Investigation on a NiFe alloy with a coefficient of thermal expansion matching the one of silicon

2008 ◽  
Vol 103 (7) ◽  
pp. 07E731
Author(s):  
Matthias Bedenbecker ◽  
Hans H. Gatzen
2020 ◽  
Vol 64 (4) ◽  
pp. 273-278
Author(s):  
Olga Shypul ◽  
Vitalii Myntiuk

This paper is concerned with the mathematical modeling of transient thermal elastic problem involving a layered cylinder with a varied coefficient of thermal expansion and powered by a heat flux from an external surfaces. All material's properties are the same for each cylinder's layers, besides the coefficient of linear thermal expansion which is varied and corresponds to hardened and unhardened layers. An obtained solution is a transient state of a heat transfer for the one-dimensional temperature change under the action of heat flux in continuous time. Cumbersome analytical solutions are converted into simple approximation. They are used to solve the inverse problems of the thermal stressed state–determining the time of action of the heat flux to achieve the specified maximum temperature or stress. Some numerical results for the stress distributions are shown in figures.


2010 ◽  
Vol 44-47 ◽  
pp. 2950-2953
Author(s):  
Sheng Yi Chang ◽  
Hsi Hsun Tsai ◽  
Sheng Ching Wang

The bonding glue is well used in packaging of the opto-electronic elements. The light paths of the elements are aligned accurately before bonding, the coefficient of thermal expansion of bonding glue is much more large than the one of silicon based optoelectronic elements, the light paths of the elements are thus misalignment after the bonding. The silica filler is usually mixed into the bonding glue for lowering the coefficient of thermal expansion. In this paper, the ceramic powder of the ZrW2O8 with negative coefficient of thermal expansion is thus mixed the commercial bonding glue for deriving of the extra low dilation adhesion. The thermal expansion of the composite bonding glue with negative coefficient of thermal expansion fillers is measured accurately to compare with the filler of silica powder. The results show that a composite glue with the very low coefficient of thermal expansion is therefore acquired for packaging of optoelectronic elements.


Alloy Digest ◽  
1987 ◽  
Vol 36 (8) ◽  

Abstract NILO alloy 36 is a binary iron-nickel alloy having a very low and essentially constant coefficient of thermal expansion at atmospheric temperatures. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-79. Producer or source: Inco Alloys International Inc..


Alloy Digest ◽  
1971 ◽  
Vol 20 (1) ◽  

Abstract UNISPAN LR35 offers the lowest coefficient of thermal expansion of any alloy now available. It is a low residual modification of UNISPAN 36 for fully achieving the demanding operational level of precision equipment. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and surface treatment. Filing Code: Fe-46. Producer or source: Cyclops Corporation.


Alloy Digest ◽  
1998 ◽  
Vol 47 (4) ◽  

Abstract Deltalloy 4032 has good machinability and drilling characteristics when using single-point or multispindle screw machines and an excellent surface finish using polycrystalline or carbide tooling. The alloy demonstrates superior wear resistance and may eliminate the need for hard coat anodizing. Deltalloy 4032 is characterized by high strength and a low coefficient of thermal expansion. This datasheet provides information on composition, physical properties, and tensile properties. It also includes information on corrosion and wear resistance as well as machining and surface treatment. Filing Code: AL-347. Producer or source: ALCOA Wire, Rod & Bar Division.


Alloy Digest ◽  
1960 ◽  
Vol 9 (2) ◽  

Abstract RED X-20 is a heat treatable hypereutectic aluminum-silicon alloy with excellent wear resistance and a very low coefficient of thermal expansion. This datasheet provides information on composition, physical properties, hardness, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as casting, heat treating, machining, and joining. Filing Code: Al-89. Producer or source: Apex Smelting Company.


Alloy Digest ◽  
1990 ◽  
Vol 39 (7) ◽  

Abstract AA 4032 has a comparatively low coefficient of thermal expansion and good forgeability. The alloy takes on an attractive dark gray appearance when anodized which may be desirable in architectural applications. This datasheet provides information on composition, physical properties, hardness, tensile properties, and shear strength as well as fatigue. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Al-305. Producer or source: Various aluminum companies.


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