2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications

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9781467380997

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Improved algorithm for delay extraction using Hilbert transform

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383664 ◽

2015 ◽

Author(s):

Jia-Yi Wu ◽

Qian-Hua Jian ◽

Mu-Shui Zhang ◽

Hong-Zhou Tan

Keyword(s):

Hilbert Transform ◽

Delay Extraction ◽

Improved Algorithm

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Virtual metrology for TSV etch depth measurement using optical emission spectroscopy

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383700 ◽

2015 ◽

Cited By ~ 1

Author(s):

Ja Myung Gu ◽

Sang Jeen Hong

Keyword(s):

Emission Spectroscopy ◽

Optical Emission Spectroscopy ◽

Optical Emission ◽

Etch Depth ◽

Depth Measurement ◽

Virtual Metrology

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Design of active connector for high speed serial link interconnection

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383692 ◽

2015 ◽

Cited By ~ 2

Author(s):

Bumhee Bae ◽

Junyong Park ◽

Joungho Kim

Keyword(s):

High Speed ◽

Serial Link

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Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383697 ◽

2015 ◽

Cited By ~ 12

Author(s):

Kyungjun Cho ◽

Hyunsuk Lee ◽

Heegon Kim ◽

Sumin Choi ◽

Youngwoo Kim ◽

...

Keyword(s):

Design Optimization ◽

Signal Integrity ◽

High Bandwidth

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Characterization and simulation for 2.5-D interposer

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383671 ◽

2015 ◽

Cited By ~ 1

Author(s):

Chung-Long Pan ◽

Yu-Jung Huang ◽

Chun-Yi Wang

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Power and ground co-reference design for 16-32Gbps transceiver packages

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383706 ◽

2015 ◽

Author(s):

Siow Chek Tan ◽

Hong Shi ◽

Sarajuddin Niazi

Keyword(s):

Reference Design

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Electrical approach to acoustic noise for MLCCs of power delivery network in mobile system

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383668 ◽

2015 ◽

Cited By ~ 2

Author(s):

Hyunho Baek ◽

Dongho Yu ◽

Junho Lee ◽

Hwanwoo Shim ◽

Joong-Ho Kim

Keyword(s):

Acoustic Noise ◽

Power Delivery ◽

Mobile System ◽

Power Delivery Network ◽

Delivery Network

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Surface current distribution for PCB PDNGeometry

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383680 ◽

2015 ◽

Author(s):

Biyao Zhao ◽

Siqi Bai ◽

Chenxi Huang ◽

Jun Fan ◽

Albert Ruehli ◽

...

Keyword(s):

Current Distribution ◽

Surface Current ◽

Surface Current Distribution

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A fast statistical eye-diagram estimation method including internal PDN noise of pseudo-differential receiver buffer

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383679 ◽

2015 ◽

Cited By ~ 1

Author(s):

Heegon Kim ◽

Sumin Choi ◽

Jonghoon J. Kim ◽

Daniel H. Jung ◽

Hyunsuk Lee ◽

...

Keyword(s):

Estimation Method ◽

Eye Diagram

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Power distribution network design and optimization based on frequency dependent target impedance

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2015.7383675 ◽

2015 ◽

Cited By ~ 5

Author(s):

Youngwoo Kim ◽

Kiyeong Kim ◽

Jonghyun Cho ◽

Joungho Kim ◽

Kibum Kang ◽

...

Keyword(s):

Network Design ◽

Power Distribution ◽

Distribution Network ◽

Power Distribution Network ◽

Frequency Dependent ◽

Design And Optimization ◽

Distribution Network Design

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2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Improved algorithm for delay extraction using Hilbert transform

Virtual metrology for TSV etch depth measurement using optical emission spectroscopy

Design of active connector for high speed serial link interconnection

Design optimization of high bandwidth memory (HBM) interposer considering signal integrity

Characterization and simulation for 2.5-D interposer

Power and ground co-reference design for 16-32Gbps transceiver packages

Electrical approach to acoustic noise for MLCCs of power delivery network in mobile system

Surface current distribution for PCB PDNGeometry

A fast statistical eye-diagram estimation method including internal PDN noise of pseudo-differential receiver buffer

Power distribution network design and optimization based on frequency dependent target impedance

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Latest Publications