scholarly journals Special Articles: The Micro Soldering Technology of Super High Density Packaging. Chip-size Packaging Technology.

1994 ◽  
Vol 9 (7) ◽  
pp. 475-478
Author(s):  
Sugio UCHIDA ◽  
Shinichi WAKABAYASHI
Keyword(s):  
High Density ◽  
Packaging Technology ◽  
Chip Size ◽  
Soldering Technology ◽  
High Density Packaging

High density packaging technology ultra thin package & new tab package

1989 ◽  
Vol 18 (5) ◽  
pp. 633-643 ◽  
Author(s):  
Osamu Nakagawa ◽  
Haruo Shimamoto ◽  
Tetsuya Ueda ◽  
Kou Shimomura ◽  
Tsutomu Hata ◽  
...  
Keyword(s):  
High Density ◽  
Packaging Technology ◽  
High Density Packaging

Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

2003 ◽  
Author(s):  
Kazuto Nishida ◽  
Kazumichi Shimizu ◽  
Michiro Yoshino ◽  
Hideo Koguchi ◽  
Nipon Taweejun
Keyword(s):  
Cross Section ◽  
Flip Chip ◽  
High Capacity ◽  
High Density ◽  
Thickness Direction ◽  
The Finite Element Method ◽  
Memory Card ◽  
Chip Technology ◽  
Chip Size ◽  
High Density Packaging

We have developed a high-density packaging technology by using a thin IC and a thin substrate and bonding it by new flip chip technology. Numerical analysis with the finite element method (FEM) as well experiments clearly showed that deflection of the IC and reliability were affected by the IC thickness. Consequently, reliability could be improved by reducing IC thickness. The dependency of the life in single-sided CSP and both-sided CSP on the thickness of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively. Moreover, a both-sided flip chip approach solved the problem of warpage. A high-capacity memory card of 512 MB was put to practical use by applying these results. This increased the Si density by four times over that of a conventional chip-size package (CSP).

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