scholarly journals Research of bottom blowing and slag layer thickness on bath stirring in a 120t ladle

2021 ◽  
Vol 2044 (1) ◽  
pp. 012039
Author(s):  
Jipeng Li ◽  
Yong Liu ◽  
Shusen Cheng
Author(s):  
V.P. Piptyuk ◽  
P.G. Prokopenko ◽  
S.V. Grekov ◽  
G.O. Andrievsky

The purpose of the work is to determine the effect of slag on the processes of mixing the steel melt in the ladle during its bottom purge. The study by physical modeling was carried out on a transparent bucket model with its bottom purge without slag layer and, if any, it was present. Water was used as the liquid of the metal, and slag was sunflower oil. The bath was washed with air at various costs. Controled the thickness of the slag layer and the surface area of the metal surface from it. The level of conductivity of a water bath was determined depending on the variables. A slight decrease in the electrical conductivity of the melt mist (water) in the presence of slag is observed, as well as an increase in the thickness of the slag layer and the surface area of the melt surface with increasing air flow. The factors which can be applied for the calculation of hydrodynamic processes during the processing of steel on the "ladle-furnace" installation, taking into account the slag component, are revealed. It is shown that when the air flow increases, the diameter of the water released from the slag (oil) increases, and when the volume of the latter is stored, the thickness of its layer increases. The expediency of continuation of researches by cold physical modeling of hydrodynamics, heat and mass transfer with and without slag is shown, which will allow them to be taken into account in hot modeling and in industrial conditions.


Author(s):  
Alain Claverie ◽  
Zuzanna Liliental-Weber

GaAs layers grown by MBE at low temperatures (in the 200°C range, LT-GaAs) have been reported to have very interesting electronic and transport properties. Previous studies have shown that, before annealing, the crystalline quality of the layers is related to the growth temperature. Lowering the temperature or increasing the layer thickness generally results in some columnar polycrystalline growth. For the best “temperature-thickness” combinations, the layers may be very As rich (up to 1.25%) resulting in an up to 0.15% increase of the lattice parameter, consistent with the excess As. Only after annealing are the technologically important semi-insulating properties of these layers observed. When annealed in As atmosphere at about 600°C a decrease of the lattice parameter to the substrate value is observed. TEM studies show formation of precipitates which are supposed to be As related since the average As concentration remains almost unchanged upon annealing.


Author(s):  
H. Kung ◽  
A.J. Griffin ◽  
Y.C. Lu ◽  
K.E. Sickafus ◽  
T.E. Mitchell ◽  
...  

Materials with compositionally modulated structures have gained much attention recently due to potential improvement in electrical, magnetic and mechanical properties. Specifically, Cu-Nb laminate systems have been extensively studied mainly due to the combination of high strength, and superior thermal and electrical conductivity that can be obtained and optimized for the different applications. The effect of layer thickness on the hardness, residual stress and electrical resistivity has been investigated. In general, increases in hardness and electrical resistivity have been observed with decreasing layer thickness. In addition, reduction in structural scale has caused the formation of a metastable structure which exhibits uniquely different properties. In this study, we report the formation of b.c.c. Cu in highly textured Cu/Nb nanolayers. A series of Cu/Nb nanolayered films, with alternating Cu and Nb layers, were prepared by dc magnetron sputtering onto Si {100} wafers. The nominal total thickness of each layered film was 1 μm. The layer thickness was varied between 1 nm and 500 nm with the volume fraction of the two phases kept constant at 50%. The deposition rates and film densities were determined through a combination of profilometry and ion beam analysis techniques. Cross-sectional transmission electron microscopy (XTEM) was used to examine the structure, phase and grain size distribution of the as-sputtered films. A JEOL 3000F high resolution TEM was used to characterize the microstructure.


Author(s):  
Masahiro Ito ◽  
Yuitch Iwagaki ◽  
Hiroshi Murakami ◽  
Kenji Nemoto ◽  
Masato Yamamoto ◽  
...  

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