Polyethylene Glycol ◽  
Surface Morphology ◽  
Deposition Rate ◽  
Adhesive Force ◽  
Optimal Concentration ◽  
Coating Properties ◽  
Gold Plating ◽  
Electroless Gold

In order to improve the non-cyanide electroless gold plating deposition performance, the effects of the kinds of additives as well as its concentration on the deposition performance were investigated. The appearance inspection, deposition rate, adhesive force, surface morphology and corrosion resistance were evaluated. The results showed that the introduction of appropriate additives did improve the coating properties. The optimal concentration of polyethylene glycol and polycrylamide were 0.6~1.0 g·L-1 and 1.0~1.5 g·L-1, respectively. The corrosion resistance of the coating deposited in baths containing polyacrylamide was best.

scholarly journals The Behavior of Electroless Gold Plating Baths Using Hydrazine Compound as Reducing Agent.

2002 ◽  
Vol 5 (1) ◽  
pp. 72-74
Author(s):  
Masako HIRATSUKA ◽  
Tadashi KURASHINA ◽  
Hidemi NAWAFUNE
Keyword(s):  
Reducing Agent ◽  
Gold Plating ◽  
Electroless Gold

scholarly journals Electroless deposition of nickel boron coatings using morpholine borane as a reducing agent

Chemija ◽  
2020 ◽  
Vol 31 (1) ◽  
Author(s):  
Zita Sukackienė ◽  
Kornelija Antanavičiūtė ◽  
Jūratė Vaičiūnienė ◽  
Loreta Tamašauskaitė-Tamašiūnaitė ◽  
Arnas Naujokaitis ◽  
...  
Keyword(s):  
Deposition Rate ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Plating Bath ◽  
Plating Solution

Nickel boron (NiB) coatings were deposited onto copper using a nickelglycine (Ni-Gly) plating solution and morpholine borane (MB) as a reducing agent. It has been determined that using MB as a reducing agent in the Ni-Gly plating solution produces NiB coatings, which exhibit typical cauliflower-like textures. The deposition rate of the NiB coatings and their composition depend on the concentrations of the reducing agent (MB) and the ligand (Gly), in addition to the pH and temperature of the plating solution. The highest deposition rate (3.42 mg cm–2 h–1) of the NiB coating was obtained when the plating bath was operated at pH 5 and 60°C temperature. Using this method, NiB coatings containing 10–20 at.% of boron can be obtained.

scholarly journals A Very Stable Non-cyanide Electroless Gold Plating Bath Using Thiourea and hydroquinone as a Cooperating Double Reductant System.

1998 ◽  
Vol 49 (12) ◽  
pp. 1298-1304 ◽  
Author(s):  
Takashi INOUE ◽  
Setsuo ANDO ◽  
Jiro USHIO ◽  
Hiroaki OKUDAIRA ◽  
Hiroko TAKEHARA ◽  
...  
Keyword(s):  
Gold Plating ◽  
Plating Bath ◽  
Electroless Gold

Comparison of corrosion resistance properties of Ni-P and Ni-W-P coatings obtained by electroless deposition

2020 ◽  
Vol 25 (2) ◽  
pp. 66-71
Author(s):  
A.B. Drovosekov
Keyword(s):  
Corrosion Resistance ◽  
Sulfuric Acid ◽  
Electroless Deposition ◽  
Corrosion Damage ◽  
Electrochemical Activity ◽  
High Porosity ◽  
Environment Analysis ◽  
Damage Degree ◽  
Lower Porosity ◽  
Electroless Coatings

Corrosion resistance properties, such as porosity, stability in the atmosphere of NaCl mist, and anodic electrochemical activity in a sulfuric acid solution are studied and compared for Ni-W-P and Ni-P coatings obtained by electroless deposition. The studied coatings were obtained from solutions with glycine as the main ligand and contained 10.2 to 15.6 at.% of phosphorus and up to 3.3 at.% of tungsten. It is shown that Ni-W-P coatings with a tungsten content of 2.3 to 3.3 at.% and a thickness of 15 μm have a significantly lower porosity as compared with nickel-phosphorus coatings of the same thickness. Also, significantly better stability of Ni-W-P coatings in a NaCl mist atmosphere was observed, their corrosion damage degree is less than that of Ni-P coatings, and relatively little depends on the duration of exposure in a corrosive environment. Analysis of anodic polarization curves showed an almost similar electrochemical activity upon dissolution of Ni-P and Ni-W-P coatings in sulfuric acid. Both these types of electroless coatings showed a markedly better tendency to anodic dissolution than pure nickel. Taking into account the obtained experimental data, a conclusion is made as to the better protective characteristics of Ni-W-P coatings in comparison with nickel-phosphorus coatings. The main reason of the inferior protective properties of Ni-P coatings is their relatively high porosity.

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