Mitigation of Electro Magnetic Interference by Using C-Shaped Composite Cylindrical Device

The extremely low-frequency (ELF) and its corresponding electromagnetic field influences the yield of CMOS processes in the foundry, especially for high-end equipment such as scanning electron microscopy (SEM) systems, transmission electron microscopy (TEM) systems, focused ion beam (FIB) systems, and electron beam lithography (E-Beam) systems. There are several techniques to mitigate electromagnetic interference (EMI), among which active shielding systems and passive shielding methods are widely used. An active shielding system is used to generate an internal electromagnetic field to reduce the detected external electromagnetic field in electric coils with the help of the current. Although the active shielding system reduces the EMI impact, it induces an internal electromagnetic field that could affect the function of nearby tools and/or high-performance probes. Therefore, in this study, we have used a C-shaped cylindrical device combined with an active shielding system and passive shielding techniques to reduce EMI for online monitoring and to overcome the aforementioned issues. In this study, the active shielding system was wrapped with a permalloy composite material (i.e., a composite of nickel and iron alloy) as a tubular device. A C-shaped opening was made on the tubular structure vertically or horizontally to guide the propagation of the electromagnetic field. This C-shaped cylindrical device further reduced electromagnetic noise up to −5.06 dB and redirected the electromagnetic field toward the opening direction on the cylindrical device. The results demonstrated a practical reduction of the electromagnetic field.

Laplace Transform for Finite Element Analysis of Electromagnetic Interferences in Underground Metallic Structures

A numerical methodology is proposed for the calculation of transient electromagnetic interference induced by overhead high-voltage power lines in metallic structures buried in soil—pipelines for oil or gas transportation. A series of 2D finite element simulations was employed to sample the harmonic response of a given geometry section. The numerical inverse Laplace transform of the results allowed obtaining the time domain evolution of the induced voltages and currents in the buried conductors, for any given condition of the power line.

DEVELOPMENT OF CALIBRATION MODULES FOR A COMPLEX OF ASSESSING THE IMPACT OF ELECTROMAGNETIC INTERFERENCE ON ELECTRONIC DEVICES

В современном мире при стремлении человечества к миниатюризации электротехнической и радиоэлектронной продукции без потери технических характеристик устройств, наряду с их расширением одной из значимых проблем является влияние электромагнитных помех на стабильное функционирование устройств. Представлены модули калибровки, используемые в программно-аппаратном комплексе (ПАК), который позволяет произвести оценку влияния электромагнитных помех (ЭМП) на электронные средства. Практическое искажение сигналов неизбежно, так как причиной помех может стать взаимное влияние элементов печатной платы (ПП) друг на друга, а также конфигурация самого рисунка дорожек ПП и её топологии. Рассматриваются модули, позволяющие выявить ряд ошибок по ранее полученным результатам и обеспечить калибровку комплекса с целью повышения точности оценки влияния самоиндукции и импеданса линии передач на вносимые искажения сигнала при различных конфигурациях трассировки печатной платы. Применение данного программно-аппаратного комплекса позволяет значительно сократить время, необходимое на разработку устройства и комплекс испытаний, что, в свою очередь, снижает финансовую нагрузку на выпуск единицы продукции, поскольку позволяет выявить недостатки устройств на стадии макетирования электротехнической продукции In the modern world, with the desire of all mankind to miniaturize electrical products without loss of power, one of the significant problems is the influence of electromagnetic interference on the stable functioning of devices. This article presents the calibration modules used in the software and hardware complex (SHC), which allows one to assess the influence of electromagnetic interference (EMI) on electronic means. The practical distortion of signals is inevitable since the cause of interference can be their mutual influence on each other, as well as the configuration of the printed circuit board pattern itself. The paper considers modules that allow identifying a number of errors based on previously obtained results and providing calibration of the complex in order to increase the accuracy of estimating the effect of self-induction and transmission line impedance on the introduced signal distortion in various configurations of the PCB trace. The use of this software and hardware complex can significantly reduce the development time and conduct tests that require financial costs since it allows one to conduct a number of experiments at the stage of prototyping electrical products