Analysis of Crosstalk in High Speed and High Frequency Printed Circuit Board

Author(s):  
Avali Ghosh ◽  
Sisir Kumar Das ◽  
Annapurna Das
2012 ◽  
Vol 2012 (1) ◽  
pp. 000628-000637
Author(s):  
Jerry Aguirre ◽  
Marcos Vargas ◽  
Paul Garland

A full-wave electromagnetic analysis for characterizing typical electromagnetic shielding practices in ceramic electronic packages is presented. Typically in printed circuit board emissions, the power plane emissions, and exposed surface nets are considered, however, the signal interconnect from the PCB to an electronic package can also be a significant source of radiation and hence an electromagnetic interference (EMI) issue. In this paper we describe electromagnetic radiation mechanisms resulting from high-frequency and high-speed applications in ceramic multilayer electronic packages and review the typical practice of implementing via fences to mitigate and reduce the EMI risk within a package substrate and also for the case when the package is part of a package/board configuration.


2013 ◽  
Vol 333-335 ◽  
pp. 465-471
Author(s):  
Chuan Liu ◽  
Zhi Chao Huang ◽  
Peng Wu ◽  
Lei Chen ◽  
Wei Wang

Many applications in Power communication system have a demand of adjustable transmission time delay of high-speed signal. In sequential logic circuit, the control of transmission time delay of high-speed signal can effectively improve the accuracy of clock sampling, as a result, satisfy the constraints between clock signal and periodic data. A method of equivalent sampling based on printed circuit board (PCB) is provided in the article, it realizes equivalent sampling of the data by fixing a group of clock signal delay, thus, increase the accuracy of sampling.


2019 ◽  
Vol 13 (6) ◽  
pp. 805-811 ◽  
Author(s):  
Neethu Salim ◽  
Saurabh Prakash Nikam ◽  
Saumitra Pal ◽  
Ashok Krishnrao Wankhede ◽  
Baylon Godfrey Fernandes

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