In a previous paper,1we showed, with a microwave quality factor (Q) measurement, that in the X band and with alumina substrates, thick film losses are not worse than thin film losses when the inks are screened then etched, and when they have copper oxide as adhesive layer and gold or copper as metal powder.Here, we extend this study to show that, our experimental results being in good agreement with theory, a simple D.C. resistivity measurement is sufficient to characterize these MIC'S metallizations and is as suitable as a microwave Q measurement. We also show that the nature of the ground plane cannot be neglected.
Experimental and Theoretical Characterization of Thick and Thin Films for Microwave Uses on 99.6% Alumina Substrates