Accelerated reliability evaluation for high density packaging integrated circuits

2011 ◽  
Author(s):  
Bin Yao ◽  
Ping Lai
Keyword(s):  
Integrated Circuits ◽  
Reliability Evaluation ◽  
High Density ◽  
High Density Packaging

scholarly journals An Original Interconnection Technique for an Electronic Payment Card

1982 ◽  
Vol 10 (1) ◽  
pp. 23-29
Author(s):  
M. Monnier ◽  
M. Monneraye
Keyword(s):  
Integrated Circuits ◽  
High Density ◽  
Electronic Payment ◽  
Practical Application ◽  
Payment Card ◽  
High Density Packaging

This paper intends to illustrate, through a practical application, the possibilities of LEP foil flexible circuitry for mounting and interconnecting integrated circuits. This technique results in a high density packaging which is used here for the integration of two components, a microprocessor and a memory, in an electronic payment card.

scholarly journals A Brief Overview of On-Chip Voltage Regulation in High-Performance and High-Density Integrated Circuits

IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 813-826
Author(s):  
Farid Uddin Ahmed ◽  
Zarin Tasnim Sandhie ◽  
Liaquat Ali ◽  
Masud H. Chowdhury
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Voltage Regulation ◽  
High Density ◽  
On Chip

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

2005 ◽  
Vol 297-300 ◽  
pp. 837-843
Author(s):  
Takashi Hasegawa ◽  
Masumi Saka
Keyword(s):  
Current Density ◽  
Solder Bump ◽  
High Density ◽  
Solder Bumps ◽  
Multi Phase ◽  
High Density Packaging

Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.

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