2019 Electrical Design of Advanced Packaging and Systems (EDAPS)
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47
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H-INDEX

1
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Published By IEEE

9781728124322
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Simulation of Reflection Noise in Small Single-end Serpentine Delay Line in A Practical Server PCB

2019 ◽  
Author(s):  
Wei-Min Che ◽  
Chien-Yuan Huang ◽  
Shih-Chieh Lin ◽  
Ping-yueh Lai ◽  
Chih-Hsin Lu ◽  
...  
Keyword(s):  
Delay Line

Sparsity Constrained Regression For High-Speed Signal Integrity Modeling

2019 ◽  
Author(s):  
Jiacheng Zhuo ◽  
Jiayi He ◽  
Zurab Kiguradze ◽  
Bhyrav Mutnury ◽  
James Drewniak
Keyword(s):  
High Speed ◽  
Signal Integrity ◽  
Constrained Regression

Noise Coupling Analysis Method for an Electronic Safety and Arming Device (ESAD)

2019 ◽  
Author(s):  
Hyungmin Kang ◽  
Subin Kim ◽  
Daehwan Lho ◽  
Hyunwook Park ◽  
Boogyo Sim ◽  
...  
Keyword(s):  
Analysis Method ◽  
Coupling Analysis ◽  
Noise Coupling

Dielectric Characterization of Printed Circuit Board by Microstrip Line Up to 110 GHz

2019 ◽  
Author(s):  
Chien-Chang Huang ◽  
Chang-Lin Peng ◽  
Po-Yen Lin ◽  
Bing-Han Yang ◽  
Kuan-Chien Cheng ◽  
...  
Keyword(s):  
Microstrip Line ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dielectric Characterization ◽  
Printed Circuit

Design and Characteristic Calibration of TEM Cell for IC Radiation EMC Test

2019 ◽  
Author(s):  
Tzu-Hao Ho ◽  
Han-Nien Lin ◽  
Po-Ning Ko ◽  
Yu-Chun Huang ◽  
Huei-Chun Hsiao ◽  
...  
Keyword(s):  
Tem Cell

Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity

2019 ◽  
Author(s):  
Gaurav Kumar ◽  
Gapyeol Park ◽  
Hyunwook Park ◽  
Daehwan Lho ◽  
Junyong Park ◽  
...  
Keyword(s):  
Signal Integrity ◽  
High Definition ◽  
Multimedia Interface
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