A novel solder joints inspection method using curvature and geometry features in high-density flexible IC substrates surface mount technology

2021 ◽  
Author(s):  
Yong Zeng ◽  
Yueming Hu ◽  
Xiaohan Zhang ◽  
Zhongliang Luo ◽  
Xiaohui Wei
Keyword(s):  
Solder Joints ◽  
High Density ◽  
Surface Mount Technology ◽  
Inspection Method ◽  
Surface Mount

Solder Joint Formation in Surface Mount Technology—Part II: Design

1990 ◽  
Vol 112 (3) ◽  
pp. 219-222 ◽  
Author(s):  
S. M. Heinrich ◽  
N. J. Nigro ◽  
A. F. Elkouh ◽  
P. S. Lee
Keyword(s):  
Surface Tension ◽  
Solder Joint ◽  
Solder Joints ◽  
Cross Sectional Area ◽  
Surface Mount Technology ◽  
Sectional Area ◽  
Cross Sectional ◽  
Joint Formation ◽  
Surface Mount ◽  
Surface Tension Model

In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension model, the advantage of these dimensionless curves is that they may be used for arbitrary values of solder density and surface tension. The range of applicability of previously developed approximate formulae for predicting joint dimensions is also investigated. A simple example problem is included to illustrate the use of both the design curves and the approximate formulae.

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

1994 ◽  
Vol 116 (2) ◽  
pp. 89-91 ◽  
Author(s):  
M. K. Schwiebert
Keyword(s):  
Simple Model ◽  
Solder Joint ◽  
Solder Joints ◽  
Reaction Force ◽  
Molten Solder ◽  
Surface Mount Technology ◽  
Surface Mount

This study considers the influence of solder joint voiding and seating plane stability on the lead standoffs of surface mount technology (SMT) solder joints. A model is presented for approximating the reaction force generated by a gas-filled void in molten solder which is compressed under an SMT lead. Seating plane stability is defined with a simple model. The lead standoffs of a component with an unstable seating plane are sensitive to small forces. For some SMT components, the reaction force generated by compressed voids in molten solder can tilt or rock a component, resulting in lead standoffs much greater than the measured lead coplanarity.

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

1991 ◽  
Vol 113 (2) ◽  
pp. 178-185 ◽  
Author(s):  
D. T. Read ◽  
G. K. Lucey
Keyword(s):  
Finite Element ◽  
Solder Joints ◽  
Vision System ◽  
Field Performance ◽  
Surface Mount Technology ◽  
Element Analysis ◽  
Element Mesh ◽  
X Ray ◽  
Surface Mount ◽  
Inspection Data

The ultimate goal of this work is an improved method to assess the significance of anomalies in surface mount technology (SMT) solder joints, by relating them to field performance and reliability. The fitness-for-purpose approach can be applied to SMT solder joints by relating specific characteristics or flaw indications in individual solder joints to their likelihood of failure, through finite element analysis. An effort is underway to automate the finite element modeling of actual solder joints by generating meshes from optical and X-ray inspection data in the form of thousands of surface points. Computer programs have been written to convert these surface points to finite element meshes. Two trial data sets have been meshed, one from an X-ray laminography system and one from a machine vision system.

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