scholarly journals Research on temperature field model of hot air reflow soldering process

2021 ◽  
Vol 1976 (1) ◽  
pp. 012050
Author(s):  
Zhanming Pang ◽  
Yi Zheng ◽  
Hongqiao Shen ◽  
Chengyang Ji ◽  
Kailin Pan ◽  
...  
Keyword(s):  
Temperature Field ◽  
Field Model ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Hot Air ◽  
Temperature Field Model

Comparative Analysis of Temperature Field Model and Design of Cooling System Structure Parameters of Submersible Motor

2021 ◽  
pp. 1-30
Author(s):  
Qi Zhang ◽  
Zengliang Li ◽  
Xiangwei Dong ◽  
Yanxin Liu ◽  
Ran Yu
Keyword(s):  
Temperature Field ◽  
Field Model ◽  
Cooling System ◽  
System Structure ◽  
Structure Parameters ◽  
Bidirectional Coupling ◽  
Temperature Field Model ◽  
Submersible Motor ◽  
Coupling Mode ◽  
Two Temperature

Abstract The reliability of submersible motor is the key to determining the stability of the middle and deep sea exploration and development equipment. In this paper, in view of different equivalent modes of convective heat transfer of housing surface, two temperature field models are established in the finite volume method (FVM). The unidirectional and bidirectional coupling mode between loss and temperature of motor are analyzed, and the temperature calculation results are compared when the oil friction loss and copper loss are constant and variable. Then, the bidirectional coupling mode between radiator temperature field and cooling system internal flow field is determined based on the structural parameters of radiator and cooling circulation impeller. The circulation flow is simulated and the influence of different loss unidirectional coupling modes on the temperature field is compared. Finally, the cooling system design procedure is proposed to obtain the matching relationship of the same cooling system structure parameters of the two temperature field models. Experimental validation is presented, and a more reasonable temperature field model is obtained under the coupling mode proposed. It provides the necessary theoretical basis for the research on the submersible motor cooling system.

scholarly journals Transient Temperature Field Model of Wear Land on the Flank of End Mills: A Focus on Time-Varying Heat Intensity and Time-Varying Heat Distribution Ratio

2019 ◽  
Vol 9 (8) ◽  
pp. 1698 ◽  
Author(s):  
Du ◽  
Yue ◽  
Liu ◽  
Liang ◽  
Wang ◽  
...  
Keyword(s):  
Temperature Field ◽  
High Speed ◽  
Field Model ◽  
Transient Temperature ◽  
Time Varying ◽  
Peripheral Milling ◽  
Transient Temperature Field ◽  
Proposed Model ◽  
Temperature Field Model ◽  
End Mills

Modelling methods for the transient temperature field of wear land on the flank of end mills have been proposed to address the challenges of inaccurate prediction in the temperature field of end mills during the high-speed peripheral milling of Ti6Al4V that is a titanium alloy. A transient temperature rise model of wear land on the flank of end mills was constructed under the influence of heat sources in the primary shearing zone (PSZ), rake-chip zone (RCZ), flank-workpiece zone (FWZ), and dissipating heat source. Then the transient temperature field model of wear land on the flank of end mills was constructed. Finally, the transient temperature field model of wear land on the flank of end mills was constructed. Comparison of simulation result and experimental data verified the accuracy of the model. In sum, the proposed model may provide a temperature model support for future studies of flank wear rate in end mill modeling.

SURFACE TEMPERATURE FIELD MODEL AND INFLUENCE FACTORS OF HF CVD DIAMOND FILMS ON WC–Co ALLOYS

2006 ◽  
Vol 13 (05) ◽  
pp. 661-668
Author(s):  
SHA LIU ◽  
JING QIU ZHANG
Keyword(s):  
Temperature Field ◽  
Surface Temperature ◽  
Field Model ◽  
Influence Factors ◽  
Diamond Films ◽  
Thermal Source ◽  
Heat Conductivity Coefficient ◽  
Temperature Field Model ◽  
Surface Temperature Field ◽  
Co Alloys

The surface temperature field model of hot filament chemical vapor deposition (HF CVD) diamond films on WC – Co alloys was constructed and calculated by taking into account the influences of both thermal source properties and physical properties of substrates. Under the certain conditions of some parameters, the effects of the influence factors such as the maximum specific heat flux (q m ), the heat conductivity coefficient (λ) of the substrate and the substrate height (h) on the surface temperature field were exhibited quickly and clearly by the computer modeling. The theoretical calculating data are close to the experimental results. It is found that the influences of the thermal source parameter, the substrate height, and the heat conductivity coefficient of the substrate materials on the surface temperature field of diamond films on WC – Co alloys are almost equally important.

Analysis and Optimization for Lead-Free Reflow Soldering Process Parameters of SMA Based on 6 σ Method

2014 ◽  
Vol 602-605 ◽  
pp. 180-184
Author(s):  
Xuan Jun Dai ◽  
Hong Yan Huang
Keyword(s):  
Process Parameters ◽  
Lead Free ◽  
Analysis Method ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Hot Air

The reflow soldering process under infrared hot air environment was simulated based on a typical BGA SMA and a twelve-zone reflow oven. Then the optimal soldering process parameters were obtained based on 6σ analysis method and related software. The results could be used to direct the lead-free soldering process parameters setting, and the soldering quality was ensured effectively.

Three-dimensional transient temperature field model for laser annealing

2005 ◽  
Vol 97 (3) ◽  
pp. 033520 ◽  
Author(s):  
Jean-Yves Degorce ◽  
Jean-Numa Gillet ◽  
François Magny ◽  
Michel Meunier
Keyword(s):  
Temperature Field ◽  
Laser Annealing ◽  
Field Model ◽  
Three Dimensional ◽  
Transient Temperature ◽  
Transient Temperature Field ◽  
Temperature Field Model

Research on a 3D Temperature Field Model of a Slab with Oxide Layer Growth

2015 ◽  
Vol 46 (2) ◽  
pp. 147-159
Author(s):  
Xiao-xu Dong ◽  
An-rui He ◽  
Wen-quan Sun ◽  
Zhu-bing Liu ◽  
Bo Hong
Keyword(s):  
Temperature Field ◽  
Oxide Layer ◽  
Field Model ◽  
Layer Growth ◽  
Temperature Field Model
Sign in / Sign up

Export Citation Format

Share Document