scholarly journals Preparation and thermophysical properties of graphite flake-carbon fiber coreinforced copper matrix composites

2021 ◽  
Author(s):  
Junchen Huang ◽  
Guodong Miu ◽  
TongLe Liu ◽  
Chen Huang ◽  
Shibo Guo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Hot Pressing ◽  
Bending Strength ◽  
Volume Fraction ◽  
Copper Matrix ◽  
Graphite Flake ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Hot Pressing Sintering

Abstract Graphite flake-carbon fiber coreinforced copper matrix composites were prepared by vacuum hot pressing technology. The carbon fibers were dispersed ultrasonic in alcohol and then mixed with graphite flake and alloys powder（Zr and Cu）for hot pressing sintering. The effects of the carbon fiber content on the microstructure, bending strength and thermal conductivity of the composites were investigated. The results show that the interface of the composites is well bonded. When the volume fraction of carbon fiber is 1%-3%, the carbon fiber can be uniformly dispersed in the matrix, and the bending strength of the composites can be improved effectively. When the volume fraction of carbon fiber is 2%, the bending strength reaches a maximum of 152 MPa, which is an increase of 60% compared with that of the composites without carbon fiber. However, an excessive addition of carbon fiber (4% or more) leads to an uneven distribution of carbon fiber, and the bending strength of the composites decreases. When the volume fraction of carbon fiber is 2%, the thermal conductivity of the composite is 597 W·m-1·K-1. The acoustic mismatch model (AMM) associated with the Digimat MF module is able to predict the thermal conductivity of the anisotropic multiphase composites.

Thermo-Physical Properties of Copper Matrix Composites Reinforced with 3D-SiC Network

2010 ◽  
Vol 150-151 ◽  
pp. 144-149
Author(s):  
Hong Wei Xing ◽  
Jin Song Zhang ◽  
Xiao Ming Cao
Keyword(s):  
Thermal Conductivity ◽  
Physical Properties ◽  
Room Temperature ◽  
Volume Fraction ◽  
Copper Matrix ◽  
High Thermal Stability ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Specific Heat Capacities ◽  
Thermo Physical Properties

Copper matrix composites reinforced with 3D-SiC network (15v% and 20v% SiC) were fabricated by squeezing copper alloy into 3D-SiC network preforms. The thermo-physical properties of the copper matrix composites were investigated. The specific heat capacities of the composites were about 0.39~0.50 J•g-1•K-1. The coefficients of thermal expansion (CTEs) of the composites were found to be lower than 6.9×10-6 -1 at Room Temperature. The composites exhibited high thermal stability for 3D-SiC network advent. The thermal conductivity of the composites was in the range of 50~80W•m−1•K−1. The thermo-physical properties of Cu matrix composites had a great relationship with the structures of 3D-SiC network preforms. The thermal conductivity of the composites decreased with an increase in the volume fraction of SiC or the structures of the limbs changing compacted, but the CTEs were not completely according this rule.

The fabrication and properties of short carbon fiber reinforced copper matrix composites

2011 ◽  
Vol 45 (24) ◽  
pp. 2567-2571 ◽  
Author(s):  
Weiwei Li ◽  
Lei Liu ◽  
Bin Shen
Keyword(s):  
Carbon Fiber ◽  
Volume Fraction ◽  
High Strength ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Electroless Copper Plating ◽  
Fiber Volume ◽  
Copper Matrix Composites ◽  
Thermal Expansion Property ◽  
Short Carbon

Short carbon fibers (SCFs) reinforced copper matrix composites, fiber volume fraction of which ranged from 10% to 30%, were prepared by electroless copper plating plus cold press and sintering technique. SCFs were copperized directly by electroless plating using hypophosphite as reducing agent. The effects of SCFs volume fraction on mechanical, thermal, and electrical properties of the composites were discussed. The results indicated that the microhardness and thermal expansion property of Cu/SCFs composites increased with increasing fibers content, owing to the high strength of SCF. However, thermal conductivity and electrical conductivity reversed, it was attributed to the performance of carbon fiber itself; furthermore, more defects and interfaces in the matrix acted as barriers to heat and electronic transfer.

Synthesis and Analysis of the Thermal Behavior of SiC-Fibre Reinforced Copper Matrix Composites as Heat Sink Material

2008 ◽  
Vol 59 ◽  
pp. 153-157 ◽  
Author(s):  
Verena Paffenholz ◽  
Stefan Lindig ◽  
Annegret Brendel ◽  
Harald Bolt
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Volume Fraction ◽  
Fibre Volume Fraction ◽  
Copper Matrix ◽  
Fibre Volume ◽  
Matrix Composites ◽  
Scanning Calorimetry ◽  
Fibre Direction ◽  
Copper Matrix Composites

Copper matrix composites reinforced with silicon carbide fibres (SiCf/Cu) are considered as heat sink materials for the divertor of DEMO as they combine high thermal conductivity and good mechanical strength at high temperature. A new method was developed to synthesise a metal matrix composite (MMC) consisting of about 3-6 unidirectional reinforced layers (UD-layers). The UD-layers were prepared by two subsequent electroplating processes which allow to adjust various fibre volume fractions. These single UD layers were stacked with different relative fibre orientations (0°/0° and 0°/90°) and consolidated by vacuum hot pressing to form the MMC specimen. The thermal conductivity perpendicular to fibre direction was obtained by laser flash apparatus (LFA) measurements. It is about 310 Wm-1K-1 for electroplated copper (Cu) and above 200 Wm-1K-1 for MMC specimens with a fibre volume fraction of 8-13%. Due to the manufacturing process, boundaries within the matrix were found resulting in a reduction of the values. In addition, DSC (differential scanning calorimetry) measurements were performed which gave similar results.

MICROSTRUCTURE AND PROPERTIES OF SiC PARTICLES REINFORCED COPPER BASED ALLOY COMPOSITE

2013 ◽  
Vol 27 (19) ◽  
pp. 1341025 ◽  
Author(s):  
YU HONG ◽  
XIAOLI CHEN ◽  
WENFANG WANG ◽  
YUCHENG WU
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Relative Density ◽  
Volume Fraction ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Wear Properties ◽  
Sic Particles ◽  
Copper Based Alloy

Copper-matrix composites reinforced with SiC particles are prepared by mechanical alloying. The microstructure characteristics, relative density, hardness, tensile strength, electrical conductivity, thermal conductivity and wear properties of the composites are investigated in this paper. The results indicate that the relative density, macro-hardness and mechanical properties of composites are improved by modifying the surface of SiC particles with Cu and Ni . The electrical conductivity and thermal conductivity of composites, however, are not obviously improved. For a given volume fraction of SiC , the Cu / SiC ( Ni ) has higher mechanical properties than Cu / SiC ( Cu ). The wear resistance of the composites are improved by the addition of SiC . The composites with optimized interface have lower wear rate.

Microstructure, electrical and mechanical properties of Ti2AlN MAX phase reinforced copper matrix composites processed by hot pressing

2021 ◽  
Vol 171 ◽  
pp. 110812
Author(s):  
C. Salvo ◽  
E. Chicardi ◽  
J. Hernández-Saz ◽  
C. Aguilar ◽  
P. Gnanaprakasam ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Hot Pressing ◽  
Copper Matrix ◽  
Max Phase ◽  
Matrix Composites ◽  
Copper Matrix Composites

Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing

2009 ◽  
Vol 79-82 ◽  
pp. 1579-1582
Author(s):  
Chang Chun Wang ◽  
Guang Hui Min ◽  
Suk Bong Kang
Keyword(s):  
Electrical Conductivity ◽  
Hot Pressing ◽  
Coating Layer ◽  
Annealing Treatment ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Conducting Property ◽  
Reinforcement Content ◽  
Electrical Conducting

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.

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