scholarly journals Numerical Study of the Thermal Model on High Uniformity Temperature Test Platform

2019 ◽  
Vol 256 ◽  
pp. 03003
Author(s):  
Zijuan Wang ◽  
Ying Zhou ◽  
Han Xiao ◽  
Shao Jingyi

The surface temperature uniformity of a test platform with an effective test area of 600 mm × 600 mm was numerically studied. The conductive heat transfer model for the test platform and the device under test (DUT) installed on the surface was established in the present work, as well as the radiation heat transfer model from the platform surface to the background temperature. The platform surface was divided into 5 or 9 regions where heated independently to make the surface temperature consistent. The temperature uniformity of these two partition designs was compared. The result shows that the 9 regions design has higher temperature uniformity at both target temperatures of -10°C and +45°C.

2016 ◽  
Vol 289 ◽  
pp. 371-380 ◽  
Author(s):  
Alexander Yu. Chebotarev ◽  
Andrey E. Kovtanyuk ◽  
Gleb V. Grenkin ◽  
Nikolai D. Botkin ◽  
Karl-Heinz Hoffmann

2021 ◽  
Author(s):  
Vassilis Z. Antonopoulos ◽  
Soultana K. Gianniou

Abstract The knowledge of micrometeorological conditions on water surface of impoundments is crucial for the better modeling of the temperature and water quality parameters distribution in the water body and against the climatic changes. Water temperature distribution is an important factor that affects most physical, chemical and biological processes and reactions occurring in lakes. In this work, different processes of water surface temperature of lake’s estimation based on the energy balance method are considered. The daily meteorological data and the simulation results of energy balance components from an integrated heat transfer model for two complete years as well as the lake’s characteristics for Vegoritis lake in northern Greece were used is this analysis.The simulation results of energy balance components from a heat transfer model are considered as the reference and more accurate procedure to estimate water surface temperature. These results are used to compare the other processes. The examined processes include a) models of heat storage changes in relationship to net radiation (Qt(Rn) values, b) net radiation estimation with different approaches, as the process of Slob’s equation with adjusted coefficients to lake data, and c) ANNs models with different architecture and input variables. The results show that the model of heat balance describes the water surface temperature with high accuracy (r2=0.916, RMSE=2.422oC). The ANN(5,6,1) model in which Tsw(i-1) is incorporated in the input variables was considered the better of all other ANN structures (r2=0.995, RMSE=0.490oC). The use of different approaches for simulating net radiation (Rn) and Qt(Rn) in the equation of water surface temperature gives results with lower accuracy.


2012 ◽  
Vol 457-458 ◽  
pp. 138-141
Author(s):  
Yi Wang ◽  
Xin Jian Ma

This paper describes the new development of the breakout prediction technique based a heat transfer model. The model aims to minimize the variation in surface temperature. The breakout prediction system of slab continuous casting has been analyzed with consideration of the principles, model and thermocouples installation. The system has been designed and implemented in the steel plants.


2020 ◽  
Vol 16 (1) ◽  
pp. 224-232
Author(s):  
Kabita Luitel ◽  
Dil Bahadur Gurung ◽  
Harihar Khanal ◽  
Kedar Nath Uprety

1999 ◽  
Vol 122 (2) ◽  
pp. 107-114 ◽  
Author(s):  
Sanjeev B. Sathe ◽  
Bahgat G. Sammakia

This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By attaching a heat sink directly to the chip and using a thin layer of high thermal conductivity adhesive, a very low internal thermal resistance can be achieved. The package is attached to an organic card and placed vertically in a channel. A three-dimensional conjugate heat transfer model is used, accounting for conduction and radiation in the package and card and convection in the surrounding air. A simplified turbulence model is developed to predict temperatures in the low Re turbulence regime. A parametric study is performed to evaluate the effects of card design, air velocities, interconnect thermal conductivities and thermal radiation on the chip junction temperatures. An experimental study was also conducted to verify the model. Even though the geometry is highly complex due to the multilayer construction of the module and the card, agreement between the model and the experimental measurement is excellent. It was shown that radiation heat transfer can be an equally significant mode as convection in the natural convection regime. [S1043-7398(00)01302-5]


Author(s):  
Kazuya Takabatake ◽  
Xiaosong Sun ◽  
Mikio Sakai ◽  
Dimitrios Pavlidis ◽  
Jiansheng Xiang ◽  
...  

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