A high-power PCCM LED driver based on GaN eHEMT with hybrid dimming modes

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xixian Lin ◽  
Yuming Zhang ◽  
Yimeng Zhang ◽  
Guangjian Rong
Keyword(s):  
Printed Circuit Board ◽  
Pulse Width Modulation ◽  
Circuit Board ◽  
Switching Frequency ◽  
Led Driver ◽  
Power Circuit ◽  
Content Type ◽  
Wide Range ◽  
Circuit Function ◽  
Pwm Dimming

Purpose The purpose of this study is to design a more flexible and larger range of the dimming circuit that achieves the independence of multiple LED strings drive and can time-multiplex the power circuit. Design/methodology/approach The state-space method is used to model the BUCK circuit working in Pseudo continuous conduction mode, analyze the frequency characteristics of the system transfer function and design the compensation network. Build a simulation platform on the Orcad PSPICE platform and verify the function of the designed circuit through the simulation results. Use Altium Designer 16 to draw the printed circuit board, complete the welding of various components and use the oscilloscope, direct current (DC) power supply and a signal generator to verify the circuit function. Findings A prototype of the proposed LED driver is fabricated and tested. The measurement results show that the switching frequency can be increased to 1 MHz, Power inductance is 2.2 µH, which is smaller than current research. The dimming ratio can be set from 10% to 100%. The proposed LED driver can output more than 48 W and achieve a peak conversion efficiency of 91%. Originality/value The proposed LED driver adopts pulse width modulation (PWM) dimming at a lower dimming ratio and adopts DC dimming at a larger dimming ratio to realize switching PWM dimming to analog dimming. The control strategy can be more precise and have a wide range of dimming.

Performance Comparison Between Surface-mount and Embedded Power Modules

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000647-000670
Author(s):  
Gerald Weis
Keyword(s):  
Printed Circuit Board ◽  
State Of The Art ◽  
Circuit Board ◽  
Switching Frequency ◽  
Surface Mount ◽  
Printed Circuit ◽  
Power Transistors ◽  
Wide Range ◽  
Power Switches ◽  
Embedded Power

Increasing efficiency in power electronic circuits requires innovative cooling concepts and a low impedance connection in the power path as well as low inductance driving circuits placed as close as possible to the main power switches. A direct comparison between state-of-the-art standard surface-mount build-ups and power switches embedded directly into the printed circuit board shows the high potential of integrated electronics. Measurements at defined operating point(s) verify improved thermal performance due to more heat spreading area, as well as higher achievable switching speed. For performance benchmarking two similar versions of half bridge circuits in DC-DC buck configuration were built to be compared in measurement. The first configuration uses standard, state-of-the-art SMD packages assembled onto the module. For the second half bridge module an embedded power path was used: The power transistors (GaN HEMT devices) are mounted inside the printed circuit board (PCB) and galvanically isolated from the heat sink pad on top of the package. Both versions use exactly the same schematic, layer stack-up and copper structure on the six layers used. A slightly different laser drill configuration was necessary because embedded parts are connected by copper filled laser drill holes. This measure was taken to optimize the modules according to their technology. Each module has an NTC thermistor mounted at the same distance to the half bridge transistors, and is used to indicate the temperature of the transistor dies during measurement. To cover a wide range of operational conditions the devices under test (DUTs) were stressed under hard switching operation (HSW) as well as triangular current mode (TCM). HSW causes more stress because the opposite transistor is switched before the whole energy of Coss has been discharged. In TCM the current through the inductor is becoming negative for a short time period and discharges the Coss capacitors of the power transistors. The test conditions were set as follows: 150V, 11A with 200kHz switching frequency in HSW mode. The switching behavior is similar, because both modules uses the same power transistors. Due to less parasitic impedance at the embedded module the turn-on behavior is slightly improved at the embedded module. Embedding as a new, innovative concept is compared to standard technologies. First measurements show that the embedded DUT stays 20K below the temperature of the standard module while running at the same load current. Additionally fewer disturbances were observed at the embedded module.

Numerical simulation of EWOD on a printed circuit board for cleanroom-less digital fluidic manufacturing applications

2019 ◽  
Vol 38 (1) ◽  
pp. 119-137 ◽  
Author(s):  
Reza Hadjiaghaie Vafaie ◽  
Hossein Dehganpour ◽  
Abolfazl Moradpour
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Electric Field ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Angle Distribution ◽  
Content Type ◽  
Electrowetting On Dielectric ◽  
Printed Circuit ◽  
Wide Range

Purpose Digital microfluidic devices have been demonstrated to have great potential for a wide range of applications. These devices need expensive photolithography process and clean room facilities, while printed circuit board (PCB) technology provides high configurability and at low cost. This study aims to investigate the mechanism of electrowetting-on-a-dielectric (EWOD) on PCB by solving the multiphysics interaction between fluid droplet and electric field. The performance of system will be improved by inducing an efficient electric field inside the droplet. Design/methodology/approach To induce an electric field inside the droplet on a PCB and change the initial contact angle, the mechanism of EWOD is studied based on energy minimization method and a set of simulations are carried out by considering multiphysics interaction between the fluid droplet and external electric field. The performance of EWOD on a PCB system is investigated using different electrode structures. Findings Surface tension plays an efficient role in smaller sizes and can be used to move and control a fluid droplet on a surface by changing the interfacial surface tension. EWOD on a PCB system is studied. and it revealed that any change in electric field affects the droplet contact angle and as a result droplet deformation and movement. The electrode pattern is an important parameter which could change the electric potential distribution inside the droplet. Array of electrodes with square, zigzag interdigitated and crescent shapes are studied to enhance the EWOD force on a PCB substrate. Based on the results, the radial shape of the crescent electrodes keeps almost the same actuated contact line, applies uniform force on the droplet periphery and prevents the droplet from large deformation. A droplet velocity of 0.6 mm/s is achieved by exciting the crescent electrodes at 315 V. Furthermore, the behavior of system is characterized for process parameters such as actuation voltage, dielectric constant of insulator layer, fluidic material properties and the resultant velocity and contact angle. The study of contact angle distribution and droplet motion revealed that it is helpful to generate EWOD mechanism on a PCB which does not need more complicated fabrication processes. Originality/value The ability to handle and manipulate the droplets is very important for chemistry on-chip analysis such as immunoassay chips. Furthermore, a PCB-based electrowetting-on-dielectric device is of high interest because it does not need cleanroom facilities and avoids additional high-cost fabrication processes. In the present research, the EWOD mechanism is studied on a PCB by using different electrode patterns.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Robotic system design and development for automated dismantling of PCB waste

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ioan Doroftei ◽  
Daniel Chirita ◽  
Ciprian Stamate ◽  
Stelian Cazan ◽  
Carlos Pascal ◽  
...  
Keyword(s):  
Design Methodology ◽  
Printed Circuit Board ◽  
Vision System ◽  
Electronic Waste ◽  
Robotic System ◽  
Circuit Board ◽  
Short Introduction ◽  
Content Type ◽  
Printed Circuit ◽  
System A

Purpose The mass electronics sector is one of the most critical sources of waste, in terms of volume and content with dangerous effects on the environment. The purpose of this study is to provide an automated and accurate dismantling system that can improve the outcome of recycling. Design/methodology/approach Following a short introduction, the paper details the implementation layout and highlights the advantages of using a custom architecture for the automated dismantling of printed circuit board waste. Findings Currently, the amount of electronic waste is impressive while manual dismantling is a very common and non-efficient approach. Designing an automatic procedure that can be replicated, is one of the tasks for efficient electronic waste recovery. This paper proposes an automated dismantling system for the advanced recovery of particular waste materials from computer and telecommunications equipment. The automated dismantling architecture is built using a robotic system, a custom device and an eye-to-hand configuration for a stereo vision system. Originality/value The proposed approach is innovative because of its custom device design. The custom device is built using a programmable screwdriver combined with an innovative rotary dismantling tool. The dismantling torque can be tuned empirically.

Analysis of surface insulation resistance related failures in electronics by circuit simulation

Circuit World ◽  
2017 ◽  
Vol 43 (2) ◽  
pp. 45-55 ◽  
Author(s):  
Vadimas Verdingovas ◽  
Salil Joshy ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Electronic Device ◽  
Early Stage ◽  
Circuit Simulation ◽  
Circuit Board ◽  
Insulation Resistance ◽  
Electronic Circuits ◽  
Content Type ◽  
Printed Circuit ◽  
Surface Insulation Resistance

Purpose The purpose of this study is to show that the humidity levels for surface insulation resistance (SIR)-related failures are dependent on the type of activators used in no-clean flux systems and to demonstrate the possibility of simulating the effects of humidity and contamination on printed circuit board components and sensitive parts if typical SIR data connected to a particular climatic condition are available. This is shown on representative components and typical circuits. Design/methodology/approach A range of SIR values obtained on SIR patterns with 1,476 squares was used as input data for the circuit analysis. The SIR data were compared to the surface resistance values observable on a real device printed circuit board assembly. SIR issues at the component and circuit levels were analysed on the basis of parasitic circuit effects owing to the formation of a water layer as an electrical conduction medium. Findings This paper provides a summary of the effects of contamination with various weak organic acids representing the active components in no-clean solder flux residue, and demonstrates the effect of humidity and contamination on the possible malfunctions and errors in electronic circuits. The effect of contamination and humidity is expressed as drift from the nominal resistance values of the resistors, self-discharge of the capacitors and the errors in the circuits due to parasitic leakage currents (reduction of SIR). Practical/implications The methodology of the analysis of the circuits using a range of empirical leakage resistance values combined with the knowledge of the humidity and contamination profile of the electronics can be used for the robust design of a device, which is also important for electronic products relying on low current consumption for long battery lifetime. Originality/value Examples provide a basic link between the combined effect of humidity and contamination and the performance of electronic circuits. The methodology shown provides the possibility of addressing the climatic reliability of an electronic device at the early stage of device design by using typical SIR data representing the possible climate exposure.

Vision-force guided precise robotic assembly for 2.5D components in a semistructured environment

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Boyoung Kim ◽  
Minyong Choi ◽  
Seung-Woo Son ◽  
Deokwon Yun ◽  
Sukjune Yoon
Keyword(s):  
Computer Aided Design ◽  
Degrees Of Freedom ◽  
Printed Circuit Board ◽  
Force Sensor ◽  
Circuit Board ◽  
Robotic Assembly ◽  
Ccd Cameras ◽  
Content Type ◽  
3 Dimensional ◽  
Aided Design

Purpose Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system should assemble each part with adequate force and avoid breaking the circuits with excessive force. The purpose of this study is to assemble high precision components with relatively reasonable vision devices compared to previous studies. Design/methodology/approach This paper presents a vision-force guided precise assembly system using a force sensor and two charge coupled device (CCD) cameras without an expensive 3-dimensional (3D) sensor or computer-aided design model. The system accurately estimates 6 degrees-of-freedom (DOF) poses from a 2D image in real time and assembles parts with the proper force. Findings In this experiment, three connectors are assembled on a printed circuit board. This system obtains high accuracy under 1 mm and 1 degree error, which shows that this system is effective. Originality/value This is a new method for sub-mm assembly using only two CCD cameras and one force sensor.

Study on fine lines and undercut suppression of printed circuit board prepared by electrolytic etching

Circuit World ◽  
2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Denglin Fu ◽  
Yanan Wen ◽  
Jida Chen ◽  
Lansi Lu ◽  
Ting Yan ◽  
...  
Keyword(s):  
Corrosion Inhibitor ◽  
Corrosion Inhibitors ◽  
Printed Circuit Board ◽  
Copper Surface ◽  
Etching Process ◽  
Circuit Board ◽  
Content Type ◽  
Printed Circuit ◽  
Etching Method ◽  
Electrolytic Etching

Purpose The purpose of this paper is to study an electrolytic etching method to prepare fine lines on printed circuit board (PCB). And the influence of organics on the side corrosion protection of PCB fine lines during electrolytic etching is studied in detail. Design/methodology/approach In this paper, the etching factor of PCB fine lines produced by new method and the traditional method was analyzed by the metallographic microscope. In addition, field emission scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were used to study the inhibition of undercut of the four organometallic corrosion inhibitors with 2,5-dimercapto-1,3,4-thiadiazole, benzotriazole, l-phenylalanine and l-tryptophan in the electrolytic etching process. Findings The SEM results show that corrosion inhibitors can greatly inhibit undercut of PCB fine lines during electrolytic etching process. XPS results indicate that N and S atoms on corrosion inhibitors can form covalent bonds with copper during electrolytic etching process, which can be adsorbed on sidewall of PCB fine lines to form a dense protective film, thereby inhibiting undercut of PCB fine lines. Quantum chemical calculations show that four corrosion inhibitor molecules tend to be parallel to copper surface and adsorb on copper surface in an optimal form. COMSOL Multiphysics simulation revealed that there is a significant difference in the amount of corrosion inhibitor adsorbed on sidewall of the fine line and the etching area. Originality/value As a clean production technology, electrolytic etching method has a good development indicator for the production of high-quality fine lines in PCB industry in the future. And it is of great significance in saving resources and reducing environmental pollution.

High quality factor fractal inductor with complementary split-ring array inclusion

Circuit World ◽  
2020 ◽  
Vol 46 (3) ◽  
pp. 215-219
Author(s):  
Akhendra Kumar Padavala ◽  
Narayana Kiran Akondi ◽  
Bheema Rao Nistala
Keyword(s):  
Quality Factor ◽  
Circuit Design ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Three Dimensional ◽  
Circuit Board ◽  
Integrated Circuit Design ◽  
Split Ring ◽  
Content Type ◽  
Practical Implications

Purpose This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface. Design/methodology/approach Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value. Findings The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally. Practical implications The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design. Originality/value Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.

scholarly journals Implementation and Experimental Verification of Smart Junction Box for Low-Voltage Automotive Electronics in Electric Vehicles

2020 ◽  
Vol 10 (7) ◽  
pp. 2214
Author(s):  
Sang Wook Lee ◽  
Soo-Whang Baek
Keyword(s):  
Electric Vehicles ◽  
Printed Circuit Board ◽  
Pulse Width Modulation ◽  
Low Voltage ◽  
Short Circuit ◽  
Circuit Board ◽  
Area Network ◽  
Automotive Electronics ◽  
Overload Protection ◽  
The Impact

In this study, we designed and implemented a smart junction box (SJB) that was optimized for supplying power to low-voltage headlights (13.5 V) in electric vehicles. The design incorporated a number of automotive semiconductor devices, and components were placed in a high-density arrangement to reduce the overall size of the final design. The heat generated by the SJB was efficiently managed to mount an Intelligent Power Switch (IPS), which was used to power the headlights onto the printed circuit board (PCB) to minimize the impact on other components. The SJB was designed to provide power to the headlights via pulse width modulation to extend their lifetime. In addition, overload protection and fail/safe functions were implemented in the software to improve the stability of the system, and a controller area network (CAN) bus was provided for communications with various components in the SJB as well as with external controllers. The performance of the SJB was validated via a load operation test to assess the short circuit and overload protection functions, and the output duty cycle was evaluated across a range of input voltages to ensure proper operation. Based on our results, the power supplied to the headlights was found to be uniform and stable.

scholarly journals Advances in pressure sensing for vapour phase soldering process monitoring

2019 ◽  
Vol 31 (3) ◽  
pp. 169-175 ◽  
Author(s):  
Mohamed Amine Alaya ◽  
Attila Geczy ◽  
Balazs Illes ◽  
Gábor Harsányi ◽  
David Bušek
Keyword(s):  
Process Control ◽  
Printed Circuit Board ◽  
Pressure Sensors ◽  
Vapour Phase ◽  
Circuit Board ◽  
Power Functions ◽  
Monitoring Method ◽  
Content Type ◽  
Precise Control ◽  
Soldering Process

Purpose The purpose of the paper is to improve the control of vapour phase soldering (VPS). To enable better productivity and assembling quality, the industry needs to provide precise control and measurements during assembling. In the paper, a special monitoring method is presented for VPS to enable improved process control and oven state identification. Design/methodology/approach The work presents the investigation of the workspace with dynamic and gage type pressure sensors in fusion with thermocouples. Different sensors were evaluated to find an appropriate type. The relation between the temperature and the pressure was investigated, according to the setup of the oven. The effect of inserting a printed circuit board (PCB) on the pressure of the vapour inside the oven was also investigated with the pressure/power functions. Findings It was found that the novel gage-type sensors enable better precision than solutions seen in previous literature. The sensors are able to monitor the decreasing vapour concentration when a PCB is inserted to the workspace. It was found that there is a suggested minimum power to sustain a well-developed vapour column for soldering in saturated vapour. An inflexion point highlights this in the pressure/power function, in accordance with the temperature/power curve. Originality/value The research presents original works with aspects of a novel sensor fusion concept and work space monitoring for better process control and improved soldering quality.

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