Characterization of interfacial intermetallic compounds in gold wire bonding with copper pad

2018 ◽  
Author(s):  
Wang Bisheng ◽  
Liao Jinzhi Lois ◽  
Li Xiaomin
Keyword(s):  
Intermetallic Compounds ◽  
Gold Wire ◽  
Wire Bonding ◽  
Interfacial Intermetallic Compounds

Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads

2014 ◽  
Vol 64 ◽  
pp. 356-366 ◽  
Author(s):  
Hyung Giun Kim ◽  
Sang Min Kim ◽  
Jae Young Lee ◽  
Mi Ri Choi ◽  
Si Hyun Choe ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Wire Bonding ◽  
Microstructural Evaluation ◽  
Interfacial Intermetallic Compounds

A comparison of copper and gold wire bonding on integrated circuit devices

2002 ◽  
Author(s):  
S.L. Khoury ◽  
D.J. Burkhard ◽  
D.P. Galloway ◽  
T.A. Scharr
Keyword(s):  
Integrated Circuit ◽  
Gold Wire ◽  
Wire Bonding

Reliability characterization of heavy wire bonding materials

2012 ◽  
Author(s):  
F. Naumann ◽  
J. Schischka ◽  
S. Koetter ◽  
E. Milke ◽  
M. Petzold
Keyword(s):  
Wire Bonding

Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

1999 ◽  
Vol 22 (1) ◽  
pp. 7-15 ◽  
Author(s):  
R.W. Johnson ◽  
M.J. Palmer ◽  
M.J. Bozack ◽  
T. Isaacs-Smith
Keyword(s):  
Gold Wire ◽  
Wire Bonding ◽  
Surface Finishes ◽  
Palladium Surface

Modeling and Experimental Study of a Wire Clamp for Wire Bonding

2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Fuliang Wang ◽  
Dengke Fan
Keyword(s):  
Experimental Study ◽  
Finite Element ◽  
Energy Conservation ◽  
Design Process ◽  
Gold Wire ◽  
Wire Bonding ◽  
Fe Model ◽  
Amplification Ratio ◽  
Model Studies ◽  
Thermosonic Wire Bonding

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.

Structural characterization of RNi2 (R ≡ La, Ce) intermetallic compounds and their hydrides

1987 ◽  
Vol 131 (1-2) ◽  
pp. 201-208 ◽  
Author(s):  
V Paul-Boncour ◽  
A Percheron-Guegan ◽  
M Diaf ◽  
J.C Achard
Keyword(s):  
Intermetallic Compounds ◽  
Structural Characterization

Effect of Post Weld Heat Treatment on Al 5052-SS 316 Explosive Cladding with Copper Interlayer

2018 ◽  
Vol 910 ◽  
pp. 35-40
Author(s):  
Eswaran Elango ◽  
Somasundaram Saravanan ◽  
Krishnamorthy Raghukandan
Keyword(s):  
Heat Treatment ◽  
Tensile Strength ◽  
Intermetallic Compounds ◽  
Microstructural Characterization ◽  
Optical Microscope ◽  
Post Weld Heat Treatment ◽  
Inclination Angles ◽  
Copper Interlayer ◽  
Weld Heat

This study focuses on effect of post weld heat treatment (PWHT) on interfacial and mechanical properties of Al 5052-SS 316 explosive clad with copper interlayer at varied loading ratios and inclination angles. The use of interlayer is proposed for the control of additional kinetic energy dissipation and to alleviate the formation of intermetallic compounds at the interface. The Al-Steel clads are subjected to PWHT at varied temperatures (300°C-450°C) for 30 minutes and the results are presented. The microstructural characterization of as-clad and PWHT samples is observed by an optical microscope and Scanning Electron Microscope (SEM). Maximum hardness is obtained at the interface of the as-clad and PWHT samples. Increase in PWHT temperature enhances the tensile strength of the composite, whereas, the tensile strength decreases at 300°C due to the diffusion of Al and Cu elements and the formation of detrimental intermetallic compounds.

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