IEEE Transactions on Components Packaging and Manufacturing Technology
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A Wettability-mediated Microdroplet under Electrowetting Effect for Hotspot Cooling

2022 ◽  
pp. 1-1
Author(s):  
Israr Ahmad ◽  
Atul Ranjan ◽  
Manabendra Pathak ◽  
Mohd Kaleem Khan

Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards

2022 ◽  
pp. 1-1
Author(s):  
Joao V. T. Silveira ◽  
Zidi Li ◽  
Kazuyoshi Fushinobu ◽  
Ryuta Yasui ◽  
Takuya Shinoda
Keyword(s):  
Heat Generation ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit
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