Coupled Thermal-Moisture-Stress Analysis for Electronic Packages

2006 ◽  
Author(s):  
David Cadge ◽  
Jason Wang H.J. ◽  
Junlong Bie ◽  
Xuewei Sun ◽  
Rui Bai ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Moisture Stress ◽  
Electronic Packages

Crop Moisture Stress Analysis Using Computer-Controlled Environmental Chambers and Simulated Weather Sequences

1984 ◽  
Vol 27 (6) ◽  
pp. 1862-1870 ◽  
Author(s):  
George E. Meyer ◽  
James A. Lamb ◽  
William E. Splinter
Keyword(s):  
Stress Analysis ◽  
Moisture Stress ◽  
Computer Controlled ◽  
Environmental Chambers

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints

1996 ◽  
Vol 118 (2) ◽  
pp. 72-79 ◽  
Author(s):  
S. Ling ◽  
A. Dasgupta
Keyword(s):  
Solder Joint ◽  
Stress Analysis ◽  
Thermal Loading ◽  
Stress And Strain ◽  
Electronic Packages ◽  
Strain Fields ◽  
Surface Mount ◽  
Elastic Plastic ◽  
Solder Joint Fatigue ◽  
Fatigue Endurance

Solder joint fatigue failures are a potential reliability hazard in surface-mount electronic packages under cyclic thermal loading environment. Proper design and reliability assessment are thus crucial to ensure the fatigue endurance of the electronic packages. Accurate modeling of the stress and strain fields within the solder joint under cyclic thermal loading condition is of extreme importance since ultimately, a reasonable fatigue life estimation depends not only on a appropriate fatigue model, but more fundamentally, on accurately predicted stress and strain fields. Modeling stress and strain fields in solder joint in surface-mount electronic packages have never been an easy task since solder undergoes elastic, plastic and time dependent creep during each loading and unloading cycle. Some of the existing closed-form stress analysis models tend to oversimplify this complicated viscoplastic stress state, thus failing to give a reasonable prediction of the solder joint fatigue endurance. Extensive finite element analyses require prohibitive investment in terms of the analysis time and analyst expertise, especially when full scale elastic, plastic and creep analyses are performed. A generalized multi-domain approach proposed earlier by the authors is further developed in this paper to obtain the stress and strain fields in J-leaded surface-mount solder joint undergoing elastic-plastic deformation, under cyclic thermal environment (Ling et al., 1995). The Rayleigh-Ritz energy method based on a multi-field displacement assumption is used. In a previous paper (Ling et al., 1995), the results for analysis within elastic region had been demonstrated and were proved to be in agreement with finite element analysis. In this paper we further develop the methodology into plastic deformation region. Hysteresis loops for both the global and the local CTE mismatch problem can finally be generated. Results for two-dimensional elastic-plastic analysis are presented in the current paper. Creep deformation can be further modeled with this scheme by using time-stepping incremental techniques, and will be presented in a future paper. The final goal of this research is to predict the stress, strain and energy density distributions in the solder joint with reasonable accuracy. The fatigue assessment of the solder joint can then be performed by combining results from this stress analysis model with an appropriate damage model, for example, the energy-partitioning fatigue model (Dasgupta et al., 1992).

FORCE DISTRIBUTIONS AND STRESS ANALYSIS OF THE INTOR-CH SUPERCONDUCTING COIL

1984 ◽  
Vol 45 (C1) ◽  
pp. C1-901-C1-904 ◽  
Author(s):  
C. Marinucci ◽  
L. Palladino ◽  
G. Pasotti ◽  
M. V. Ricci ◽  
G. Vécsey
Keyword(s):  
Stress Analysis ◽  
Superconducting Coil

Stress analysis of symmetric laminates with rectangular or square holes subjected to inplane loading

2017 ◽  
Vol 105 (3) ◽  
pp. 301
Author(s):  
Toni Jabbour ◽  
Mohamad Abdel Wahab
Keyword(s):  
Stress Analysis

Scale transition models and X-ray stress analysis

2003 ◽  
Vol 100 (12) ◽  
pp. 1137-1149
Author(s):  
M. François
Keyword(s):  
Stress Analysis ◽  
X Ray ◽  
Scale Transition ◽  
Transition Models

Quantifying the value proposition for white clover persistence on a New Zealand summer-dry hill-country farm

2020 ◽  
Vol 82 ◽  
pp. 199-209
Author(s):  
Mike B. Dodd ◽  
Katherine N. Tozer ◽  
Iris Vogeler ◽  
Rose Greenfield ◽  
David R. Stevens ◽  
...  
Keyword(s):  
White Clover ◽  
Net Present Value ◽  
Moisture Stress ◽  
Simulation Modelling ◽  
Low Fertility ◽  
System Modelling ◽  
Value Proposition ◽  
Hill Country ◽  
The North ◽  
Farm System

The improvement in forage quality and quantity of summer-dry hill country pasture resulting from the introduction of clover is well recognised. However, ensuring the persistence of the commonly availablecultivars is challenging, in the face of seasonal moisture stress, intensive grazing, competition from established well-adapted pasture species, low soil fertility and low soil pH – conditions typical of the East Coast of the North Island. Here we quantify the value proposition associated with the introduction of white clover into a case study on a Gisborne sheep and beef farm, using a six-step process. A topographically explicit approach is taken, using an understanding of the underlying spatial variability, based on a combination of soil and pasture measurements, APSIM simulation modelling of pasture growth and farm system modelling of enterprise performance. We show that from a baseline of a typical low-fertility, diverse species hill country pasture, white clover introduction can increase spring and summer forage consumption by 17%, enabling inclusion of an additional 6-month bull finishing enterprise generating a 32% greater carcass weight production and leading to a 49% improvement in farm system EBIT. This represents a positive net present value of over $360,000 for the original investment in white clover establishment into existing pastures.

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