scholarly journals Research on Manufacturing Readiness Level Improvement of Hybrid Integrated Circuit Based on Intelligent Manufacturing

2021 ◽  
Vol 1884 (1) ◽  
pp. 012016
Author(s):  
Hailong Zhao ◽  
Yu Zhang ◽  
Kui Zhang ◽  
Jie Huang ◽  
Honglei Ran
Author(s):  
M. Schneck ◽  
M. Horn ◽  
M. Schmitt ◽  
C. Seidel ◽  
G. Schlick ◽  
...  

AbstractIn this review paper, the authors investigate the state of technology for hybrid- and multi-material (MM) manufacturing of metals utilizing additive manufacturing, in particular powder bed fusion processes. The study consists of three parts, covering the material combinations, the MM deposition devices, and the implications in the process chain. The material analysis is clustered into 2D- and 3D-MM approaches. Based on the reviewed literature, the most utilized material combination is steel-copper, followed by fusing dissimilar steels. Second, the MM deposition devices are categorized into holohedral, nozzle-based as well as masked deposition concepts, and compared in terms of powder deposition rate, resolution, and manufacturing readiness level (MRL). As a third aspect, the implications in the process chain are investigated. Therefore, the design of MM parts and the data preparation for the production process are analyzed. Moreover, aspects for the reuse of powder and finalization of MM parts are discussed. Considering the design of MM parts, there are theoretical approaches, but specific parameter studies or use cases are not present in the literature. Principles for powder separation are identified for exemplary material combinations, but results for further finalization steps of MM parts have not been found. In conclusion, 3D-MM manufacturing has a MRL of 4–5, which indicates that the technology can be produced in a laboratory environment. According to this maturity, several aspects for serial MM parts need to be developed, but the potential of the technology has been demonstrated. Thus, the next important step is to identify lead applications, which benefit from MM manufacturing and hence foster the industrialization of these processes.


2021 ◽  
Vol 37 (5) ◽  
pp. 1117-1124
Author(s):  
R. M. Nikam ◽  
A. P. Patil ◽  
K. H. Kapadnis ◽  
A. D. Ahirrao ◽  
R.Y. Borse

There are numerous methods has been investigated and developed for the preparation of thin and thick films. Thick film technology is utilized for the production of electronic devices like surface mount devices, in the preparation of hybrid integrated circuit, in the formulation of heating elements, in the construction of integrated passive devices and sensors. Pure tin oxide (SnO2) and composite 1%, 3%, 5%, 7% and 9 % zirconium oxide (ZrO2) thick films of dimensions 2 cm×1 cm incorporated into pure tin oxide (SnO2) were prepared with standard screen printing method. All samples were fabricated on glass support. The thick films were subjected to drying and firing at 5000C at 5 hours in muffle furnace. Thick films of tin oxide (SnO2) and composite 1%, 3%, 5%, 7% and 9 % zirconium oxide (ZrO2) incorporated into pure tin oxide (SnO2) were checked for Scanning Electron Microscopy (S.E.M), Energy Dispersive X-ray Spectroscopy (E.D.A.X), X-ray diffraction (X.R.D), Fourier Transform infra-Red (F.T.I.R) and Ultra-Violet-Visible spectroscopy (U.V) for surface morphology, elemental analysis, crystalline phases of films, vibrational and spectrophotometric study respectively. In this research paper the spectrophotometric parameters such as absorbance and absorption coefficient with pure and compositional thick films were a part of investigation and surveillance.


1994 ◽  
Vol 38 ◽  
pp. 479-487 ◽  
Author(s):  
O. N. Grigoriev ◽  
S. M. Kushnerenko ◽  
K. A. Plotnikov ◽  
W. Kreher

Recently aluminum nitride (A1N) has been intensively studied as a promising material for production of hybrid integrated circuit substrates because of its high thermal conductivity, high fjexural strength, and nontoxic nature. The estimated theoretical value of its thermal conductivity at room temperature is 320 W/mK, but it is strongly degraded by the introduction of oxygen. The measured values vary from 30 to 260 W/mK, Therefore, in production of this material the reduction of oxygen contamination is of paramount importance.


Author(s):  
Andre Garcia ◽  
Neil Ganey ◽  
Jeff Wilbert

Technology Readiness Levels (TRL) are a framework, originally created by NASA and later adopted and tailored by the US Department of Defense (Graettinger, Garcia, Siviy, Schenk, Van Syckle, 2002) to track the progress and maturity of a given technology. There are a number of derivative readiness level frameworks that have spun off the original TRL framework such as System Readiness Levels, Software Readiness Levels, Integration Readiness Levels, and Manufacturing Readiness Levels, just to name a few. Most of the time, these frameworks have an associated readiness assessment used to identify or assess the precise readiness level status. Human Readiness Levels (HRLs) are a framework used to identify the level of readiness or maturity of a given technology as it relates to its usability and its refinement to be used by a human(s) (Phillips, 2010). There are a number of HRL frameworks or similar (e.g. Human Factors Readiness Levels), yet little attention has been paid to Human Readiness Assessments (HRAs). The purpose of this paper is to review the literature of Human Readiness Levels and introduce a new multivariate Human Readiness Assessment that emphasizes workload, situation awareness (SA), and usability.


Author(s):  
X. Miao ◽  
Q. Zhang ◽  
H. Jiang ◽  
H. Qi

Within the past ten years, significant improvements have been achieved in the laser manufacturing process. It is feasible now to obtain various small-scale surface features (such as dimples, riblets, grooves, etc.) with the current manufacturing readiness level of laser surface texturing techniques. In this paper, the aerodynamic impact of the employment of riblets on turbine endwall has been investigated through combined CFD and experimental studies in a low speed linear cascade environment. Detailed comparisons of the flow structures have been made for cases with and without riblets on the endwall. The results show that endwall riblets can effectively reduce the strength of the pressure side leg of the horseshoe vortex, lower the cross passage pressure gradient, and alleviate the lift up of the passage vortex. A test section with seven passages and eight blades was used to validate the CFD observations. Both numerical and experimental results indicate that, the addition of riblets can be an effective approach to reduce the endwall secondary flow, and there is a large space for further optimization.


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