Shortening the design for assembly process time for torque converter development

2002 ◽  
Vol 22 (3) ◽  
pp. 248-259 ◽  
Author(s):  
Y.J. Lin ◽  
Adam Uhler
Keyword(s):  
Torque Converter ◽  
Process Time ◽  
Design For Assembly ◽  
Assembly Process

scholarly journals Application of the Deep CNN-Based Method in Industrial System for Wire Marking Identification

Energies ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3659
Author(s):  
Andrzej Szajna ◽  
Mariusz Kostrzewski ◽  
Krzysztof Ciebiera ◽  
Roman Stryjski ◽  
Waldemar Woźniak
Keyword(s):  
Production Process ◽  
Process Development ◽  
Process Time ◽  
Industrial System ◽  
Assembly Process ◽  
Production Environment ◽  
Deep Convolutional Neural Networks ◽  
Control Cabinet ◽  
Production Processes ◽  
The Wire

Industry 4.0, a term invented by Wolfgang Wahlster in Germany, is celebrating its 10th anniversary in 2021. Still, the digitalization of the production environment is one of the hottest topics in the computer science departments at universities and companies. Optimization of production processes or redefinition of the production concepts is meaningful in light of the current industrial and research agendas. Both the mentioned optimization and redefinition are considered in numerous subtopics and technologies. One of the most significant topics in these areas is the newest findings and applications of artificial intelligence (AI)—machine learning (ML) and deep convolutional neural networks (DCNNs). The authors invented a method and device that supports the wiring assembly in the control cabinet production process, namely, the Wire Label Reader (WLR) industrial system. The implementation of this device was a big technical challenge. It required very advanced IT technologies, ML, image recognition, and DCNN as well. This paper focuses on an in-depth description of the underlying methodology of this device, its construction, and foremostly, the assembly industrial processes, through which this device is implemented. It was significant for the authors to validate the usability of the device within mentioned production processes and to express both advantages and challenges connected to such assembly process development. The authors noted that in-depth studies connected to the effects of AI applications in the presented area are sparse. Further, the idea of the WLR device is presented while also including results of DCNN training (with recognition results of 99.7% although challenging conditions), the device implementation in the wire assembly production process, and its users’ opinions. The authors have analyzed how the WLR affects assembly process time and energy consumption, and accordingly, the advantages and challenges of the device. Among the most impressive results of the WLR implementation in the assembly process one can be mentioned—the device ensures significant process time reduction regardless of the number of characters printed on a wire.

Design for Assembly Evaluation of Orientation Difficulty Features

1992 ◽  
Author(s):  
Robert H. Sturges ◽  
Jui-Te Yang
Keyword(s):  
Geometric Modeling ◽  
Boundary Representation ◽  
Design For Assembly ◽  
Assembly Process ◽  
Assembly Evaluation ◽  
Index Of Difficulty ◽  
Analysis System ◽  
Time Required ◽  
High Level ◽  
Geometric Modeling System

Abstract In support of the effort to bring downstream issues to the attention of the designer as parts take shape, an analysis system is being built to extract certain features relevant to the assembly process, such as the dimension, shape, and symmetry of an object. These features can be applied to a model during the downstream process to evaluate handling and assemblability. In this paper, we will focus on the acquisition phase of the assembly process and employ a Design for Assembly (DFA) evaluation to quantify factors in this process. The capabilities of a non-homogeneous, non-manifold boundary representation geometric modeling system are used with an Index of Difficulty (ID) that represents the dexterity and time required to assemble a product. A series of algorithms based on the high-level abstractions of loop and link are developed to extract features that are difficult to orient, which is one of the DFA criteria. Examples for testing the robustness of the algorithms are given. Problems related to nearly symmetric outlines are also discussed.

scholarly journals A Prototype of Feature-Based Design for Assembly

1990 ◽  
Author(s):  
T. L. DeFazio ◽  
A. C. Edsall ◽  
R. E. Gustavson ◽  
J. A. Hernandez ◽  
P. M. Hutchins ◽  
...  
Keyword(s):  
Information Source ◽  
Design Feature ◽  
Functional System ◽  
Design System ◽  
Prototype System ◽  
Design For Assembly ◽  
Assembly Process ◽  
Feature Based ◽  
Feature Based Design ◽  
Assembly Analysis

Abstract This paper describes a prototype software system that implements a form of feature-based design for assembly. It is not an automated design system but instead a decision and design aid for designers interested in Concurrent Design. Feature-based design captures design intent (assembly topology, product function, manufacturing, or field use) while creating part and product geometry. Design for assembly as used here extends existing ideas about critiquing part shapes and part count to include assembly process planning, assembly sequence generation, assembly fixturing assessments, and assembly process costs. This work was primarily Interested in identifying the information important to DFA tasks, and how that information could be captured using feature-based design. It was not intended to extend the state of the art in feature-based geometry creation, but rather to explore the uses of the information that can be captured. The prototype system has been programmed in LISP on Sun workstations. Its research contributions comprise integration of feature-based design with several existing and new assembly analysis and synthesis algorithms; construction of feature properties to meet the needs of those algorithms; a carefully chosen division of labor between designer and computer; and illustration of feature-based models of products as the information source for assembly analysis and process design. Some of its functions have been implemented approximately or partially but they give the flavor of the benefits to be expected from a fully functional system.

scholarly journals Design for assembly meaning: a framework for designers to design products that support operator cognition during the assembly process

2019 ◽  
Vol 22 (3) ◽  
pp. 615-632 ◽  
Author(s):  
Davy D. Parmentier ◽  
Bram B. Van Acker ◽  
Jan Detand ◽  
Jelle Saldien
Keyword(s):  
Design For Assembly ◽  
Assembly Process

A Coordinated Product and Process Development Environment for Design for Assembly

1996 ◽  
Author(s):  
David E. Lee ◽  
H. Thomas Hahn
Keyword(s):  
Concurrent Engineering ◽  
Process Development ◽  
Low Cost ◽  
Holistic Approach ◽  
Coordination Mechanism ◽  
Design For Assembly ◽  
Assembly Process ◽  
Development Environment ◽  
Industrial Sectors ◽  
Assembly Operations

Abstract The development approach embodied in design for assembly (DFA) has been demonstrated effectively in different industrial sectors and through the design of a multitude of products. However, little effort has been applied to improving development methods for the assembly operations and processes used to fabricate these products. If the benefits of concurrent engineering are to be fully realized, a more holistic approach to unifying a product’s design with development of its assembly processes is needed. This paper provides a description of our approach to establishing an environment for coordinated product and assembly process development. The steps in a product’s development cycle are introduced and the concepts of design for assembly and concurrent engineering defined. Using DFA methods as a motivation, an approach to assembly process development is derived. Referred to as Systematic Assembly Process Development (S-APD), assembly processes are defined and analyzed by using standardized generic assembly operations. To address problems created by using concurrent engineering in product/process development, two mechanisms are described. Since the focus of developing a product (i.e. how well does it perform and cost) differs from developing its assembly processes (i.e. making products at the necessary volumes), the concept of an interface reference context is introduced as a coordination mechanism and applied to development of unmanned composite low-cost aircraft. Moreover, in identifying which elements of the design are to be assembled with a specific set of production technologies, a synchronous thread is instantiated to link product and assembly process development efforts in a temporal context. Different approaches are reviewed to resolve potential conflicts related to concurrency effects generated during simultaneous product and assembly process development.

No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000708-000735 ◽  
Author(s):  
Zhaozhi Li ◽  
John L. Evans ◽  
Paul N. Houston ◽  
Brian J. Lewis ◽  
Daniel F. Baldwin ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Process Development ◽  
Low Cost ◽  
Three Dimensional ◽  
High Yield ◽  
Process Time ◽  
Assembly Process ◽  
Wafer Level ◽  
Fine Pitch

The industry has witnessed the adoption of flip chip for its low cost, small form factor, high performance and great I/O flexibility. As the Three Dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon to silicon assembly, is gaining more and more popularity. Most flip chip packages require underfill to overcome the CTE mismatch between the die and substrate. Although the flip chip to wafer assembly is a silicon to silicon integration, the underfill is necessary to overcome the Z-axis thermal expansion as well as the mechanical impact stresses that occur during shipping and handling. No flow underfill is of special interest for the wafer level flip chip assembly as it can dramatically reduce the process time as well as bring down the average package cost since there is a reduction in the number of process steps and the dispenser and cure oven that would be necessary for the standard capillary underfill process. Chip floating and underfill outgassing are the most problematic issues that are associated with no flow underfill applications. The chip floating is normally associated with the size/thickness of the die and volume of the underfill dispensed. The outgassing of the no flow underfill is often induced by the reflow profile used to form the solder joint. In this paper, both issues will be addressed. A very thin, fine pitch flip chip and 2x2 Wafer Level CSP tiles are used to mimic the assembly process at the wafer level. A chip floating model will be developed in this application to understand the chip floating mechanism and define the optimal no flow underfill volume needed for the process. Different reflow profiles will be studied to reduce the underfill voiding as well as improve the processing yield. The no flow assembly process developed in this paper will help the industry understand better the chip floating and voiding issues regarding the no flow underfill applications. A stable, high yield, fine pitch flip chip no flow underfill assembly process that will be developed will be a very promising wafer level assembly technique in terms of reducing the assembly cost and improving the throughput.

scholarly journals Strategi Self-Assembly Paralel pada Swarm Robot

2019 ◽  
Vol 7 (1) ◽  
pp. 138
Author(s):  
NIKEN SYAFITRI
Keyword(s):  
Self Assembly ◽  
Swarm Robotics ◽  
Parallel Process ◽  
Process Time ◽  
Assembly Process ◽  
Swarm Robots ◽  
Long Time ◽  
Swarm Robot ◽  
Time Required ◽  
Structure Result

ABSTRAKDari banyaknya strategi yang diusulkan untuk proses self-assembly pada swarm robotics, hanya beberapa grup riset berkonsentrasi di bidang ini yang mengusulkan proses paralel pada penggabungan antar robot. Tetapi, strategi ini hanya digunakan ketika sebuah robot memerlukan tumpuan dari dua robot atau lebih pada satu waktu. Berdasar pada kebutuhan untuk menyebarkan ratusan hingga ribuan robot pada satu swarm, strategi penggabungan antar robot satu-demi-satu memerlukan waktu yang sangat lama untuk diselesaikan. Di artikel ini, strategi self-assembly antar robot pada suatu swarm secara paralel diusulkan untuk mengurangi waktu proses self-assembly dengan menempatkan sejumlah robot di posisi tertentu. Saat penggabungan, robot-robot ini akan bergerak menempatkan dirinya sesuai dengan posisi akhir yang ditargetkan. Hasil menunjukkan bahwa strategi ini dapat mereduksi waktu proses self-assembly hingga setengah dari waktu yang diperlukan dengan proses penggabungan satu-demi-satu.Kata kunci: swarm robot, self-assembly, proses paralel ABSTRACTDespite the number of strategies proposed for self-assembly process in swarm robotics, only few research groups working in this area have proposed the parallel process of robots assembled each other. However, this strategy only works when a robot needs to be supported by two or more robots in a time. When deploying hundred to thousand robots in a swarm is required, the strategy of robots connecting to the structure of assembled robots in a one-by-one manner requires an extremely long time to accomplish. In this paper, a strategy of parallel selfassembly for robots in a swarm is proposed for reducing the self-assembly process time by placing a number of robots at particular positions. While connecting, they will move to position themselves appropriately to the targeted final structure. Result shows that this strategy can reduce the process of self-assembly time up to half of the time required for one-by-one process.Keywords: swarm robots, self-assembly, parallel process

Optimization Algorithm for Automated Assembly of Circular Parts

2007 ◽  
Vol 10-12 ◽  
pp. 672-676
Author(s):  
Feng Jiang ◽  
Jian Feng Li ◽  
Fang Yi Li
Keyword(s):  
Process Parameters ◽  
Optimization Algorithm ◽  
Design For Assembly ◽  
Assembly Process ◽  
Optimal Process ◽  
Automated Assembly

Design for assembly (DFA) has proved its success in manufacturing to face the market challenge. But the assembly process parameters were rarely concerned in the design for assembly. Aimed at this problem, an algorithm for design for automated assembly of circular parts was proposed. This algorithm can help designer to select the optimal process parameters, such as dimension tolerance of mating parts, location precision of assembly device and so on, subject to budgetary constraints. Finally a case is employed to explain the optimal course.

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