Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions

2019 ◽  
Vol 15 (2) ◽  
pp. 353-364 ◽  
Author(s):  
Lijuan Huang ◽  
Zhenghu Zhu ◽  
Hiarui Wu ◽  
Xu Long
Keyword(s):  
Failure Mode ◽  
Vapor Phase ◽  
Electronic Devices ◽  
Void Formation ◽  
Bulk Solder ◽  
Vacuum Condition ◽  
Lead Free ◽  
Shear Tests ◽  
Content Type ◽  
Soldering Temperature

Purpose Vapor phase soldering (VPS), also known as condense soldering, is capable of improving the mechanical reliability of solder joints in electronic packaging structures. The paper aims to discuss this issue. Design/methodology/approach In the present study, VPS is utilized to assemble two typical packaging types (i.e. ceramic column grid array (CCGA) and BGA) for electronic devices with lead-containing and lead-free solders. By applying the peak soldering temperatures of 215°C and 235°C with and without vacuum condition, the void formation and intermetallic compound (IMC) thickness are compared for different packaging structures with lead-containing and lead-free solder alloys. Findings It is found that at the soldering temperature of 215°C, CCGA under a vacuum condition has fewer voids but BGA without vacuum environment has fewer voids despite of the existence of lead in solder alloy. In light of contradictory phenomenon about void formation at 215°C, a similar CCGA device is soldered via VPS at the temperature of 235°C. Compared with the size of voids formed at 215°C, no obvious void is found for CCGA with vacuum at the soldering temperature of 235°C. No matter what soldering temperature and vacuum condition are applied, the IMC thickness of CCGA and BGA can satisfy the requirement of 1.0–3.0 µm. Therefore, it can be concluded that the soldering temperature of 235°C in vacuum is the optimal VPS condition for void elimination. In addition, shear tests at the rate of 10 mm/min are performed to examine the load resistance and potential failure mode. In terms of failure mode observed in shear tests, interfacial shear failure occurs between PCB and bulk solder and also within bulk solder for CCGA soldered at temperatures of 215°C and 235°C. This means that an acceptable thicker IMC thickness between CCGA solder and device provides greater interfacial strength between CCGA and device. Originality/value Due to its high I/O capacity and satisfactory reliability in electrical and thermal performance, CCGA electronic devices have been widely adopted in the military and aerospace fields. In the present study, the authors utilized VPS to assemble a typical type of CCGA with the control package of conventional BGA to investigate the relation between essential condition (i.e. soldering temperature and vacuum) to void formation.

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Xiuqi Wang ◽  
Fenglian Sun ◽  
Bangyao Han ◽  
Yilun Cao ◽  
Jinyang Du ◽  
...  
Keyword(s):  
High Temperature ◽  
Copper Substrate ◽  
Contact Angles ◽  
Alloying Elements ◽  
Lead Free ◽  
Content Type ◽  
Soldering Temperature ◽  
Solder Balls ◽  
Lead Free Solders ◽  
Wetting Behaviors

Purpose The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability. Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints. Findings The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC. Originality/value This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

Corrosion-induced tin whisker growth in electronic devices: a review

2017 ◽  
Vol 29 (1) ◽  
pp. 59-68 ◽  
Author(s):  
Balázs Illés ◽  
Barbara Horváth ◽  
Attila Géczy ◽  
Olivér Krammer ◽  
Karel Dušek
Keyword(s):  
Literature Review ◽  
Whisker Growth ◽  
Electronic Devices ◽  
Lead Free ◽  
Future Research ◽  
Tin Whisker ◽  
Content Type ◽  
The Past ◽  
Surface Finishes ◽  
Inducing Factors

Purpose The aim of this paper is to present a review of the tin whisker growth phenomena. The study focuses mainly on whisker growth in a corrosive climate when the main inducing factor of the whisker growth is oxidation. The tin whisker phenomenon is still a big challenge in lead-free reflow soldering technology. Modern lead-free alloys and surface finishes with high tin content are considered to be possible sources of whisker development, also the evolution of electronic devices towards further complexity and miniaturization points to an escalation of the reliability risks. Design/methodology/approach The present work was based on a worldwide literature review of the substantial previous works in the past decade, as well as on the results and experience of the authors in this field. Findings The effect of corrosion on tin whisker growth has been under-represented in reports of mainstream research; however, in the past five years, significant results were obtained in the field which raised the corrosion phenomena from being a side effect category into one of the main inducing factors. This paper summarizes the most important findings of this field. Practical implications This literature review provides engineers and researchers with a better understanding of the role of corrosion in tin whisker growth and the current challenges in tin whisker mitigation. Originality/value The unique challenges and future research directions about the tin whisker phenomenon were shown to highlight rarely discussed risks and problems in lead-free soldering reliability.

Fuzzy risk assessment for electro-optical target tracker

2016 ◽  
Vol 33 (6) ◽  
pp. 830-851 ◽  
Author(s):  
Soumen Kumar Roy ◽  
A K Sarkar ◽  
Biswajit Mahanty
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Linear Equations ◽  
Mode Analysis ◽  
Failure Behavior ◽  
Membership Functions ◽  
Design And Development ◽  
Effect Analysis ◽  
Content Type ◽  
Criticality Analysis

Purpose – The purpose of this paper is to evolve a guideline for scientists and development engineers to the failure behavior of electro-optical target tracker system (EOTTS) using fuzzy methodology leading to success of short-range homing guided missile (SRHGM) in which this critical subsystems is exploited. Design/methodology/approach – Technology index (TI) and fuzzy failure mode effect analysis (FMEA) are used to build an integrated framework to facilitate the system technology assessment and failure modes. Failure mode analysis is carried out for the system using data gathered from technical experts involved in design and realization of the EOTTS. In order to circumvent the limitations of the traditional failure mode effects and criticality analysis (FMECA), fuzzy FMCEA is adopted for the prioritization of the risks. FMEA parameters – severity, occurrence and detection are fuzzifed with suitable membership functions. These membership functions are used to define failure modes. Open source linear programming solver is used to solve linear equations. Findings – It is found that EOTTS has the highest TI among the major technologies used in the SRHGM. Fuzzy risk priority numbers (FRPN) for all important failure modes of the EOTTS are calculated and the failure modes are ranked to arrive at important monitoring points during design and development of the weapon system. Originality/value – This paper integrates the use of TI, fuzzy logic and experts’ database with FMEA toward assisting the scientists and engineers while conducting failure mode and effect analysis to prioritize failures toward taking corrective measure during the design and development of EOTTS.

scholarly journals Protein Nanowires: the Electrification of the Microbial World and Maybe Our Own

2020 ◽  
Vol 202 (20) ◽  
Author(s):  
Derek R. Lovley ◽  
Dawn E. Holmes
Keyword(s):  
Electron Transport ◽  
Long Range ◽  
Electronic Devices ◽  
Electricity Production ◽  
Microbial World ◽  
Electrically Conductive ◽  
Anaerobic Digesters ◽  
Content Type ◽  
Type Iv ◽  
Type Iv Pilin

ABSTRACT Electrically conductive protein nanowires appear to be widespread in the microbial world and are a revolutionary “green” material for the fabrication of electronic devices. Electrically conductive pili (e-pili) assembled from type IV pilin monomers have independently evolved multiple times in microbial history as have electrically conductive archaella (e-archaella) assembled from homologous archaellin monomers. A role for e-pili in long-range (micrometer) extracellular electron transport has been demonstrated in some microbes. The surprising finding of e-pili in syntrophic bacteria and the role of e-pili as conduits for direct interspecies electron transfer have necessitated a reassessment of routes for electron flux in important methanogenic environments, such as anaerobic digesters and terrestrial wetlands. Pilin monomers similar to those found in e-pili may also be a major building block of the conductive “cables” that transport electrons over centimeter distances through continuous filaments of cable bacteria consisting of a thousand cells or more. Protein nanowires harvested from microbes have many functional and sustainability advantages over traditional nanowire materials and have already yielded novel electronic devices for sustainable electricity production, neuromorphic memory, and sensing. e-pili can be mass produced with an Escherichia coli chassis, providing a ready source of material for electronics as well as for studies on the basic mechanisms for long-range electron transport along protein nanowires. Continued exploration is required to better understand the electrification of microbial communities with microbial nanowires and to expand the “green toolbox” of sustainable materials for wiring and powering the emerging “Internet of things.”

Organic vapor phase deposition for the growth of large area organic electronic devices

2009 ◽  
Vol 95 (23) ◽  
pp. 233305 ◽  
Author(s):  
Richard R. Lunt ◽  
Brian E. Lassiter ◽  
Jay B. Benziger ◽  
Stephen R. Forrest
Keyword(s):  
Vapor Phase ◽  
Electronic Devices ◽  
Large Area ◽  
Organic Electronic Devices ◽  
Organic Electronic ◽  
Organic Vapor ◽  
Vapor Phase Deposition ◽  
Organic Vapor Phase Deposition

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Complaint management model of manufacturing products using text mining and potential failure identification

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ririn Diar Astanti ◽  
Ivana Carissa Sutanto ◽  
The Jin Ai
Keyword(s):  
Quality Management ◽  
Text Mining ◽  
Failure Mode ◽  
Management System ◽  
Main Part ◽  
Mining Method ◽  
Content Type ◽  
Complaint Management ◽  
Potential Failure ◽  
Failure Identification

PurposeThis paper aims to propose a framework on complaint management system for quality management by applying the text mining method and potential failure identification that can support organization learning (OL). Customer complaints in the form of email text is the input of the framework, while the most frequent complaints are visualized using a Pareto diagram. The company can learn from this Pareto diagram and take action to improve their process.Design/methodology/approachThe first main part of the framework is creating a defect database from potential failure identification, which is the initial part of the failure mode and effect analysis technique. The second main part is the text mining of customer email complaints. The last part of the framework is matching the result of text mining with the defect database and presenting in the form of a Pareto diagram. After the framework is proposed, a case study is conducted to illustrate the applicability of the proposed method.FindingsBy using the defect database, the framework can interpret the customer email complaints into the list of most defect complained by customer using a Pareto diagram. The results of the Pareto diagram, based on the results of text mining of consumer complaints via email, can be used by a company to learn from complaint and to analyze the potential failure mode. This analysis helps company to take anticipatory action for avoiding potential failure mode happening in the future.Originality/valueThe framework on complaint management system for quality management by applying the text mining method and potential failure identification is proposed for the first time in this paper.

Failure mode, effects and criticality analysis improvement by using new criticality assessment and prioritization based approach

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ammar Chakhrit ◽  
Mohammed Chennoufi
Keyword(s):  
Failure Mode ◽  
Conventional Method ◽  
Fuzzy Inference System ◽  
Risk Evaluation ◽  
Failure Modes ◽  
Fuzzy Inference ◽  
Decision Makers ◽  
Inference System ◽  
Content Type ◽  
Criticality Analysis

Purpose This paper aims to enable the analysts of reliability and safety system to assess the criticality and prioritize failure modes perfectly to prefer actions for controlling the risks of undesirable scenarios. Design/methodology/approach To resolve the challenge of uncertainty and ambiguous related to the parameters, frequency, non-detection and severity considered in the traditional approach failure mode effect and criticality analysis (FMECA) for risk evaluation, the authors used fuzzy logic where these parameters are shown as members of a fuzzy set, which fuzzified by using appropriate membership functions. The adaptive neuro-fuzzy inference system process is suggested as a dynamic, intelligently chosen model to ameliorate and validate the results obtained by the fuzzy inference system and effectively predict the criticality evaluation of failure modes. A new hybrid model is proposed that combines the grey relational approach and fuzzy analytic hierarchy process to improve the exploitation of the FMECA conventional method. Findings This research project aims to reflect the real case study of the gas turbine system. Using this analysis allows evaluating the criticality effectively and provides an alternate prioritizing to that obtained by the conventional method. The obtained results show that the integration of two multi-criteria decision methods and incorporating their results enable to instill confidence in decision-makers regarding the criticality prioritizations of failure modes and the shortcoming concerning the lack of established rules of inference system which necessitate a lot of experience and shows the weightage or importance to the three parameters severity, detection and frequency, which are considered to have equal importance in the traditional method. Originality/value This paper is providing encouraging results regarding the risk evaluation and prioritizing failures mode and decision-makers guidance to refine the relevance of decision-making to reduce the probability of occurrence and the severity of the undesirable scenarios with handling different forms of ambiguity, uncertainty and divergent judgments of experts.

Sign in / Sign up

Export Citation Format

Share Document