A method for inspection of ball bonds in integrated circuits
A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits
1994 ◽
Vol 7
(4)
◽
pp. 413-422
◽
1983 ◽
Vol 41
◽
pp. 160-161
1983 ◽
Vol 41
◽
pp. 86-89
Keyword(s):
1972 ◽
Vol 30
◽
pp. 482-483
1991 ◽
Vol 49
◽
pp. 898-899
Keyword(s):
1976 ◽
Vol 34
◽
pp. 456-457
1992 ◽
Vol 50
(2)
◽
pp. 1684-1685
1986 ◽
Vol 44
◽
pp. 736-737
Keyword(s):