Characterization and simulation for 2.5-D interposer

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383671 ◽

2015 ◽

Cited By ~ 1

Author(s):

Chung-Long Pan ◽

Yu-Jung Huang ◽

Chun-Yi Wang

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