2006 International Conference on Electronic Materials and Packaging
Latest Publications

TOTAL DOCUMENTS

143

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424408337

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Interfacial Reaction of Lead-Free Solders with Lead-Free Finished Leadframes

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430624 ◽

2006 ◽

Author(s):

Y. W. Wong ◽

C. M. L. Wu ◽

H. C. B. Woo ◽

Y. T. Choi ◽

K. L. Li

Keyword(s):

Interfacial Reaction ◽

Lead Free ◽

Lead Free Solders

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System-In-Package Approach for Ultra-High-Power Semiconductor Devices

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430564 ◽

2006 ◽

Author(s):

Jeffrey Chen

Keyword(s):

High Power ◽

Semiconductor Devices ◽

Power Semiconductor ◽

Power Semiconductor Devices

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Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430583 ◽

2006 ◽

Cited By ~ 2

Author(s):

Shan Gao ◽

Jupyo Hong ◽

Taehoon Kim ◽

Seogmoon Choi ◽

Sung Yi

Keyword(s):

Acoustic Wave ◽

Surface Acoustic Wave ◽

Wafer Level ◽

Wafer Level Package

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Effect of High Temperature Storage on Reliability of Sn-Ag-Cu Flip Chip Solder Bumps

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430604 ◽

2006 ◽

Author(s):

Xingjia Huang ◽

S.W. Ricky Lee ◽

Ming Li ◽

William T. Chen

Keyword(s):

High Temperature ◽

Flip Chip ◽

Solder Bumps ◽

High Temperature Storage ◽

Temperature Storage

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Coupled Thermal-Moisture-Stress Analysis for Electronic Packages

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430636 ◽

2006 ◽

Cited By ~ 1

Author(s):

David Cadge ◽

Jason Wang H.J. ◽

Junlong Bie ◽

Xuewei Sun ◽

Rui Bai ◽

...

Keyword(s):

Stress Analysis ◽

Moisture Stress ◽

Electronic Packages

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Study of System Dynamics of High-Power LEDs

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430673 ◽

2006 ◽

Cited By ~ 1

Author(s):

Bin-Juine Huang ◽

Chun-Wen Tang ◽

Jia-Hong Wu

Keyword(s):

System Dynamics ◽

High Power

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Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430642 ◽

2006 ◽

Author(s):

Mingyu Li ◽

Hongjun Ji ◽

Chunqing Wang

Keyword(s):

Interface Reaction ◽

Bond Interface ◽

Wedge Bonding

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New 3D Stacked Technology System for PoP/SiP & Electric Components

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430680 ◽

2006 ◽

Author(s):

Yukihiro Hirai

Keyword(s):

Technology System

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Mechanical Behaviour of Grains in SnAgCu Solder Joints

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430595 ◽

2006 ◽

Author(s):

Jicheng Gong ◽

Changqing Liu ◽

Paul P. Conway ◽

Vadim V. Silberschmidt

Keyword(s):

Mechanical Behaviour ◽

Solder Joints ◽

Snagcu Solder

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Study of Interfacial Reactions by Ni/Sn5Ag/Cu Sandwich Structure

2006 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2006.4430691 ◽

2006 ◽

Author(s):

H. W. Tseng ◽

C. Y. Liu

Keyword(s):

Sandwich Structure ◽

Interfacial Reactions

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2006 International Conference on Electronic Materials and PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Interfacial Reaction of Lead-Free Solders with Lead-Free Finished Leadframes

System-In-Package Approach for Ultra-High-Power Semiconductor Devices

Study of a Wafer Level Package (WLP) for Surface Acoustic Wave (SAW) Filter

Effect of High Temperature Storage on Reliability of Sn-Ag-Cu Flip Chip Solder Bumps

Coupled Thermal-Moisture-Stress Analysis for Electronic Packages

Study of System Dynamics of High-Power LEDs

Comparison of Bond Interface Reaction in Al-Ni and Al-Au Systems Formed by Ultrasonic Wedge Bonding

New 3D Stacked Technology System for PoP/SiP & Electric Components

Mechanical Behaviour of Grains in SnAgCu Solder Joints

Study of Interfacial Reactions by Ni/Sn5Ag/Cu Sandwich Structure

2006 International Conference on Electronic Materials and Packaging
Latest Publications