ABSTRACTWe have realized direct-tunneling gate oxide (1.6nm) NMOS and PMOS transistors by means of through-the-gate-implantation in a comer parasitics-free shallow-trench-isolation CMOS technology. In order to take full advantage of in-situ cluster-tool processing and to preserve initial wafer-surface quality, the essential part of the MOS gate is fabricated prior to device isolation and through-the-gate-implantation is utilized for well- and channel doping. In addition, a fully-reinforced-gate-oxide-perimeter is provided and trench comer parasitics are eliminated by the advanced process architecture EXTIGATE without increasing process complexity.