Path optimization of CNC PCB drilling using hybrid Taguchi genetic algorithm

Kybernetes ◽  
2016 ◽  
Vol 45 (1) ◽  
pp. 107-125 ◽  
Author(s):  
Dony Hidayat Al-Janan ◽  
Tung-Kuan Liu
Keyword(s):  
Genetic Algorithm ◽  
Printed Circuit Boards ◽  
Numerical Control ◽  
Circuit Boards ◽  
Improved Genetic Algorithm ◽  
Solution Quality ◽  
Content Type ◽  
Neighbor Search ◽  
Feasible Solutions ◽  
The Traveling Salesman Problem

Purpose – In this study, the hybrid Taguchi genetic algorithm (HTGA) was used to optimize the computer numerical control-printed circuit boards drilling path. The optimization was performed by searching for the shortest route for the drilling path. The number of feasible solutions is exponentially related to the number of hole positions. The paper aims to discuss these issues. Design/methodology/approach – Therefore, a traveling cutting tool problem (TCP), which is similar to the traveling salesman problem, was used to evaluate the drilling path; this evaluation is considered an NP-hard problem. In this paper, an improved genetic algorithm embedded in the Taguchi method and a neighbor search method are proposed for improving the solution quality. The classical TCP problems proposed by Lim et al. (2014) were used for validating the performance of the proposed algorithm. Findings – Results showed that the proposed algorithm outperforms a previous study in robustness and convergence speed. Originality/value – The HTGA has not been used for optimizing the drilling path. This study shows that the HTGA can be applied to complex problems.

Experimental measurements of the shear force on surface mount components simulating the wave soldering process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Violeta Carvalho ◽  
Bruno Arcipreste ◽  
Delfim Soares ◽  
Luís Ribas ◽  
Nelson Rodrigues ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Deep Understanding ◽  
Critical Issue ◽  
Circuit Boards ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Wave Soldering ◽  
Pull Out ◽  
Minimum Force

Purpose This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

Optimized Crossover JumpX in Genetic Algorithm for General Routing Problems

2018 ◽  
pp. 205-230
Author(s):  
Hicham El Hassani ◽  
Said Benkachcha ◽  
Jamal Benhra
Keyword(s):  
Genetic Algorithm ◽  
Optimization Methods ◽  
Search Space ◽  
Optimal Solutions ◽  
Solution Quality ◽  
Path Representation ◽  
Representation Technique ◽  
Hard Problems ◽  
The Traveling Salesman Problem

Inspired by nature, genetic algorithms (GA) are among the greatest meta-heuristics optimization methods that have proved their effectiveness to conventional NP-hard problems, especially the traveling salesman problem (TSP) which is one of the most studied Supply chain management problems. This paper proposes a new crossover operator called Jump Crossover (JMPX) for solving the travelling salesmen problem using a genetic algorithm (GA) for near-optimal solutions, to conclude on its efficiency compared to solutions quality given by other conventional operators to the same problem, namely, Partially matched crossover (PMX), Edge recombination Crossover (ERX) and r-opt heuristic with consideration of computational overload. We adopt the path representation technique for our chromosome which is the most direct representation and a low mutation rate to isolate the search space exploration ability of each crossover. The experimental results show that in most cases JMPX can remarkably improve the solution quality of the GA compared to the two existing classic crossover approaches and the r-opt heuristic.

An Educational Scheme for a CNC Drilling Machine

2012 ◽  
Vol 2 (2) ◽  
pp. 1-11 ◽  
Author(s):  
Salah Haridy ◽  
Zhang Wu ◽  
Amro Shafik
Keyword(s):  
Printed Circuit Boards ◽  
Numerical Data ◽  
Numerical Control ◽  
Electronic Systems ◽  
Parallel Port ◽  
Circuit Boards ◽  
Cnc Machine ◽  
Printed Circuit ◽  
Stepper Motors ◽  
C Program

Computer numerical control (CNC) involves machines controlled by electronic systems designed to accept numerical data and other instructions, usually in a coded form. CNC machines are more productive than conventional equipment and consequently produce parts at less cost and higher accuracy even when the higher investment is considered. This article proposes an educational scheme for designing a CNC machine for drilling printed circuit boards (PCB) holes with small diameters. The machine consists of three-independently move-fully controlled tables. Output pulses from the personal computer (PC) parallel port are used to control the machine after processing by an interface card. A flexible, responsive and real-time visual C # program is developed to control the motion of the stepper motors. The educational scheme proposed in this article can provide engineers and students in academic institutions with a simple foundation to efficiently build a CNC machine based on the available resources.

Application of an Improved Genetic Algorithm with the Search Space Compression in TSP

2013 ◽  
Vol 765-767 ◽  
pp. 687-689
Author(s):  
Yi Song ◽  
Ni Ni Wei
Keyword(s):  
Genetic Algorithm ◽  
Traveling Salesman Problem ◽  
Random Search ◽  
Search Space ◽  
Traveling Salesman ◽  
Improved Genetic Algorithm ◽  
Space Compression ◽  
Accelerate Convergence ◽  
The Traveling Salesman Problem ◽  
Exponential Relation

The Traveling Salesman Problem is a combinatorial optimization problem, the problem has been shown to belong to the NPC problem, the possible solution of Traveling Salesman Problem and the scale of the cities have the exponential relation, so the more bigger of the scale. In this paper, improve the search process of the genetic algorithm by introducing the idea is to compress the search space. The simulation results show that for solving the TSP, the algorithm can quickly obtain multiple high-quality solutions. It can reduce the blindness of random search and accelerate convergence of the algorithm.

Non-destructive detection methods for discontinuities of interconnection structures

2016 ◽  
Vol 33 (1) ◽  
pp. 23-35 ◽  
Author(s):  
Tomas Blecha
Keyword(s):  
Transmission Lines ◽  
Printed Circuit Boards ◽  
Characteristic Impedance ◽  
Diagnostic Methods ◽  
Detection Methods ◽  
Circuit Boards ◽  
Content Type ◽  
Multiple Line ◽  
Detection And Localization ◽  
Non Destructive

Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Circuit World ◽  
2015 ◽  
Vol 41 (3) ◽  
pp. 121-124
Author(s):  
Wojciech Stęplewski ◽  
Mateusz Mroczkowski ◽  
Radoslav Darakchiev ◽  
Konrad Futera ◽  
Grażyna Kozioł
Keyword(s):  
Printed Circuit Boards ◽  
New Technologies ◽  
Circuit Board ◽  
Circuit Boards ◽  
Content Type ◽  
Signal Distribution ◽  
Printed Circuit ◽  
Rapid Design ◽  
Small Pitch ◽  
Signal Path

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

Minimizing assembly variation in selective assembly for auto-body parts based on IGAOT

2018 ◽  
Vol 11 (2) ◽  
pp. 254-268 ◽  
Author(s):  
Yanfeng Xing ◽  
Yansong Wang
Keyword(s):  
Genetic Algorithm ◽  
Sheet Metal ◽  
Rigid Bodies ◽  
Influence Coefficient ◽  
Body Parts ◽  
Selective Assembly ◽  
Improved Genetic Algorithm ◽  
Content Type ◽  
Sheet Metal Parts ◽  
Assembly Tolerance

PurposeDimensional quality of sheet metal assemblies is an important factor for the final product. However, the part tolerance is not easily controlled because of the spring back deformation during the stamping process. Selective assembly is a means to decrease assembly tolerance of the assembly from low-precision components. Therefore, the purpose of this paper is to propose a fully efficient method of selective assembly optimization based on an improved genetic algorithm for optimization toolbox (IGAOT) in MATLAB.Design/methodology/approachThe method of influence coefficient is first applied to calculate the assembly variation of sheet metal components since the traditional rigid assembly variation model cannot be used due to welding deformation. Afterwards, the IGAOT is proposed to generate optimal selective groups, which consists of advantages of genetic algorithm for optimization toolbox (GAOT) and simulated annealing.FindingsThe cases of two simple planes and the tail lamp bracket assembly are used to illustrate the flowchart of optimizing combinations of selective groups. These cases prove that the proposed IGAOT has better precision than that of GAOT with the same parameters for selective assembly.Originality/valueThe research objective of this paper is to evaluate the changes from rigid bodies to sheet metal parts which are very complex for selective assembly. The method of IGAOT was proposed to the selected groups which has better precision than that of current optimization algorithms.

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

2015 ◽  
Vol 27 (1) ◽  
pp. 31-44 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Boards ◽  
Molten Solder ◽  
Circuit Boards ◽  
Fluid Structure ◽  
Content Type ◽  
Thermally Induced ◽  
C Language ◽  
Soldering Process ◽  
Wave Soldering

Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach – The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results. Findings – Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress. Practical implications – This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry. Originality/value – This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.

Influence of the cavities on the PCB mechanical properties

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 76-79
Author(s):  
Boleslav Psota ◽  
Alexandr Otáhal ◽  
Ivan Szendiuch
Keyword(s):  
Mechanical Properties ◽  
Resonant Frequency ◽  
Design Methodology ◽  
Printed Circuit Boards ◽  
Measured Data ◽  
Circuit Boards ◽  
Frequency Range ◽  
Content Type ◽  
Printed Circuit ◽  
Acceleration Amplitude

Purpose – The main aim of this paper is to investigate the influence of the cavity coverage on the printed circuit boards (PCB) to the resonant frequency, acceleration and displacement. Design/methodology/approach – Tests were realized on four PCBs with different cavity areas. Frequency range of tests was between 10 and 2,000 Hz with 0.3 g acceleration amplitude. In addition, more simulations were performed to check different setups of the boards. Findings – From the calculated and measured data, it is clear that with the larger cavity area the resonance frequency drops. In case a greater number of components placed in cavities are needed on board, it is appropriate to use multiple smaller cavities than the bigger ones. Originality/value – Results in this paper could be very useful for PCB manufacturers and designers during designing of the new PCBs with cavities for dipped components.

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