Signal and power integrity analysis of TSV-Based 3D IC
2018 ◽
Vol 466
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pp. 012060
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2010 ◽
Vol 52
(2)
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pp. 357-364
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2014 ◽
Vol 4
(8)
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pp. 1317-1324
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2010 ◽
Vol 52
(4)
◽
pp. 1008-1018
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2018 ◽
Vol 11
(7)
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pp. 119-128
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