Optimizing feeder arrangement of a PCB assembly machine for multiple boards

2010 ◽  
Author(s):  
Y.Z. Wu ◽  
P. Ji
Keyword(s):  
Pcb Assembly ◽  
Feeder Arrangement

Optimizing the Performance of Chip Shooter Machine Based on Ant Colony Algorithm

2012 ◽  
Vol 224 ◽  
pp. 47-50
Author(s):  
Xuan Du ◽  
Gang Yu
Keyword(s):  
Optimization Problem ◽  
Ant Colony Algorithm ◽  
Printed Circuit Board ◽  
Ant Colony ◽  
Circuit Board ◽  
Component Placement ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Communication Function ◽  
Feeder Arrangement

The component placement sequence and feeder arrangement are two critical factors determining the assembly time of chip-shooter machine (CS). In addition, the different size of component and different arrangement strategy affect the feeder arrangement and component placement sequence. Based on the engineering analysis, an integrated optimization model of printed circuit board (PCB) assembly for CS machine is established. According to the parallel placement character of CS machine, "Max-Min Ant Colony Algorithm with Communication function (MMAC)" is designed based on traditional Ant Colony Algorithm. The idea that two ants with different duties collaborate to solve the optimization problem is presented. Guide ants optimize placement sequence while executant ants optimize feeder arrangement according to the components placement sequence. The component placement sequence and feeder arrangement are optimized simultaneously

A dynamic point specification approach to sequencing robot moves for PCB assembly

1995 ◽  
Vol 8 (6) ◽  
pp. 448-456 ◽  
Author(s):  
YI-CHEN SU ◽  
COLLIN WANG ◽  
PIUS J. EGBELU ◽  
DAVID J. CANNON
Keyword(s):  
Pcb Assembly

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals Multi-Level Planning and Scheduling for Parallel PCB Assembly Lines Using Hybrid Spider Monkey Optimization Approach

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 18685-18700 ◽  
Author(s):  
Jabir Mumtaz ◽  
Zailin Guan ◽  
Lei Yue ◽  
Zhengya Wang ◽  
Saif Ullah ◽  
...  
Keyword(s):  
Spider Monkey ◽  
Optimization Approach ◽  
Assembly Lines ◽  
Planning And Scheduling ◽  
Pcb Assembly ◽  
Multi Level ◽  
Spider Monkey Optimization

Genetic algorithm approach in PCB assembly

1999 ◽  
Vol 10 (5) ◽  
pp. 256-265 ◽  
Author(s):  
Nan‐Shing Ong ◽  
Li Pheng Khoo
Keyword(s):  
Genetic Algorithm ◽  
Pcb Assembly ◽  
Genetic Algorithm Approach

Knowledge based decision support for PCB assembly using SMT

1992 ◽  
Vol 23 (1-4) ◽  
pp. 405-408 ◽  
Author(s):  
K. Srihari ◽  
Martin Cala
Keyword(s):  
Decision Support ◽  
Pcb Assembly ◽  
Knowledge Based
Sign in / Sign up

Export Citation Format

Share Document