Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated. Two differential compensation structures for various lengths of interconnects are designed and experimentally evaluated using dedicated transmit and receive radar modules operating across a 110–156 GHz band. Measurement results demonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential interconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended chip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than 1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.
Optical transmission between III-V chips on Si using photonic wire bonding