2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications

TOTAL DOCUMENTS

65

(FIVE YEARS 0)

H-INDEX

5

(FIVE YEARS 0)

Published By IEEE

9781467380997

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Power distribution network design and optimization based on frequency dependent target impedance

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383675 ◽

2015 ◽

Author(s):

Youngwoo Kim ◽

Kiyeong Kim ◽

Jonghyun Cho ◽

Joungho Kim ◽

Kibum Kang ◽

...

Keyword(s):

Network Design ◽

Power Distribution ◽

Distribution Network ◽

Power Distribution Network ◽

Frequency Dependent ◽

Design And Optimization ◽

Distribution Network Design

Download Full-text

Analysis of illuminated bent microstrip line based on Baum-Liu-Tesche (BLT) equation

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383691 ◽

2015 ◽

Author(s):

Sheng-Jie Guo ◽

Lin-Sheng Wu ◽

Min Tang ◽

Jun-Fa Mao

Keyword(s):

Microstrip Line

Download Full-text

Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383697 ◽

2015 ◽

Author(s):

Kyungjun Cho ◽

Hyunsuk Lee ◽

Heegon Kim ◽

Sumin Choi ◽

Youngwoo Kim ◽

...

Keyword(s):

Design Optimization ◽

Signal Integrity ◽

Download Full-text

Characterization and simulation for 2.5-D interposer

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383671 ◽

2015 ◽

Author(s):

Chung-Long Pan ◽

Yu-Jung Huang ◽

Chun-Yi Wang

Download Full-text

Power and ground co-reference design for 16-32Gbps transceiver packages

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383706 ◽

2015 ◽

Author(s):

Siow Chek Tan ◽

Hong Shi ◽

Sarajuddin Niazi

Keyword(s):

Reference Design

Download Full-text

Electrical approach to acoustic noise for MLCCs of power delivery network in mobile system

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383668 ◽

2015 ◽

Author(s):

Hyunho Baek ◽

Dongho Yu ◽

Junho Lee ◽

Hwanwoo Shim ◽

Joong-Ho Kim

Keyword(s):

Acoustic Noise ◽

Power Delivery ◽

Mobile System ◽

Power Delivery Network ◽

Delivery Network

Download Full-text

Surface current distribution for PCB PDNGeometry

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383680 ◽

2015 ◽

Author(s):

Biyao Zhao ◽

Siqi Bai ◽

Chenxi Huang ◽

Jun Fan ◽

Albert Ruehli ◽

...

Keyword(s):

Current Distribution ◽

Surface Current ◽

Surface Current Distribution

Download Full-text

A fast statistical eye-diagram estimation method including internal PDN noise of pseudo-differential receiver buffer

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383679 ◽

2015 ◽

Author(s):

Heegon Kim ◽

Sumin Choi ◽

Jonghoon J. Kim ◽

Daniel H. Jung ◽

Hyunsuk Lee ◽

...

Keyword(s):

Estimation Method ◽

Download Full-text

Improved algorithm for delay extraction using Hilbert transform

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383664 ◽

2015 ◽

Author(s):

Jia-Yi Wu ◽

Qian-Hua Jian ◽

Mu-Shui Zhang ◽

Hong-Zhou Tan

Keyword(s):

Hilbert Transform ◽

Delay Extraction ◽

Improved Algorithm

Download Full-text

Virtual metrology for TSV etch depth measurement using optical emission spectroscopy

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383700 ◽

2015 ◽

Author(s):

Ja Myung Gu ◽

Sang Jeen Hong

Keyword(s):

Emission Spectroscopy ◽

Optical Emission Spectroscopy ◽

Optical Emission ◽

Depth Measurement ◽

Virtual Metrology

Download Full-text