Estimation of Wirebonded Package Inductance and Resistance using Statistical DOE/RSM

2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ◽

10.1109/edaps47854.2019.9011650 ◽

2019 ◽

Author(s):

Kamna Ashu ◽

Jimmy Johansson ◽

Raj Pugo

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