Screen Printing Strategy for Investigation of Spectrophotometric Properties of Modified Thick Films of Zirconium Oxide (ZrO2): Tin Oxide (SnO2) Composites

There are numerous methods has been investigated and developed for the preparation of thin and thick films. Thick film technology is utilized for the production of electronic devices like surface mount devices, in the preparation of hybrid integrated circuit, in the formulation of heating elements, in the construction of integrated passive devices and sensors. Pure tin oxide (SnO2) and composite 1%, 3%, 5%, 7% and 9 % zirconium oxide (ZrO2) thick films of dimensions 2 cm×1 cm incorporated into pure tin oxide (SnO2) were prepared with standard screen printing method. All samples were fabricated on glass support. The thick films were subjected to drying and firing at 5000C at 5 hours in muffle furnace. Thick films of tin oxide (SnO2) and composite 1%, 3%, 5%, 7% and 9 % zirconium oxide (ZrO2) incorporated into pure tin oxide (SnO2) were checked for Scanning Electron Microscopy (S.E.M), Energy Dispersive X-ray Spectroscopy (E.D.A.X), X-ray diffraction (X.R.D), Fourier Transform infra-Red (F.T.I.R) and Ultra-Violet-Visible spectroscopy (U.V) for surface morphology, elemental analysis, crystalline phases of films, vibrational and spectrophotometric study respectively. In this research paper the spectrophotometric parameters such as absorbance and absorption coefficient with pure and compositional thick films were a part of investigation and surveillance.

Fatigue Life Prediction and Verification for HIC Hermetical Sealing under Random Vibration Loading

This work aims to predict fatigue life of hybrid integrated circuit (HIC) hermetical metal sealing structure mounted on PCB under random vibration loading. The prediction method consists of following steps. Firstly, finite-element model was developed to obtain model parameters (including natural frequencies and mode shapes) and power spectral density (PSD) of the critical part of sealing structure by ANSYS workbench. Secondly, modal test and random vibration test were conducted to verify the results of simulation. Thirdly, the Von Mises stress PSD was transformed into time-history data through inverse Fourier transform with Matlab program after calculating from the FEA results. The rainflow-counting algorithm was employed to evaluate cumulative damages of the critical part. The material’s S-N curve, Palmgren-Miner’s damage accumulation rule and rainflow-counting algorithm were used to predict fatigue life. A specially designed fixture and board with heat sink were used in the experiment to verify the first five mode shapes and response spectrum of the six critical points with hammer excitation. The calculation result of in this study is 70.3 hours which could be a reference for structural design of hybrid integrated circuit hermetical metal sealing under vibration conditions.

A multi-scale PDMS fabrication strategy to bridge the size mismatch between integrated circuits and microfluidics

We have developed a multi-scale PDMS fabrication strategy that can straddle the length scales of hybrid integrated circuit (IC)/microfluidic chips. This approach allows multiple millimeter-scale ICs, with micrometer-scale fluid channels built directly above the IC's surface, to be incorporated into a centimeter-sized PDMS chip.