scholarly journals Multi-material additive and subtractive prosumer digital fabrication with a free and open-source convertible delta RepRap 3-D printer

2015 ◽  
Vol 21 (5) ◽  
pp. 506-519 ◽  
Author(s):  
Gerald C. Anzalone ◽  
Bas Wijnen ◽  
Joshua M. Pearce
Keyword(s):  
Open Source ◽  
Printed Circuit Boards ◽  
Digital Fabrication ◽  
Circuit Boards ◽  
Distributed Manufacturing ◽  
Fused Filament Fabrication ◽  
Content Type ◽  
Capital Costs ◽  
Financial Investments ◽  
Paste Extrusion

Purpose – The purpose of this paper is to present novel modifications to a RepRap design that increase RepRap capabilities well beyond just fused filament fabrication. Open-source RepRap 3-D printers have made distributed manufacturing and prototyping an affordable reality. Design/methodology/approach – The design is a significantly modified derivative of the Rostock delta-style RepRap 3-D printer. Modifications were made that permit easy and rapid repurposing of the platform for milling, paste extrusion and several other applications. All of the designs are open-source and freely available. Findings – In addition to producing fused filament parts, the platform successfully produced milled printed circuit boards, milled plastic objects, objects made with paste extrudates, such as silicone, food stuffs and ceramics, pen plotted works and cut vinyl products. The multi-purpose tool saved 90-97 per cent of the capital costs of functionally equivalent dedicated tools. Research limitations/implications – While the platform was used primarily for production of hobby and consumer goods, research implications are significant, as the tool is so versatile and the fact that the designs are open-source and eminently available for modification for more purpose-specific applications. Practical implications – The platform vastly broadens capabilities of a RepRap machine at an extraordinarily low price, expanding the potential for distributed manufacturing and prototyping of items that heretofore required large financial investments. Originality/value – The unique combination of relatively simple modifications to an existing platform has produced a machine having capabilities far exceeding that of any single commercial product. The platform provides users the ability to work with a wide variety of materials and fabrication methods at a price of less than $1,000, provided users are willing to build the machine themselves.

Path optimization of CNC PCB drilling using hybrid Taguchi genetic algorithm

Kybernetes ◽  
2016 ◽  
Vol 45 (1) ◽  
pp. 107-125 ◽  
Author(s):  
Dony Hidayat Al-Janan ◽  
Tung-Kuan Liu
Keyword(s):  
Genetic Algorithm ◽  
Printed Circuit Boards ◽  
Numerical Control ◽  
Circuit Boards ◽  
Improved Genetic Algorithm ◽  
Solution Quality ◽  
Content Type ◽  
Neighbor Search ◽  
Feasible Solutions ◽  
The Traveling Salesman Problem

Purpose – In this study, the hybrid Taguchi genetic algorithm (HTGA) was used to optimize the computer numerical control-printed circuit boards drilling path. The optimization was performed by searching for the shortest route for the drilling path. The number of feasible solutions is exponentially related to the number of hole positions. The paper aims to discuss these issues. Design/methodology/approach – Therefore, a traveling cutting tool problem (TCP), which is similar to the traveling salesman problem, was used to evaluate the drilling path; this evaluation is considered an NP-hard problem. In this paper, an improved genetic algorithm embedded in the Taguchi method and a neighbor search method are proposed for improving the solution quality. The classical TCP problems proposed by Lim et al. (2014) were used for validating the performance of the proposed algorithm. Findings – Results showed that the proposed algorithm outperforms a previous study in robustness and convergence speed. Originality/value – The HTGA has not been used for optimizing the drilling path. This study shows that the HTGA can be applied to complex problems.

scholarly journals Prospects of applying 3-D printing to economics of remote communities

2018 ◽  
Vol 12 (4) ◽  
pp. 488-509 ◽  
Author(s):  
Svetlana Obydenkova ◽  
Nicholas C. Anzalone ◽  
Joshua M. Pearce
Keyword(s):  
Open Source ◽  
Case Studies ◽  
Raw Materials ◽  
Economic Feasibility ◽  
Environmental Benefits ◽  
Remote Communities ◽  
Fused Filament Fabrication ◽  
Content Type ◽  
Climate Conditions ◽  
Reindeer Herder

Purpose Isolated communities face a variety of inconveniences including severe remoteness, poor roads and extreme climate conditions, resulting in the lack of security of supply chains and exorbitant prices for cargo delivery. This paper aims to investigate the present advantages and prospects of applying 3-D printing to improve economics and everyday life of remote communities, reindeer herder case taken as an example. Design/methodology/approach This study covers the use of a low-cost open-source 3-D printer (RepRap) capable of fused filament fabrication to reduce operating costs for nomadic reindeer herder groups. Three case studies are provided for reindeer-specific applications to probe economic and technical viability of the technology, namely, ear-tags, electric fence components and lasso accessories. Findings 3-D printed objects feature technical characteristics similar to those of analogues available on the market while reducing the price by 63 per cent. Distributed 3-D printing reduces the cost of raw materials by 68 per cent and shipping costs by 50 because of lower trip frequency. If all reindeer herders globally were to adopt distributed manufacturing of the three aforementioned sample items only, their annual savings from such solution would amount to US$2m. The paper discovers other economic, entrepreneurial, technical and environmental opportunities offered by 3-D printing put to service the needs of remote communities. Research limitations As the paper is the first-ever study of 3-D printing potential applied to the reindeer husbandry case, it is based on a more thorough analysis of the techno-economic feasibility of the technology, while cultural and entrepreneurial factors have been discussed as preconditions only. Practical implications The paper might serve as a valuable source of information for entrepreneurs, as well as for students and academics for further case studies in this area. Originality/value In remote conditions, 3-D printing offers a more sustainable way of good manufacturing. Numerous open source designs already available for specialists, financial effectiveness, environmental benefits and vast opportunities for entrepreneurs are among the most promising advantages of the technology.

Experimental measurements of the shear force on surface mount components simulating the wave soldering process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Violeta Carvalho ◽  
Bruno Arcipreste ◽  
Delfim Soares ◽  
Luís Ribas ◽  
Nelson Rodrigues ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Deep Understanding ◽  
Critical Issue ◽  
Circuit Boards ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Wave Soldering ◽  
Pull Out ◽  
Minimum Force

Purpose This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

Non-destructive detection methods for discontinuities of interconnection structures

2016 ◽  
Vol 33 (1) ◽  
pp. 23-35 ◽  
Author(s):  
Tomas Blecha
Keyword(s):  
Transmission Lines ◽  
Printed Circuit Boards ◽  
Characteristic Impedance ◽  
Diagnostic Methods ◽  
Detection Methods ◽  
Circuit Boards ◽  
Content Type ◽  
Multiple Line ◽  
Detection And Localization ◽  
Non Destructive

Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Circuit World ◽  
2015 ◽  
Vol 41 (3) ◽  
pp. 121-124
Author(s):  
Wojciech Stęplewski ◽  
Mateusz Mroczkowski ◽  
Radoslav Darakchiev ◽  
Konrad Futera ◽  
Grażyna Kozioł
Keyword(s):  
Printed Circuit Boards ◽  
New Technologies ◽  
Circuit Board ◽  
Circuit Boards ◽  
Content Type ◽  
Signal Distribution ◽  
Printed Circuit ◽  
Rapid Design ◽  
Small Pitch ◽  
Signal Path

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

2015 ◽  
Vol 27 (1) ◽  
pp. 31-44 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Boards ◽  
Molten Solder ◽  
Circuit Boards ◽  
Fluid Structure ◽  
Content Type ◽  
Thermally Induced ◽  
C Language ◽  
Soldering Process ◽  
Wave Soldering

Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach – The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results. Findings – Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress. Practical implications – This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry. Originality/value – This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.

Influence of the cavities on the PCB mechanical properties

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 76-79
Author(s):  
Boleslav Psota ◽  
Alexandr Otáhal ◽  
Ivan Szendiuch
Keyword(s):  
Mechanical Properties ◽  
Resonant Frequency ◽  
Design Methodology ◽  
Printed Circuit Boards ◽  
Measured Data ◽  
Circuit Boards ◽  
Frequency Range ◽  
Content Type ◽  
Printed Circuit ◽  
Acceleration Amplitude

Purpose – The main aim of this paper is to investigate the influence of the cavity coverage on the printed circuit boards (PCB) to the resonant frequency, acceleration and displacement. Design/methodology/approach – Tests were realized on four PCBs with different cavity areas. Frequency range of tests was between 10 and 2,000 Hz with 0.3 g acceleration amplitude. In addition, more simulations were performed to check different setups of the boards. Findings – From the calculated and measured data, it is clear that with the larger cavity area the resonance frequency drops. In case a greater number of components placed in cavities are needed on board, it is appropriate to use multiple smaller cavities than the bigger ones. Originality/value – Results in this paper could be very useful for PCB manufacturers and designers during designing of the new PCBs with cavities for dipped components.

Enhancement of luminous flux of InGaAlP-based low-power SMD LEDs using substrates with different thermal resistances

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Muna Ezzi Raypah ◽  
Shahrom Mahmud ◽  
Mutharasu Devarajan ◽  
Anoud AlShammari
Keyword(s):  
Low Power ◽  
Printed Circuit Boards ◽  
Thermal Characteristics ◽  
Input Power ◽  
Luminous Flux ◽  
Optical Parameters ◽  
Circuit Boards ◽  
Aluminum Phosphide ◽  
Content Type ◽  
Light Emitting

Purpose Optimization of light-emitting diodes’ (LEDs’) design together with long-term reliability is directly correlated with their photometric, electric and thermal characteristics. For a given thermal layout of the LED system, the maximum luminous flux occurs at an optimal electrical input power and can be determined using a photo-electro-thermal (PET) theory. The purpose of this study is to extend the application of the luminous flux equation in PET theory for low-power (LP) LEDs. Design/methodology/approach LP surface-mounted device LEDs were mounted on substrates of different thermal resistances. Three LEDs were attached to substrates which were flame-retardant fiberglass epoxy (FR4) and two aluminum-based metal core printed circuit boards (MCPCBs) with thermal conductivities of about 1.0 W/m.K, 2.0 W/m.K and 5.0 W/m.K, respectively. The conjunction of thermal transient tester and thermal and radiometric characterization of LEDs system was used to measure the thermal and optical parameters of the LEDs at a certain range of input current and temperature. Findings The validation of the extended application of the luminous flux equation was confirmed via a good agreement between the practical and theoretical results. The outcomes show that the optimum luminous flux is 25.51, 31.91 and 37.01 lm for the LEDs on the FR4 and the two MCPCBs, respectively. Accordingly, the stipulated maximum electrical input power in the LED datasheet (0.185 W) is shifted to 0.6284, 0.6963 and 0.8838 W between the three substrates. Originality/value Using a large number of LP LEDs is preferred than high-power (HP) LEDs for the same system power to augment the heat transfer and provide a higher luminous flux. The PET theory equations have been applied to HP LEDs using heatsinks with various thermal resistances. In this work, the PET theory luminous flux equation was extended to be used for Indium Gallium Aluminum Phosphide LP LEDs attached to the substrates with dissimilar thermal resistances.

Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates

Circuit World ◽  
2017 ◽  
Vol 43 (1) ◽  
pp. 9-12 ◽  
Author(s):  
Aneta Arazna ◽  
Kamil Janeczek ◽  
Konrad Futera
Keyword(s):  
Thermal Annealing ◽  
Inkjet Printing ◽  
Printed Circuit Boards ◽  
Flexible Substrate ◽  
Flexible Substrates ◽  
Circuit Boards ◽  
Electronic Circuits ◽  
Content Type ◽  
Printed Circuit ◽  
Kapton Foil

Purpose This paper aims to present the results of investigations of inkjet-printed electronic circuits fabricated on a flexible substrate (KAPTON foil) using silver nanoparticles ink. Design/methodology/approach Fully inkjet-printed conductive circuit tracks were printed on a flexible, transparent KAPTON foil, using a commercial 40LT-15 C nanosilver ink as well as a PixDro LP50 inkjet printer with KonicaMinnolta 512 printhead. After cure, electrical properties by resistance measurements and printing quality by optical and SEM microscopic observation of conductive tracks were examined. Afterwards, the tested samples were annealed for 1, 2 and 3 h at 150°C or subjected to cycling bending. Findings It was found that silver nanoparticles ink could be used for the preparation of electronic circuits using the inkjet printing technique. The obtained patterns had appropriate mapping and good quality. It was also noticed that thermal annealing caused a decrease in resistivity values of the tested lines irrespective of their width. Approximately 34 per cent decrease was achieved in the values of resistivity of all the tested lines after the first hour of thermal annealing. After the second hour, the values of resistivity decreased by another 50 per cent. There were no visible changes in resistivity values after 1,000 cycles of bending. Originality/value In this paper, the results of thermal annealing and bending tests of inkjet-printed silver nanoparticle conductive tracks on flexible substrate were presented. That is very important information for producing printed circuit boards using ecological, rapid and low-cost inkjet printing techniques, particularly during the production of printed circuit boards on flexible substrates working in different conditions of mechanical and thermal stresses.

Identification of printed circuit boards mechanical properties using response surface methods

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mohammad Gharaibeh
Keyword(s):  
Finite Element ◽  
Response Surface ◽  
Material Properties ◽  
Printed Circuit Boards ◽  
Dynamic Testing ◽  
Mode Shapes ◽  
Fe Model ◽  
Circuit Boards ◽  
Content Type ◽  
Printed Circuit

Purpose This study aims to discuss the determination of the unknown in-plane mechanical material properties of printed circuit boards (PCBs) by correlating the results from dynamic testing and finite element (FE) models using the response surface method (RSM). Design/methodology/approach The first 10 resonant frequencies and vibratory mode shapes are measured using modal analysis with hammer testing experiment, and hence, systematically compared with finite element analysis (FEA) results. The RSM is consequently used to minimize the cumulative error between dynamic testing and FEA results by continuously modifying the FE model, to acquire material properties of PCBs. Findings Great agreement is shown when comparing FEA to measurements, the optimum in-plane material properties were identified, and hence, verified. Originality/value This paper used FEA and RSMs along with modal measurements to obtain in-plane material properties of PCBs. The methodology presented here can be easily generalized and repeated for different board designs and configurations.

Sign in / Sign up

Export Citation Format

Share Document